PL2732883T3 - Urządzenie i sposób do wyrzucania kropelek - Google Patents
Urządzenie i sposób do wyrzucania kropelekInfo
- Publication number
- PL2732883T3 PL2732883T3 PL12810942T PL12810942T PL2732883T3 PL 2732883 T3 PL2732883 T3 PL 2732883T3 PL 12810942 T PL12810942 T PL 12810942T PL 12810942 T PL12810942 T PL 12810942T PL 2732883 T3 PL2732883 T3 PL 2732883T3
- Authority
- PL
- Poland
- Prior art keywords
- discharge device
- droplet discharge
- droplet
- discharge
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D83/00—Containers or packages with special means for dispensing contents
- B65D83/0005—Containers or packages provided with a piston or with a movable bottom or partition having approximately the same section as the container
- B65D83/0022—Containers or packages provided with a piston or with a movable bottom or partition having approximately the same section as the container moved by a reciprocable plunger
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/05—Heads having a valve
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011152594A JP5806868B2 (ja) | 2011-07-11 | 2011-07-11 | 液滴吐出装置および方法 |
PCT/JP2012/067527 WO2013008799A1 (ja) | 2011-07-11 | 2012-07-10 | 液滴吐出装置および方法 |
EP12810942.8A EP2732883B1 (en) | 2011-07-11 | 2012-07-10 | Droplet discharge device and method |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2732883T3 true PL2732883T3 (pl) | 2019-11-29 |
Family
ID=47506082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL12810942T PL2732883T3 (pl) | 2011-07-11 | 2012-07-10 | Urządzenie i sposób do wyrzucania kropelek |
Country Status (13)
Country | Link |
---|---|
US (1) | US9440781B2 (pl) |
EP (1) | EP2732883B1 (pl) |
JP (1) | JP5806868B2 (pl) |
KR (1) | KR101801224B1 (pl) |
CN (2) | CN103747885B (pl) |
ES (1) | ES2735286T3 (pl) |
HK (1) | HK1193377A1 (pl) |
HU (1) | HUE044123T2 (pl) |
MY (1) | MY166475A (pl) |
PL (1) | PL2732883T3 (pl) |
SG (1) | SG10201605074WA (pl) |
TW (3) | TWI537057B (pl) |
WO (1) | WO2013008799A1 (pl) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011071888A1 (en) * | 2009-12-08 | 2011-06-16 | Nordson Corporation | Force amplifying driver system, jetting dispenser, and method of dispensing fluid |
WO2015080081A1 (ja) * | 2013-11-29 | 2015-06-04 | リソテックジャパン株式会社 | 薬液供給機構及び小型製造装置 |
CN105980064A (zh) * | 2014-02-14 | 2016-09-28 | 诺信公司 | 喷射分配器以及用于喷射流体材料滴的方法 |
JP6538649B2 (ja) * | 2014-03-10 | 2019-07-03 | 武蔵エンジニアリング株式会社 | 塗布装置および塗布方法 |
US9757900B2 (en) * | 2015-05-20 | 2017-09-12 | Xerox Corporation | Pin-actuated printhead |
US10286415B2 (en) * | 2015-07-10 | 2019-05-14 | Ginolis Oy | Dispensing device and method |
JP2017103103A (ja) * | 2015-12-02 | 2017-06-08 | 矢崎総業株式会社 | 電線付き端子の製造方法 |
US10442174B2 (en) * | 2015-12-08 | 2019-10-15 | Xerox Corporation | Material feeder for engineering polymer ejection system for additive manufacturing applications |
CN108472677B (zh) * | 2016-01-16 | 2021-07-23 | 武藏工业株式会社 | 液体材料吐出装置 |
JP6646809B2 (ja) * | 2016-01-18 | 2020-02-14 | パナソニックIpマネジメント株式会社 | 液体吐出用の吐出ノズル |
