JP2015196206A - 基板研磨装置 - Google Patents
基板研磨装置 Download PDFInfo
- Publication number
- JP2015196206A JP2015196206A JP2014074111A JP2014074111A JP2015196206A JP 2015196206 A JP2015196206 A JP 2015196206A JP 2014074111 A JP2014074111 A JP 2014074111A JP 2014074111 A JP2014074111 A JP 2014074111A JP 2015196206 A JP2015196206 A JP 2015196206A
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- JP
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- Prior art keywords
- polishing
- chamber
- gas
- polishing chamber
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 381
- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 238000004140 cleaning Methods 0.000 claims abstract description 78
- 239000007921 spray Substances 0.000 claims abstract description 40
- 239000003595 mist Substances 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims description 58
- 238000005507 spraying Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 37
- 239000012530 fluid Substances 0.000 abstract description 34
- 238000007667 floating Methods 0.000 abstract description 8
- 239000007789 gas Substances 0.000 description 88
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 55
- 235000012431 wafers Nutrition 0.000 description 43
- 230000007246 mechanism Effects 0.000 description 23
- 238000009826 distribution Methods 0.000 description 14
- 238000012423 maintenance Methods 0.000 description 14
- 239000002002 slurry Substances 0.000 description 14
- 238000012544 monitoring process Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 5
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000000383 hazardous chemical Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 125000002066 L-histidyl group Chemical group [H]N1C([H])=NC(C([H])([H])[C@](C(=O)[*])([H])N([H])[H])=C1[H] 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
301 気体供給口
302 噴霧ノズル
303 研磨部(研磨テーブル)
304 気体排出口
305 グローブボックス
306 ハンド式の洗浄具
307 密閉型グローブ
308 固定部材
Claims (8)
- 研磨チャンバ内において基板を研磨する研磨部と、
前記研磨チャンバ内に気体を供給する気体供給口と、
前記気体を前記研磨チャンバ内から排出する気体排出口と、
前記研磨チャンバ内の壁面に設けられ、前記研磨チャンバ内に洗浄液を霧状に噴霧する噴霧ノズルと、
を備えた基板研磨装置であって、
前記気体供給口は、前記研磨チャンバ内の壁面の中心から側方にオフセットされた位置に配置されており、
前記噴霧ノズルの向きは、前記研磨チャンバ内の壁面から中央の空間に向けて前記洗浄液を噴霧するように設定されていることを特徴とする基板研磨装置。 - 複数の前記気体供給口が、前記研磨チャンバ内の上部においてそれぞれ異なる位置に設けられている、請求項1に記載の基板研磨装置。
- 前記気体供給口は、前記研磨チャンバの上部に設けられており、
前記噴霧ノズルは、前記気体供給口の近傍に配置されている、請求項1または請求項2に記載の基板研磨装置。 - 前記気体排出口は、前記研磨チャンバの下部の前記研磨部の近傍に設けられており、
前記噴霧ノズルは、前記気体排出口の近傍に配置されている、請求項1または請求項2に記載の基板研磨装置。 - 前記噴霧ノズルの向きは、前記気体供給口から供給された気体の流れと反対の向きに設定されている、請求項1ないし請求項4のいずれかに記載の基板研磨装置。
- 前記噴霧ノズルの向きは、前記気体供給口から供給された気体の流れと同じ向きに設定されている、請求項1ないし請求項4のいずれかに記載の基板研磨装置。
- 前記研磨チャンバ内を洗浄するためのハンド式の洗浄具と、
前記研磨チャンバの外から前記ハンド式の洗浄具を操作するための密閉型グローブと、
を備える、請求項1ないし請求項6のいずれかに記載の基板研磨装置。 - 前記密閉型グローブを前記研磨チャンバ内の壁面に固定するための固定部材を備える、請求項7に記載の基板研磨装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014074111A JP6328977B2 (ja) | 2014-03-31 | 2014-03-31 | 基板研磨装置 |
US14/641,623 US20150273659A1 (en) | 2014-03-31 | 2015-03-09 | Substrate polishing apparatus |
SG10201502030UA SG10201502030UA (en) | 2014-03-31 | 2015-03-17 | Substrate polishing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014074111A JP6328977B2 (ja) | 2014-03-31 | 2014-03-31 | 基板研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015196206A true JP2015196206A (ja) | 2015-11-09 |
JP6328977B2 JP6328977B2 (ja) | 2018-05-23 |
Family
ID=54189046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014074111A Expired - Fee Related JP6328977B2 (ja) | 2014-03-31 | 2014-03-31 | 基板研磨装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150273659A1 (ja) |
JP (1) | JP6328977B2 (ja) |
