SG10201510099RA - Coating method, computer storage medium and coating apparatus - Google Patents

Coating method, computer storage medium and coating apparatus

Info

Publication number
SG10201510099RA
SG10201510099RA SG10201510099RA SG10201510099RA SG10201510099RA SG 10201510099R A SG10201510099R A SG 10201510099RA SG 10201510099R A SG10201510099R A SG 10201510099RA SG 10201510099R A SG10201510099R A SG 10201510099RA SG 10201510099R A SG10201510099R A SG 10201510099RA
Authority
SG
Singapore
Prior art keywords
storage medium
computer storage
coating
coating method
coating apparatus
Prior art date
Application number
SG10201510099RA
Other languages
English (en)
Inventor
Hasimoto Takafumi
Hatakeyama Shinichi
Shibata Naoki
Yoshihara Kousuke
Kubota Minoru
Ide Hiroyuki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201510099RA publication Critical patent/SG10201510099RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B15/00—Systems controlled by a computer
    • G05B15/02—Systems controlled by a computer electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • B05D3/042—Directing or stopping the fluid to be coated with air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0466—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
    • B05D3/104—Pretreatment of other substrates
SG10201510099RA 2014-12-11 2015-12-09 Coating method, computer storage medium and coating apparatus SG10201510099RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014250571A JP5886935B1 (ja) 2014-12-11 2014-12-11 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置

Publications (1)

Publication Number Publication Date
SG10201510099RA true SG10201510099RA (en) 2016-07-28

Family

ID=55523973

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201510099RA SG10201510099RA (en) 2014-12-11 2015-12-09 Coating method, computer storage medium and coating apparatus

Country Status (6)