JP6846589B2 (ja) * | 2016-07-29 | 2021-03-24 | パナソニックIpマネジメント株式会社 | 液体吐出装置および液体吐出方法 |
JP6778426B2 (ja) * | 2016-09-20 | 2020-11-04 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
JP2018051479A (ja) * | 2016-09-29 | 2018-04-05 | セイコーエプソン株式会社 | 流体吐出装置および流体を吐出する方法 |
JP2018051478A (ja) | 2016-09-29 | 2018-04-05 | セイコーエプソン株式会社 | 流体吐出装置および流体を吐出する方法 |
JP6772725B2 (ja) | 2016-09-29 | 2020-10-21 | セイコーエプソン株式会社 | 流体吐出装置および流体を吐出する方法 |
IT201700019466A1 (it) * | 2017-02-21 | 2018-08-21 | Tecno Italia S R L | Dispositivo e metodo per la decorazione di manufatti mediante stampa digitale |
EP3610957B1 (en) * | 2017-04-14 | 2023-06-07 | Illinois Tool Works Inc. | Apparatus for preventing solder paste dripping |
JP7127055B2 (ja) * | 2017-04-14 | 2022-08-29 | イリノイ トゥール ワークス インコーポレイティド | はんだペースト印刷機の自動はんだペースト付加装置 |
US11173562B2 (en) * | 2017-04-14 | 2021-11-16 | Illinois Tool Works Inc. | Solder paste feeding assembly and method |
JP6953801B2 (ja) * | 2017-05-31 | 2021-10-27 | セイコーエプソン株式会社 | 液体吐出装置 |
IT201700098731A1 (it) * | 2017-09-04 | 2019-03-04 | Durst Phototechnik Ag | "Dispositivo per il posizionamento di un attuatore" |
CN108464940B (zh) * | 2017-09-26 | 2024-08-09 | 河北华胜科技有限公司 | 一种膏药制作机 |
CN109569955B (zh) * | 2017-09-29 | 2021-10-08 | 精工爱普生株式会社 | 位移放大机构以及使用了该位移放大机构的液体喷射装置 |
EP3769855B1 (en) * | 2018-03-20 | 2024-03-13 | Musashi Engineering, Inc. | Liquid material ejecting apparatus |
JP6993276B2 (ja) * | 2018-03-27 | 2022-01-13 | 株式会社Ihi回転機械エンジニアリング | 液材供給装置 |
JP7243054B2 (ja) | 2018-06-26 | 2023-03-22 | セイコーエプソン株式会社 | 液体吐出装置および液体吐出方法 |
JP7243053B2 (ja) | 2018-06-26 | 2023-03-22 | セイコーエプソン株式会社 | 液体吐出装置および液体吐出方法 |
CN112770847B (zh) * | 2018-09-28 | 2023-03-24 | 富士胶片株式会社 | 薄膜制造方法及设备、薄膜 |
CN109367969B (zh) * | 2018-12-10 | 2019-07-23 | 江苏逸洁包装科技有限公司 | 一种按压式洗护液瓶 |
JP7207152B2 (ja) * | 2019-05-16 | 2023-01-18 | 株式会社デンソー | スリーブはんだ付け装置および電子装置の製造方法 |
GB2592868A (en) * | 2019-11-01 | 2021-09-15 | Jetronica Ltd | Method and apparatus for dispensing liquid droplets |
US11945052B2 (en) | 2019-12-27 | 2024-04-02 | Harima Chemicals, Inc. | Brazing material application method and manufacturing method of metal member for brazing |
CN213910835U (zh) * | 2020-07-03 | 2021-08-10 | 吴明翰 | 眼药水的施用装置 |
FR3132575A1 (fr) * | 2022-02-08 | 2023-08-11 | Universite D'aix Marseille | Procédé de commande d'une seringue motorisée |
JP2023139496A (ja) * | 2022-03-22 | 2023-10-04 | 株式会社リコー | 液滴吐出ヘッドおよび液滴吐出装置 |
KR102646741B1 (ko) | 2022-06-23 | 2024-03-11 | 동의대학교 산학협력단 | 액적 토출 모니터링이 가능한 공압 디스펜서 |
WO2024171566A1 (ja) * | 2023-02-16 | 2024-08-22 | パナソニックIpマネジメント株式会社 | 液滴吐出装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4942984A (en) * | 1988-11-10 | 1990-07-24 | Scm Metal Products, Inc. | Dripless solder paste dispenser |
JPH03254851A (ja) * | 1990-03-05 | 1991-11-13 | Suzuki Motor Corp | 高粘度流体用ガン |
DE4202561A1 (de) | 1992-01-30 | 1993-08-05 | Boehringer Mannheim Gmbh | Vorrichtung zum dosierten zufuehren einer analysefluessigkeit |
US5747102A (en) | 1995-11-16 | 1998-05-05 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
