SG10201605074WA - Droplet discharge device and method - Google Patents

Droplet discharge device and method

Info

Publication number
SG10201605074WA
SG10201605074WA SG10201605074WA SG10201605074WA SG10201605074WA SG 10201605074W A SG10201605074W A SG 10201605074WA SG 10201605074W A SG10201605074W A SG 10201605074WA SG 10201605074W A SG10201605074W A SG 10201605074WA SG 10201605074W A SG10201605074W A SG 10201605074WA
Authority
SG
Singapore
Prior art keywords
discharge device
droplet discharge
droplet
discharge
Prior art date
Application number
SG10201605074WA
Other languages
English (en)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of SG10201605074WA publication Critical patent/SG10201605074WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D83/00—Containers or packages with special means for dispensing contents
    • B65D83/0005—Containers or packages provided with a piston or with a movable bottom or partition having approximately the same section as the container
    • B65D83/0022—Containers or packages provided with a piston or with a movable bottom or partition having approximately the same section as the container moved by a reciprocable plunger
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/05—Heads having a valve
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
SG10201605074WA 2011-07-11 2012-07-10 Droplet discharge device and method SG10201605074WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011152594A JP5806868B2 (ja) 2011-07-11 2011-07-11 液滴吐出装置および方法

Publications (1)

Publication Number Publication Date
SG10201605074WA true SG10201605074WA (en) 2016-08-30

Family

ID=47506082

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201605074WA SG10201605074WA (en) 2011-07-11 2012-07-10 Droplet discharge device and method

Country Status (13)

Country Link
US (1) US9440781B2 (zh)
EP (1) EP2732883B1 (zh)
JP (1) JP5806868B2 (zh)
KR (1) KR101801224B1 (zh)
CN (2) CN103747885B (zh)
ES (1) ES2735286T3 (zh)
HK (1) HK1193377A1 (zh)
HU (1) HUE044123T2 (zh)
MY (1) MY166475A (zh)
PL (1) PL2732883T3 (zh)
SG (1) SG10201605074WA (zh)
TW (3) TWI537057B (zh)
WO (1) WO2013008799A1 (zh)