SG (1) | SG10201502030UA (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019119039A (ja) * | 2018-01-08 | 2019-07-22 | エスケイ・シルトロン・カンパニー・リミテッド | ウェーハ研磨装置 |
JP6957706B1 (ja) * | 2020-09-17 | 2021-11-02 | Dmg森精機株式会社 | 工作機械 |
KR20210152226A (ko) * | 2020-06-08 | 2021-12-15 | 에스케이실트론 주식회사 | 웨이퍼의 연마 장치 및 방법 |
KR102673183B1 (ko) * | 2022-10-25 | 2024-06-07 | 유한회사 씨티씨 | 반도체 기판 연마장치 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3043377A1 (en) * | 2004-11-01 | 2016-07-13 | Ebara Corporation | Polishing apparatus |
US20180085891A1 (en) * | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for shaping the surface of chemical mechanical polishing pads |
US9802293B1 (en) * | 2016-09-29 | 2017-10-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method to shape the surface of chemical mechanical polishing pads |
CN107243823A (zh) * | 2017-06-30 | 2017-10-13 | 浙江展邦电子科技有限公司 | 线路板正反面强力抛光机 |
CN112530831B (zh) * | 2019-09-19 | 2022-12-30 | 夏泰鑫半导体(青岛)有限公司 | 半导体设备及半导体设备净化方法 |
US11211272B2 (en) * | 2019-09-25 | 2021-12-28 | Micron Technology, Inc. | Contaminant detection tools and related methods |
CN112706060B (zh) * | 2020-12-23 | 2021-11-09 | 上海新昇半导体科技有限公司 | 具有自清洗功能的双面抛光设备及抛光方法 |
CN115228862B (zh) * | 2022-08-04 | 2023-10-17 | 长鑫存储技术有限公司 | 传输腔室及其清洁方法、半导体加工设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07276241A (ja) * | 1994-04-04 | 1995-10-24 | Aasu Giken:Kk | サンドブラスト装置及びそれに用いるブラストガン |
JP2002121698A (ja) * | 2000-10-13 | 2002-04-26 | Sony Corp | 半導体製造装置および半導体装置の製造方法 |
JP2008296293A (ja) * | 2007-05-29 | 2008-12-11 | Tokyo Seimitsu Co Ltd | 研磨部のチャンバ内洗浄装置および洗浄方法 |
JP2010082759A (ja) * | 2008-09-30 | 2010-04-15 | Honda Motor Co Ltd | 加工機の集塵装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US7102763B2 (en) * | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
DE10316995A1 (de) * | 2003-04-11 | 2004-11-18 | Tesa Ag | Abdeckklebeband |
US20110277257A1 (en) * | 2010-03-17 | 2011-11-17 | Quickie Manufacturing Corporation | Scrub brush |
US8856965B1 (en) * | 2012-09-19 | 2014-10-14 | Michael J. Theofield | Shirt system with sealed glove and sleeve |
-
2014
- 2014-03-31 JP JP2014074111A patent/JP6328977B2/ja not_active Expired - Fee Related
-
2015
- 2015-03-09 US US14/641,623 patent/US20150273659A1/en not_active Abandoned
- 2015-03-17 SG SG10201502030UA patent/SG10201502030UA/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07276241A (ja) * | 1994-04-04 | 1995-10-24 | Aasu Giken:Kk | サンドブラスト装置及びそれに用いるブラストガン |
JP2002121698A (ja) * | 2000-10-13 | 2002-04-26 | Sony Corp | 半導体製造装置および半導体装置の製造方法 |
JP2008296293A (ja) * | 2007-05-29 | 2008-12-11 | Tokyo Seimitsu Co Ltd | 研磨部のチャンバ内洗浄装置および洗浄方法 |
JP2010082759A (ja) * | 2008-09-30 | 2010-04-15 | Honda Motor Co Ltd | 加工機の集塵装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019119039A (ja) * | 2018-01-08 | 2019-07-22 | エスケイ・シルトロン・カンパニー・リミテッド | ウェーハ研磨装置 |
US11198207B2 (en) | 2018-01-08 | 2021-12-14 | Sk Siltron Co., Ltd. | Wafer polishing apparatus |
KR20210152226A (ko) * | 2020-06-08 | 2021-12-15 | 에스케이실트론 주식회사 | 웨이퍼의 연마 장치 및 방법 |
KR102435926B1 (ko) | 2020-06-08 | 2022-08-25 | 에스케이실트론 주식회사 | 웨이퍼의 연마 장치 및 방법 |
JP6957706B1 (ja) * | 2020-09-17 | 2021-11-02 | Dmg森精機株式会社 | 工作機械 |
JP2022049959A (ja) * | 2020-09-17 | 2022-03-30 | Dmg森精機株式会社 | 工作機械 |
KR102673183B1 (ko) * | 2022-10-25 | 2024-06-07 | 유한회사 씨티씨 | 반도체 기판 연마장치 |
Also Published As
Publication number | Publication date |
---|---|
JP6328977B2 (ja) | 2018-05-23 |
US20150273659A1 (en) | 2015-10-01 |
SG10201502030UA (en) | 2015-10-29 |
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