US6253957B1 (en) * | 1995-11-16 | 2001-07-03 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
SE507519C2 (sv) | 1996-10-16 | 1998-06-15 | Mydata Automation Ab | Anordning för att anbringa ett visköst medium på ett underlag |
JP3904668B2 (ja) * | 1997-05-19 | 2007-04-11 | 松下電器産業株式会社 | 接着剤の塗布方法および装置 |
JP3223892B2 (ja) * | 1998-11-25 | 2001-10-29 | 日本電気株式会社 | インクジェット式記録装置及びインクジェット式記録方法 |
JP2001046937A (ja) * | 1999-08-05 | 2001-02-20 | Matsushita Electric Ind Co Ltd | 粘性液体塗布装置および方法 |
JP4663894B2 (ja) * | 2001-03-27 | 2011-04-06 | 武蔵エンジニアリング株式会社 | 液滴の形成方法および液滴定量吐出装置 |
KR101499597B1 (ko) * | 2007-03-08 | 2015-03-06 | 무사시 엔지니어링 가부시키가이샤 | 액적 토출 장치 및 방법 |
JP2010022881A (ja) * | 2007-03-30 | 2010-02-04 | Musashi Eng Co Ltd | 液材吐出装置および液材吐出方法 |
JP2009018587A (ja) | 2008-07-25 | 2009-01-29 | Microjet:Kk | 吐出装置 |
JP5476840B2 (ja) | 2009-08-03 | 2014-04-23 | 日本電気株式会社 | 噴射式塗布ユニット、噴射式塗布装置及び噴射式塗布方法 |
US8708246B2 (en) * | 2011-10-28 | 2014-04-29 | Nordson Corporation | Positive displacement dispenser and method for dispensing discrete amounts of liquid |
-
2011
- 2011-07-11 JP JP2011152594A patent/JP5806868B2/ja active Active
-
2012
- 2012-07-10 KR KR1020147003150A patent/KR101801224B1/ko active IP Right Grant
- 2012-07-10 ES ES12810942T patent/ES2735286T3/es active Active
- 2012-07-10 SG SG10201605074WA patent/SG10201605074WA/en unknown
- 2012-07-10 MY MYPI2014700080A patent/MY166475A/en unknown
- 2012-07-10 HU HUE12810942 patent/HUE044123T2/hu unknown
- 2012-07-10 CN CN201280034714.3A patent/CN103747885B/zh active Active
- 2012-07-10 PL PL12810942T patent/PL2732883T3/pl unknown
- 2012-07-10 US US14/232,186 patent/US9440781B2/en active Active
- 2012-07-10 WO PCT/JP2012/067527 patent/WO2013008799A1/ja active Application Filing
- 2012-07-10 EP EP12810942.8A patent/EP2732883B1/en active Active
- 2012-07-10 CN CN201610680453.2A patent/CN106166535B/zh active Active
- 2012-07-11 TW TW101124885A patent/TWI537057B/zh active
- 2012-07-11 TW TW105112119A patent/TWI564083B/zh active
- 2012-07-11 TW TW105134055A patent/TWI609722B/zh active
-
2014
- 2014-07-07 HK HK14106856.4A patent/HK1193377A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
SG10201605074WA (en) | 2016-08-30 |
TW201313324A (zh) | 2013-04-01 |
HUE044123T2 (hu) | 2019-10-28 |
TW201707796A (zh) | 2017-03-01 |
CN106166535A (zh) | 2016-11-30 |
EP2732883A1 (en) | 2014-05-21 |
KR20140050042A (ko) | 2014-04-28 |
EP2732883B1 (en) | 2019-05-15 |
TW201639633A (zh) | 2016-11-16 |
CN103747885A (zh) | 2014-04-23 |
JP5806868B2 (ja) | 2015-11-10 |
TWI564083B (zh) | 2017-01-01 |
TWI537057B (zh) | 2016-06-11 |
MY166475A (en) | 2018-06-27 |
WO2013008799A1 (ja) | 2013-01-17 |
JP2013017945A (ja) | 2013-01-31 |
ES2735286T3 (es) | 2019-12-17 |
CN106166535B (zh) | 2019-03-12 |
KR101801224B1 (ko) | 2017-11-24 |
US20140217127A1 (en) | 2014-08-07 |
TWI609722B (zh) | 2018-01-01 |
US9440781B2 (en) | 2016-09-13 |
HK1193377A1 (zh) | 2014-09-19 |
EP2732883A4 (en) | 2016-11-23 |
CN103747885B (zh) | 2016-09-14 |
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