SG10201706631XA - Method for measuring the thickness of flat workpieces - Google Patents

Method for measuring the thickness of flat workpieces

Info

Publication number
SG10201706631XA
SG10201706631XA SG10201706631XA SG10201706631XA SG10201706631XA SG 10201706631X A SG10201706631X A SG 10201706631XA SG 10201706631X A SG10201706631X A SG 10201706631XA SG 10201706631X A SG10201706631X A SG 10201706631XA SG 10201706631X A SG10201706631X A SG 10201706631XA
Authority
SG
Singapore
Prior art keywords
measuring
thickness
flat workpieces
workpieces
flat
Prior art date
Application number
SG10201706631XA
Other languages
English (en)
Inventor
Dr Jörn Kanzow
Sascha Werth
Original Assignee
Lapmaster Wolters Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lapmaster Wolters Gmbh filed Critical Lapmaster Wolters Gmbh
Publication of SG10201706631XA publication Critical patent/SG10201706631XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B24B49/045—Specially adapted gauging instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
SG10201706631XA 2016-08-29 2017-08-14 Method for measuring the thickness of flat workpieces SG10201706631XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102016116012.1A DE102016116012A1 (de) 2016-08-29 2016-08-29 Verfahren zum Messen der Dicke von flachen Werkstücken

Publications (1)

Publication Number Publication Date
SG10201706631XA true SG10201706631XA (en) 2018-03-28

Family

ID=59631665

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201706631XA SG10201706631XA (en) 2016-08-29 2017-08-14 Method for measuring the thickness of flat workpieces
SG10202101748RA SG10202101748RA (en) 2016-08-29 2017-08-14 Method for measuring the thickness of flat workpieces

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10202101748RA SG10202101748RA (en) 2016-08-29 2017-08-14 Method for measuring the thickness of flat workpieces

Country Status (8)

Country Link
US (1) US20180056478A1 (de)
EP (1) EP3290155B1 (de)
JP (1) JP6966253B2 (de)
KR (1) KR102494957B1 (de)
CN (1) CN107791145B (de)
DE (1) DE102016116012A1 (de)
SG (2) SG10201706631XA (de)
TW (1) TWI808941B (de)

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* Cited by examiner, † Cited by third party
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KR101660900B1 (ko) * 2015-01-16 2016-10-10 주식회사 엘지실트론 웨이퍼 연마 장치 및 이를 이용한 웨이퍼 연마 방법
JP7046358B2 (ja) * 2018-04-17 2022-04-04 スピードファム株式会社 研磨装置
EP3597362B1 (de) * 2018-07-16 2023-04-19 Officina Meccanica Domaso SpA Federendenschleifmaschine
TWI649534B (zh) * 2018-08-08 2019-02-01 友達晶材股份有限公司 Thickness measuring device, calibration method thereof and calibration fixture
CN109352431B (zh) * 2018-09-17 2020-04-21 上海理工大学 超声振动磨削去除量在位检测装置
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7218830B1 (ja) 2022-04-14 2023-02-07 信越半導体株式会社 両面研磨装置及び両面研磨方法
CN114714151B (zh) * 2022-06-09 2022-09-16 成都飞机工业（集团）有限责任公司 一种腹板的测量点位规划方法、装置、设备及存储介质
JP7296161B1 (ja) * 2022-06-27 2023-06-22 不二越機械工業株式会社 両面研磨装置

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JP2002170800A (ja) * 2000-12-01 2002-06-14 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
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DE102007056627B4 (de) * 2007-03-19 2023-12-21 Lapmaster Wolters Gmbh Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben
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JP6146213B2 (ja) * 2013-08-30 2017-06-14 株式会社Sumco ワークの両面研磨装置及び両面研磨方法
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置
KR101660900B1 (ko) * 2015-01-16 2016-10-10 주식회사 엘지실트론 웨이퍼 연마 장치 및 이를 이용한 웨이퍼 연마 방법

Also Published As

Publication number Publication date
SG10202101748RA (en) 2021-03-30
KR20180025233A (ko) 2018-03-08
JP2018034298A (ja) 2018-03-08
JP6966253B2 (ja) 2021-11-10
DE102016116012A1 (de) 2018-03-01
KR102494957B1 (ko) 2023-02-02
US20180056478A1 (en) 2018-03-01
CN107791145B (zh) 2021-07-09
EP3290155B1 (de) 2020-11-04
CN107791145A (zh) 2018-03-13
TWI808941B (zh) 2023-07-21
EP3290155A1 (de) 2018-03-07
TW201809593A (zh) 2018-03-16

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