SG10201502295PA - Substrate processing method - Google Patents
Substrate processing methodInfo
- Publication number
- SG10201502295PA SG10201502295PA SG10201502295PA SG10201502295PA SG10201502295PA SG 10201502295P A SG10201502295P A SG 10201502295PA SG 10201502295P A SG10201502295P A SG 10201502295PA SG 10201502295P A SG10201502295P A SG 10201502295PA SG 10201502295P A SG10201502295P A SG 10201502295PA
- Authority
- SG
- Singapore
- Prior art keywords
- processing method
- substrate processing
- substrate
- processing
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32097—Recipe programming for flexible batch
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014069621A JP6259698B2 (ja) | 2014-03-28 | 2014-03-28 | 基板処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201502295PA true SG10201502295PA (en) | 2015-10-29 |
Family
ID=54167339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201502295PA SG10201502295PA (en) | 2014-03-28 | 2015-03-24 | Substrate processing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US9847263B2 (zh) |
JP (1) | JP6259698B2 (zh) |
KR (1) | KR101878018B1 (zh) |
CN (1) | CN104952775B (zh) |
SG (1) | SG10201502295PA (zh) |
TW (1) | TWI643240B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110983301B (zh) * | 2019-12-23 | 2022-08-05 | 通威太阳能(安徽)有限公司 | 一种镀膜管p设备高频自动补镀方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019622A (ja) * | 2004-07-05 | 2006-01-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US7364922B2 (en) * | 2005-01-24 | 2008-04-29 | Tokyo Electron Limited | Automated semiconductor wafer salvage during processing |
JP4569956B2 (ja) * | 2005-01-24 | 2010-10-27 | 東京エレクトロン株式会社 | 基板処理装置の復旧処理方法,基板処理装置,プログラム |
JP4542984B2 (ja) | 2005-11-24 | 2010-09-15 | 東京エレクトロン株式会社 | 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム |
US20070199655A1 (en) | 2006-02-28 | 2007-08-30 | Tokyo Electron Limited | Substrate processing apparatus, method for modifying substrate processing conditions and storage medium |
JP4839101B2 (ja) | 2006-03-08 | 2011-12-21 | 東京エレクトロン株式会社 | 基板処理装置、基板処理条件検討方法及び記憶媒体 |
JP2007301690A (ja) | 2006-05-12 | 2007-11-22 | Nikon Corp | 研磨装置 |
JP5511190B2 (ja) | 2008-01-23 | 2014-06-04 | 株式会社荏原製作所 | 基板処理装置の運転方法 |
JP5491022B2 (ja) * | 2008-12-10 | 2014-05-14 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、基板処理装置の制御方法および基板処理装置の表示方法 |
US8437870B2 (en) * | 2009-06-05 | 2013-05-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for implementing a virtual metrology advanced process control platform |
CN102222599B (zh) * | 2010-04-13 | 2013-03-27 | 中芯国际集成电路制造(上海)有限公司 | 工艺流程的优化方法和装置 |
CN102543799A (zh) * | 2012-02-10 | 2012-07-04 | 上海宏力半导体制造有限公司 | 刻蚀控制方法以及半导体制造工艺控制方法 |
US9727049B2 (en) * | 2012-09-04 | 2017-08-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Qualitative fault detection and classification system for tool condition monitoring and associated methods |
-
2014
- 2014-03-28 JP JP2014069621A patent/JP6259698B2/ja active Active
-
2015
- 2015-03-17 TW TW104108423A patent/TWI643240B/zh active
- 2015-03-24 SG SG10201502295PA patent/SG10201502295PA/en unknown
- 2015-03-25 US US14/668,885 patent/US9847263B2/en active Active
- 2015-03-26 KR KR1020150042118A patent/KR101878018B1/ko active IP Right Grant
- 2015-03-26 CN CN201510135013.4A patent/CN104952775B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20150279751A1 (en) | 2015-10-01 |
US9847263B2 (en) | 2017-12-19 |
KR20150112864A (ko) | 2015-10-07 |
TW201537618A (zh) | 2015-10-01 |
JP6259698B2 (ja) | 2018-01-10 |
TWI643240B (zh) | 2018-12-01 |
CN104952775B (zh) | 2020-04-07 |
KR101878018B1 (ko) | 2018-07-12 |
JP2015192094A (ja) | 2015-11-02 |
CN104952775A (zh) | 2015-09-30 |
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