SG10201502030UA - Substrate polishing apparatus - Google Patents

Substrate polishing apparatus

Info

Publication number
SG10201502030UA
SG10201502030UA SG10201502030UA SG10201502030UA SG10201502030UA SG 10201502030U A SG10201502030U A SG 10201502030UA SG 10201502030U A SG10201502030U A SG 10201502030UA SG 10201502030U A SG10201502030U A SG 10201502030UA SG 10201502030U A SG10201502030U A SG 10201502030UA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
substrate polishing
substrate
polishing
Prior art date
Application number
SG10201502030UA
Other languages
English (en)
Inventor
Hiroshi Aono
Tadakazu Sone
Hideo Aizawa
Kenji Shinkai
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201502030UA publication Critical patent/SG10201502030UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201502030UA 2014-03-31 2015-03-17 Substrate polishing apparatus SG10201502030UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014074111A JP6328977B2 (ja) 2014-03-31 2014-03-31 基板研磨装置

Publications (1)

Publication Number Publication Date
SG10201502030UA true SG10201502030UA (en) 2015-10-29

Family

ID=54189046

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201502030UA SG10201502030UA (en) 2014-03-31 2015-03-17 Substrate polishing apparatus

Country Status (3)

Country Link
US (1) US20150273659A1 (ja)
JP (1) JP6328977B2 (ja)
SG (1) SG10201502030UA (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3043377A1 (en) * 2004-11-01 2016-07-13 Ebara Corporation Polishing apparatus
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
CN107243823A (zh) * 2017-06-30 2017-10-13 浙江展邦电子科技有限公司 线路板正反面强力抛光机
KR102037747B1 (ko) * 2018-01-08 2019-10-29 에스케이실트론 주식회사 웨이퍼 연마 장치
CN112530831B (zh) * 2019-09-19 2022-12-30 夏泰鑫半导体(青岛)有限公司 半导体设备及半导体设备净化方法
US11211272B2 (en) * 2019-09-25 2021-12-28 Micron Technology, Inc. Contaminant detection tools and related methods
KR102435926B1 (ko) * 2020-06-08 2022-08-25 에스케이실트론 주식회사 웨이퍼의 연마 장치 및 방법
JP6957706B1 (ja) * 2020-09-17 2021-11-02 Dmg森精機株式会社 工作機械
CN112706060B (zh) * 2020-12-23 2021-11-09 上海新昇半导体科技有限公司 具有自清洗功能的双面抛光设备及抛光方法
CN115228862B (zh) * 2022-08-04 2023-10-17 长鑫存储技术有限公司 传输腔室及其清洁方法、半导体加工设备
KR102673183B1 (ko) * 2022-10-25 2024-06-07 유한회사 씨티씨 반도체 기판 연마장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07276241A (ja) * 1994-04-04 1995-10-24 Aasu Giken:Kk サンドブラスト装置及びそれに用いるブラストガン
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
JP4644926B2 (ja) * 2000-10-13 2011-03-09 ソニー株式会社 半導体製造装置および半導体装置の製造方法
DE10316995A1 (de) * 2003-04-11 2004-11-18 Tesa Ag Abdeckklebeband
JP2008296293A (ja) * 2007-05-29 2008-12-11 Tokyo Seimitsu Co Ltd 研磨部のチャンバ内洗浄装置および洗浄方法
JP5170812B2 (ja) * 2008-09-30 2013-03-27 本田技研工業株式会社 加工機の集塵装置
US20110277257A1 (en) * 2010-03-17 2011-11-17 Quickie Manufacturing Corporation Scrub brush
US8856965B1 (en) * 2012-09-19 2014-10-14 Michael J. Theofield Shirt system with sealed glove and sleeve

Also Published As

Publication number Publication date
JP6328977B2 (ja) 2018-05-23
US20150273659A1 (en) 2015-10-01
JP2015196206A (ja) 2015-11-09

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