Country Link
US (1) US10048664B2 (zh)
JP (1) JP5886935B1 (zh)
KR (1) KR102355809B1 (zh)
CN (1) CN105702604B (zh)
SG (1) SG10201510099RA (zh)
TW (1) TWI603377B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5096849B2 (ja) * 2007-09-13 2012-12-12 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP6212066B2 (ja) * 2015-03-03 2017-10-11 東京エレクトロン株式会社 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置
JP6316768B2 (ja) * 2015-03-26 2018-04-25 東京エレクトロン株式会社 密着層形成方法、密着層形成システムおよび記憶媒体
JP6475123B2 (ja) * 2015-09-01 2019-02-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JPWO2017195549A1 (ja) * 2016-05-13 2019-03-07 東京エレクトロン株式会社 塗布膜形成装置、塗布膜形成方法及び記憶媒体
JPWO2017221683A1 (ja) * 2016-06-24 2019-04-04 東京エレクトロン株式会社 基板処理方法、読み取り可能なコンピュータ記憶媒体及び基板処理システム
KR101909188B1 (ko) 2016-06-24 2018-10-18 세메스 주식회사 기판 처리 장치 및 방법
CN106076759A (zh) * 2016-07-25 2016-11-09 铜陵海源超微粉体有限公司 粉体涂装装置
KR101927696B1 (ko) * 2016-08-31 2019-02-27 세메스 주식회사 기판 처리 장치 및 방법
US11065639B2 (en) * 2016-12-22 2021-07-20 Tokyo Electron Limited Coating treatment method, computer storage medium and coating treatment apparatus
JP6899265B2 (ja) 2017-06-27 2021-07-07 東京エレクトロン株式会社 塗布処理方法、塗布処理装置及び記憶媒体
KR102204885B1 (ko) * 2017-09-14 2021-01-19 세메스 주식회사 기판 처리 방법
WO2019159736A1 (ja) * 2018-02-16 2019-08-22 東京エレクトロン株式会社 基板処理装置
JP7079850B2 (ja) * 2018-08-23 2022-06-02 東京エレクトロン株式会社 基板処理方法及び基板処理システム
TW202116420A (zh) * 2019-07-04 2021-05-01 日商東京威力科創股份有限公司 塗布方法及塗布裝置
US11163235B2 (en) * 2019-08-22 2021-11-02 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus for forming a photoresist layer, method for forming a masking layer, and method for forming a photoresist layer
CN113050377A (zh) * 2019-12-26 2021-06-29 沈阳芯源微电子设备股份有限公司 光阻涂布的方法
KR20220097680A (ko) * 2020-12-30 2022-07-08 세메스 주식회사 노즐 대기 포트와 이를 포함하는 기판 처리 장치 및 이를 이용한 노즐 세정 방법
JP2022124070A (ja) * 2021-02-15 2022-08-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法
JP2022178623A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 塗布処理方法および塗布処理装置
CN113471108B (zh) * 2021-07-06 2022-10-21 华海清科股份有限公司 一种基于马兰戈尼效应的晶圆竖直旋转处理装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3337150B2 (ja) * 1993-01-20 2002-10-21 シャープ株式会社 スピン式コーティング装置
JPH0899057A (ja) * 1994-09-29 1996-04-16 Dainippon Screen Mfg Co Ltd 基板へのレジスト液塗布方法および基板用レジスト液塗布装置
JPH0985155A (ja) * 1995-09-28 1997-03-31 Nippon Precision Circuits Kk スピンコート装置およびスピンコート方法
JPH11207250A (ja) * 1998-01-23 1999-08-03 Tokyo Electron Ltd 膜形成方法
TW442336B (en) * 1997-08-19 2001-06-23 Tokyo Electron Ltd Film forming method
US6332723B1 (en) * 1999-07-28 2001-12-25 Tokyo Electron Limited Substrate processing apparatus and method
JP2001307991A (ja) * 2000-04-25 2001-11-02 Tokyo Electron Ltd 膜形成方法
JP4353626B2 (ja) * 2000-11-21 2009-10-28 東京エレクトロン株式会社 塗布方法および塗布装置
JP2003136010A (ja) 2001-11-01 2003-05-13 Tokyo Electron Ltd 塗布処理装置および塗布処理方法
JP2003145016A (ja) * 2001-11-07 2003-05-20 Tokyo Electron Ltd 塗布処理方法および塗布処理装置
US20040084144A1 (en) * 2002-08-21 2004-05-06 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method
DE102005011107A1 (de) * 2005-03-10 2006-09-21 Infineon Technologies Ag Verfahren und Vorrichtung zum Bearbeiten von Wafern auf Montageträgern
US7470638B2 (en) * 2006-02-22 2008-12-30 Micron Technology, Inc. Systems and methods for manipulating liquid films on semiconductor substrates
JP4805758B2 (ja) * 2006-09-01 2011-11-02 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ読み取り可能な記録媒体及び塗布処理装置
JP5090089B2 (ja) * 2006-10-19 2012-12-05 大日本スクリーン製造株式会社 基板処理装置
JP5091764B2 (ja) * 2008-05-20 2012-12-05 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP2014050803A (ja) * 2012-09-07 2014-03-20 Toshiba Corp 回転塗布装置および回転塗布方法
JP5900370B2 (ja) * 2013-02-06 2016-04-06 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及び記憶媒体
JP6044428B2 (ja) * 2013-04-04 2016-12-14 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記憶媒体
JP6032189B2 (ja) * 2013-12-03 2016-11-24 東京エレクトロン株式会社 塗布膜形成装置、塗布膜形成方法、記憶媒体

Also Published As

Publication number Publication date
JP5886935B1 (ja) 2016-03-16
CN105702604B (zh) 2019-11-05
CN105702604A (zh) 2016-06-22
US10048664B2 (en) 2018-08-14
JP2016115693A (ja) 2016-06-23
TWI603377B (zh) 2017-10-21
US20160167079A1 (en) 2016-06-16
TW201637076A (zh) 2016-10-16
KR20160071330A (ko) 2016-06-21
KR102355809B1 (ko) 2022-01-27

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