SG11201700690VA - Optoelectronic modules having a silicon substrate, and fabrication methods for such modules - Google Patents
Optoelectronic modules having a silicon substrate, and fabrication methods for such modulesInfo
- Publication number
- SG11201700690VA SG11201700690VA SG11201700690VA SG11201700690VA SG11201700690VA SG 11201700690V A SG11201700690V A SG 11201700690VA SG 11201700690V A SG11201700690V A SG 11201700690VA SG 11201700690V A SG11201700690V A SG 11201700690VA SG 11201700690V A SG11201700690V A SG 11201700690VA
- Authority
- SG
- Singapore
- Prior art keywords
- modules
- silicon substrate
- fabrication methods
- optoelectronic
- optoelectronic modules
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000005693 optoelectronics Effects 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Lens Barrels (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462039028P | 2014-08-19 | 2014-08-19 | |
| US201462056897P | 2014-09-29 | 2014-09-29 | |
| PCT/SG2015/050264 WO2016028227A1 (en) | 2014-08-19 | 2015-08-18 | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201700690VA true SG11201700690VA (en) | 2017-03-30 |
Family
ID=55348956
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201710235VA SG10201710235VA (en) | 2014-08-19 | 2015-08-18 | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
| SG11201700690VA SG11201700690VA (en) | 2014-08-19 | 2015-08-18 | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201710235VA SG10201710235VA (en) | 2014-08-19 | 2015-08-18 | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US9711552B2 (en) |
| EP (1) | EP3183745B1 (en) |
| JP (2) | JP2017531310A (en) |
| KR (1) | KR102434816B1 (en) |
| CN (1) | CN106796916B (en) |
| SG (2) | SG10201710235VA (en) |
| TW (1) | TWI702717B (en) |
| WO (1) | WO2016028227A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016052599A1 (en) * | 2014-09-30 | 2017-07-27 | 積水化学工業株式会社 | Thermally conductive foam sheet for electronic equipment |
| US20160307881A1 (en) * | 2015-04-20 | 2016-10-20 | Advanced Semiconductor Engineering, Inc. | Optical sensor module and method for manufacturing the same |
| EP3104190B1 (en) * | 2015-06-08 | 2024-04-17 | ams AG | Optical sensor arrangement |
| WO2017164819A1 (en) * | 2016-03-23 | 2017-09-28 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic module assembly and manufacturing method |
| US10204947B2 (en) * | 2016-09-09 | 2019-02-12 | Omnivision Technologies, Inc. | Cover-glass-free array camera with individually light-shielded cameras |
| DE102016118990A1 (en) * | 2016-10-06 | 2018-04-12 | Osram Opto Semiconductors Gmbh | SENSOR |
| DE102016118996A1 (en) * | 2016-10-06 | 2018-04-12 | Osram Opto Semiconductors Gmbh | MANUFACTURE OF SENSORS |
| EP4224526A1 (en) | 2016-11-24 | 2023-08-09 | Lg Innotek Co., Ltd. | Semiconductor device and display device comprising same |
| CN112513691A (en) * | 2018-07-30 | 2021-03-16 | ams传感器新加坡私人有限公司 | Low height optoelectronic module and package |
| US10707195B2 (en) | 2018-10-09 | 2020-07-07 | Waymo Llc | Multichannel monostatic rangefinder |
| US20220190186A1 (en) * | 2019-03-28 | 2022-06-16 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic module |
| US11635786B2 (en) * | 2020-06-11 | 2023-04-25 | Apple Inc. | Electronic optical sensing device |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3619773B2 (en) * | 2000-12-20 | 2005-02-16 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
| JP4750983B2 (en) * | 2001-09-21 | 2011-08-17 | シチズン電子株式会社 | Bi-directional optical transmission device |
| JP2004006753A (en) * | 2002-04-05 | 2004-01-08 | Canon Inc | Package for optical semiconductor |
| JP2006245118A (en) * | 2005-03-01 | 2006-09-14 | Konica Minolta Opto Inc | Imaging device and its manufacturing method |
| US7692256B2 (en) | 2007-03-23 | 2010-04-06 | Heptagon Oy | Method of producing a wafer scale package |
| JP2008283002A (en) * | 2007-05-10 | 2008-11-20 | Sharp Corp | Imaging element module and its manufacturing method |
| TW200937642A (en) * | 2007-12-19 | 2009-09-01 | Heptagon Oy | Wafer stack, integrated optical device and method for fabricating the same |
| JP5554957B2 (en) * | 2009-10-09 | 2014-07-23 | オリンパス株式会社 | Imaging unit |