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WO2015080081A1 (ja) * 2013-11-29 2015-06-04 リソテックジャパン株式会社 薬液供給機構及び小型製造装置
KR20160122198A (ko) * 2014-02-14 2016-10-21 노드슨 코포레이션 분사 디스펜서, 및 유체 물질의 액적을 분사하기 위한 방법
WO2015137271A1 (ja) * 2014-03-10 2015-09-17 武蔵エンジニアリング株式会社 塗布装置および塗布方法
US9757900B2 (en) * 2015-05-20 2017-09-12 Xerox Corporation Pin-actuated printhead
US10286415B2 (en) * 2015-07-10 2019-05-14 Ginolis Oy Dispensing device and method
JP2017103103A (ja) * 2015-12-02 2017-06-08 矢崎総業株式会社 電線付き端子の製造方法
US10442174B2 (en) * 2015-12-08 2019-10-15 Xerox Corporation Material feeder for engineering polymer ejection system for additive manufacturing applications
MY202316A (en) * 2016-01-16 2024-04-23 Musashi Eng Inc Liquid material ejection device
JP6646809B2 (ja) * 2016-01-18 2020-02-14 パナソニックＩｐマネジメント株式会社 液体吐出用の吐出ノズル
JP6846589B2 (ja) * 2016-07-29 2021-03-24 パナソニックＩｐマネジメント株式会社 液体吐出装置および液体吐出方法
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
JP2018051479A (ja) * 2016-09-29 2018-04-05 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
JP6772725B2 (ja) 2016-09-29 2020-10-21 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
JP2018051478A (ja) 2016-09-29 2018-04-05 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
IT201700019466A1 (it) * 2017-02-21 2018-08-21 Tecno Italia S R L Dispositivo e metodo per la decorazione di manufatti mediante stampa digitale
WO2018189591A2 (zh) * 2017-04-14 2018-10-18 伊利诺斯工具制品有限公司 用于防止锡膏滴落的装置
US11167365B2 (en) * 2017-04-14 2021-11-09 Illinois Tool Works Inc. Automatic solder paste addition apparatus for solder paste printer
US11173562B2 (en) * 2017-04-14 2021-11-16 Illinois Tool Works Inc. Solder paste feeding assembly and method
JP6953801B2 (ja) * 2017-05-31 2021-10-27 セイコーエプソン株式会社 液体吐出装置
IT201700098731A1 (it) * 2017-09-04 2019-03-04 Durst Phototechnik Ag "Dispositivo per il posizionamento di un attuatore"
CN108464940A (zh) * 2017-09-26 2018-08-31 河北华胜塑胶机械制造有限公司 一种膏药制作机
CN109569955B (zh) * 2017-09-29 2021-10-08 精工爱普生株式会社 位移放大机构以及使用了该位移放大机构的液体喷射装置
US11833335B2 (en) * 2018-03-20 2023-12-05 Musashi Engineering, Inc. Liquid material ejecting apparatus
JP6993276B2 (ja) * 2018-03-27 2022-01-13 株式会社Ｉｈｉ回転機械エンジニアリング 液材供給装置
JP7243053B2 (ja) 2018-06-26 2023-03-22 セイコーエプソン株式会社 液体吐出装置および液体吐出方法
JP7243054B2 (ja) 2018-06-26 2023-03-22 セイコーエプソン株式会社 液体吐出装置および液体吐出方法
KR102536653B1 (ko) * 2018-09-28 2023-05-26 후지필름 가부시키가이샤 필름 제조 방법 및 설비, 필름
CN109367969B (zh) * 2018-12-10 2019-07-23 江苏逸洁包装科技有限公司 一种按压式洗护液瓶
JP7207152B2 (ja) * 2019-05-16 2023-01-18 株式会社デンソー スリーブはんだ付け装置および電子装置の製造方法
GB2592868A (en) * 2019-11-01 2021-09-15 Jetronica Ltd Method and apparatus for dispensing liquid droplets
EP4082706A4 (en) * 2019-12-27 2024-01-03 Harima Chemicals Inc METHOD FOR APPLYING BRAZING MATERIAL AND METHOD FOR MANUFACTURING A METAL BRAZING ELEMENT
CN213910835U (zh) * 2020-07-03 2021-08-10 吴明翰 眼药水的施用装置
FR3132575A1 (fr) * 2022-02-08 2023-08-11 Universite D'aix Marseille Procédé de commande d'une seringue motorisée
JP2023139496A (ja) * 2022-03-22 2023-10-04 株式会社リコー 液滴吐出ヘッドおよび液滴吐出装置
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Also Published As

Publication number Publication date
EP2732883B1 (en) 2019-05-15
CN106166535A (zh) 2016-11-30
HUE044123T2 (hu) 2019-10-28
TWI564083B (zh) 2017-01-01
MY166475A (en) 2018-06-27
TWI609722B (zh) 2018-01-01
PL2732883T3 (pl) 2019-11-29
EP2732883A1 (en) 2014-05-21
CN103747885A (zh) 2014-04-23
TWI537057B (zh) 2016-06-11
KR20140050042A (ko) 2014-04-28
KR101801224B1 (ko) 2017-11-24
CN106166535B (zh) 2019-03-12
WO2013008799A1 (ja) 2013-01-17
EP2732883A4 (en) 2016-11-23
ES2735286T3 (es) 2019-12-17
US20140217127A1 (en) 2014-08-07
CN103747885B (zh) 2016-09-14
TW201707796A (zh) 2017-03-01
JP5806868B2 (ja) 2015-11-10
US9440781B2 (en) 2016-09-13
JP2013017945A (ja) 2013-01-31
HK1193377A1 (zh) 2014-09-19
TW201313324A (zh) 2013-04-01
TW201639633A (zh) 2016-11-16

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