HUE047589T2 - Eljárás hordozóadapter elõállítására, hordozóadapter és eljárás félvezetõ elem csatlakoztatására - Google Patents

Eljárás hordozóadapter elõállítására, hordozóadapter és eljárás félvezetõ elem csatlakoztatására

Info

Publication number
HUE047589T2
HUE047589T2 HUE15195788A HUE15195788A HUE047589T2 HU E047589 T2 HUE047589 T2 HU E047589T2 HU E15195788 A HUE15195788 A HU E15195788A HU E15195788 A HUE15195788 A HU E15195788A HU E047589 T2 HUE047589 T2 HU E047589T2
Authority
HU
Hungary
Prior art keywords
substrate adapter
contacting
producing
semiconductor element
adapter
Prior art date
Application number
HUE15195788A
Other languages
English (en)
Inventor
Martin Bleifuss
Andreas Hinrich
Andreas Klein
Michael Schäfer
Elisa Krill
Christian Bachmann
Holger Ulrich
Frank Osterwald
David Benning
Jacek Rudzki
Lars Paulsen
Frank Schefuss
Martin Becker
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of HUE047589T2 publication Critical patent/HUE047589T2/hu

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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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    • H01L23/142—Metallic substrates having insulating layers
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HUE15195788A 2014-11-25 2015-11-23 Eljárás hordozóadapter elõállítására, hordozóadapter és eljárás félvezetõ elem csatlakoztatására HUE047589T2 (hu)

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DE102014117246.9A DE102014117246B4 (de) 2014-11-25 2014-11-25 Verfahren zum Herstellen eines Substratadapters, Substratadapter und Verfahren zum Kontaktieren eines Halbleiterelements

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DE102011115887A1 (de) * 2011-10-15 2013-04-18 Danfoss Silicon Power Gmbh Leistungshalbleiterchip mit oberseitigen Potentialflächen
DE202016101688U1 (de) 2016-03-30 2016-04-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Schaltungsträger
SG11201811368SA (en) 2016-05-26 2019-01-30 Amino Up Chemical Co Ltd Sleep improving agent
DE102019111437B4 (de) * 2019-05-03 2023-09-28 Heraeus Deutschland GmbH & Co. KG Verfahren zur Herstellung eines elektronischen Zwischenprodukts und Verfahren zur Herstellung eines Elektronik-Bauteils
DE102019112477B4 (de) 2019-05-13 2024-03-14 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleiterbauelement mit einer Kontakteinrichtung
DE102021116053A1 (de) 2021-06-22 2022-12-22 Danfoss Silicon Power Gmbh Elektrischer Leiter, elektronische Baugruppe mit elektrischem Leiter und Verfahren zum Herstellen einer elektronischen Baugruppe mit einem elektrischen Leiter
CN118786521A (zh) * 2022-03-15 2024-10-15 阿尔法装配解决方案公司 烧结就绪多层线/带键合焊盘和用于管芯顶部附接的方法

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JP4260263B2 (ja) * 1999-01-28 2009-04-30 株式会社ルネサステクノロジ 半導体装置
KR20000057810A (ko) * 1999-01-28 2000-09-25 가나이 쓰토무 반도체 장치
JP3721859B2 (ja) * 1999-06-08 2005-11-30 株式会社日立製作所 半導体パッケージ
JP4075199B2 (ja) * 1999-03-29 2008-04-16 三菱電機株式会社 パワー半導体モジュール
DE102005047566C5 (de) * 2005-10-05 2011-06-09 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu
JP2009016380A (ja) * 2007-06-29 2009-01-22 Toshiba Corp 半導体装置及びその製造方法
US7858440B2 (en) * 2007-09-21 2010-12-28 Infineon Technologies Ag Stacked semiconductor chips
US20120326287A1 (en) * 2011-06-27 2012-12-27 National Semiconductor Corporation Dc/dc convertor power module package incorporating a stacked controller and construction methodology
CN102324415B (zh) * 2011-09-13 2013-03-06 江苏长电科技股份有限公司 无基岛预填塑封料先刻后镀引线框结构及其生产方法
JPWO2013069232A1 (ja) * 2011-11-07 2015-04-02 パナソニックＩｐマネジメント株式会社 配線板とそれを用いた発光装置及びそれらの製造方法
DE102014117245B4 (de) * 2014-11-25 2018-03-22 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen eines Halbleiterelements mit Substratadapter und damit hergestelltes Halbleiterelement mit Substratadapter und Verfahren zum Kontaktieren dieses Halbleiterelements
US10559538B2 (en) * 2015-02-25 2020-02-11 Mitsubishi Electric Corporation Power module

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KR20160062709A (ko) 2016-06-02
DE102014117246A1 (de) 2016-05-25
EP3026703A1 (de) 2016-06-01
EP3026703B1 (de) 2019-11-20
DE102014117246B4 (de) 2018-11-15
JP6251715B2 (ja) 2017-12-20
JP2016105477A (ja) 2016-06-09
CN105632949A (zh) 2016-06-01
KR102047899B1 (ko) 2019-11-22
CN105632949B (zh) 2019-04-30

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