| JP5356980B2 (en) * | 2009-11-06 | 2013-12-04 | シャープ株式会社 | Electronic element module and manufacturing method thereof, electronic element wafer module and manufacturing method thereof, and electronic information device |
| JP2011180293A (en) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | Lens array |
| TWI547730B (en) * | 2010-08-17 | 2016-09-01 | 新加坡恒立私人有限公司 | Method of manufacturing a plurality of optical devices for cameras, assembly comprising a plurality of optical devices, and assembly comprising a plurality of cameras containing optical devices |
| KR101262470B1 (en) | 2011-01-31 | 2013-05-08 | 엘지이노텍 주식회사 | Lens assembly and camera module |
| CN103975436B (en) * | 2011-07-19 | 2019-05-10 | 新加坡恒立私人有限公司 | The method for manufacturing passive optical device and the device comprising the passive optical device |
| WO2013010284A2 (en) | 2011-07-19 | 2013-01-24 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same |
| CN103858230B (en) * | 2011-08-10 | 2018-03-27 | 新加坡恒立私人有限公司 | Optoelectronic module and the method for manufacturing the optoelectronic module |
| TW201310102A (en) | 2011-08-17 | 2013-03-01 | Pixart Imaging Inc | Lens module and manufacture method thereof |
| WO2013026175A1 (en) * | 2011-08-25 | 2013-02-28 | Heptagon Micro Optics Pte. Ltd. | Wafer-level fabrication of optical devices with front focal length correction |
| JP6338533B2 (en) * | 2011-12-22 | 2018-06-06 | ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． | Optoelectronic module, in particular flash module and method of manufacturing the same |
| US9063005B2 (en) * | 2012-04-05 | 2015-06-23 | Heptagon Micro Optics Pte. Ltd. | Reflowable opto-electronic module |
| US9570648B2 (en) * | 2012-06-15 | 2017-02-14 | Intersil Americas LLC | Wafer level optical proximity sensors and systems including wafer level optical proximity sensors |
| NL2009740C2 (en) | 2012-11-01 | 2014-05-06 | Ihc Holland Ie Bv | Device for and method of transferring personnel, equipment and/or structural elements from a surface vessel to an offshore structure. |
| US9595553B2 (en) * | 2012-11-02 | 2017-03-14 | Heptagon Micro Optics Pte. Ltd. | Optical modules including focal length adjustment and fabrication of the optical modules |
| US9094593B2 (en) | 2013-07-30 | 2015-07-28 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
| US9123735B2 (en) * | 2013-07-31 | 2015-09-01 | Infineon Technologies Austria Ag | Semiconductor device with combined passive device on chip back side |
| TWI667767B (en) * | 2014-03-31 | 2019-08-01 | 菱生精密工業股份有限公司 | Package structure of integrated optical module |
-
2015
- 2015-08-11 US US14/823,174 patent/US9711552B2/en active Active
- 2015-08-18 KR KR1020177007206A patent/KR102434816B1/en active IP Right Grant
- 2015-08-18 EP EP15833195.9A patent/EP3183745B1/en active Active
- 2015-08-18 JP JP2017509730A patent/JP2017531310A/en active Pending
- 2015-08-18 SG SG10201710235VA patent/SG10201710235VA/en unknown
- 2015-08-18 WO PCT/SG2015/050264 patent/WO2016028227A1/en active Application Filing
- 2015-08-18 CN CN201580048491.XA patent/CN106796916B/en active Active
- 2015-08-18 SG SG11201700690VA patent/SG11201700690VA/en unknown
- 2015-08-18 TW TW104126868A patent/TWI702717B/en active
-
2017
- 2017-06-14 US US15/622,813 patent/US10283542B2/en active Active
-
2019
- 2019-03-19 US US16/357,627 patent/US10680023B2/en active Active
- 2019-11-28 JP JP2019215475A patent/JP2020038998A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20170287963A1 (en) | 2017-10-05 |
| SG10201710235VA (en) | 2018-01-30 |
| CN106796916B (en) | 2019-11-08 |
| US9711552B2 (en) | 2017-07-18 |
| US10680023B2 (en) | 2020-06-09 |
| JP2017531310A (en) | 2017-10-19 |
| TWI702717B (en) | 2020-08-21 |
| WO2016028227A1 (en) | 2016-02-25 |
| EP3183745A4 (en) | 2018-08-15 |
| EP3183745A1 (en) | 2017-06-28 |
| TW201620124A (en) | 2016-06-01 |
| KR102434816B1 (en) | 2022-08-19 |
| US20160056194A1 (en) | 2016-02-25 |
| CN106796916A (en) | 2017-05-31 |
| KR20170045259A (en) | 2017-04-26 |
| EP3183745B1 (en) | 2019-11-13 |
| US20190326340A1 (en) | 2019-10-24 |
| JP2020038998A (en) | 2020-03-12 |
| US10283542B2 (en) | 2019-05-07 |
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