SE8800836L - STEP AND REPEATING SYSTEM FOR DIRECT EXPOSURE FOR MANUFACTURING OR TREATMENT OF SEMICONDUCTOR DISCS - Google Patents

STEP AND REPEATING SYSTEM FOR DIRECT EXPOSURE FOR MANUFACTURING OR TREATMENT OF SEMICONDUCTOR DISCS

Info

Publication number
SE8800836L
SE8800836L SE8800836A SE8800836A SE8800836L SE 8800836 L SE8800836 L SE 8800836L SE 8800836 A SE8800836 A SE 8800836A SE 8800836 A SE8800836 A SE 8800836A SE 8800836 L SE8800836 L SE 8800836L
Authority
SE
Sweden
Prior art keywords
wafer
image
reticle
alignment
stepped
Prior art date
Application number
SE8800836A
Other languages
Swedish (sv)
Other versions
SE456872B (en
SE8800836D0 (en
Inventor
Peski C Van
W L Meisenheimer
Original Assignee
American Semiconductor Equip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Semiconductor Equip filed Critical American Semiconductor Equip
Publication of SE8800836D0 publication Critical patent/SE8800836D0/en
Publication of SE8800836L publication Critical patent/SE8800836L/en
Publication of SE456872B publication Critical patent/SE456872B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves
    • G03F9/7057—Gas flow, e.g. for focusing, leveling or gap setting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Light Sources And Details Of Projection-Printing Devices (AREA)

Abstract

Apparatus for masking operations in processing of semiconductor wafers. A step and repeat system is used to expose the wafer 11 to an image contained on a reticle 13. The reticle also contains an alignment target which is projected onto the wafer adjacent the circuit pattern. The stage holding the wafer is stepped to produce a desired array of circuits and targets on the wafer. Subsequently a reticle 13 is used which contains a different image together with an alignment pattern that is shaped complimentary to the alignment target of the first reticle. When the wafer is stepped to each array location, a low intensity light source 42 illuminates the alignment target on the wafer through the same lens 14 used for the image exposure. The image of the alignment target is viewed on the wafer and the corresponding alignment image on the reticle, simultaneously. The stage is moved to achieve alignment. The reticle image is projected onto the wafer, overlapping the previous image. The wafer is then stepped and the process repeated at other array positions. <IMAGE>
SE8800836A 1979-05-11 1988-03-09 DEVICE FOR STEP AND REPEATING SYSTEM FOR DIRECT EXPOSURE FOR PREPARING OR TREATMENT OF SEMICONDUCTOR DISCS WITH A CAMERA FOR EXPOSURE OF A PICTURE IMAGE SE456872B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3834979A 1979-05-11 1979-05-11

Publications (3)

Publication Number Publication Date
SE8800836D0 SE8800836D0 (en) 1988-03-09
SE8800836L true SE8800836L (en) 1988-03-09
SE456872B SE456872B (en) 1988-11-07

Family

ID=21899427

Family Applications (3)

Application Number Title Priority Date Filing Date
SE8003424A SE457034B (en) 1979-05-11 1980-05-07 DEVICE WITH PHOTO EXPOSURE SYSTEM FOR SEMICONDUCTOR DISCS WITH A CAMERA FOR EXPOSURE OF THE DISC TO MAKE SEMICONDUCTOR DEVICES.
SE8800837A SE456873B (en) 1979-05-11 1988-03-09 DEVICE FOR USE IN A STEP AND REPEATING SYSTEM FOR DIRECT EXPOSURE OF SEMICONDUCTOR DISCS
SE8800836A SE456872B (en) 1979-05-11 1988-03-09 DEVICE FOR STEP AND REPEATING SYSTEM FOR DIRECT EXPOSURE FOR PREPARING OR TREATMENT OF SEMICONDUCTOR DISCS WITH A CAMERA FOR EXPOSURE OF A PICTURE IMAGE

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SE8003424A SE457034B (en) 1979-05-11 1980-05-07 DEVICE WITH PHOTO EXPOSURE SYSTEM FOR SEMICONDUCTOR DISCS WITH A CAMERA FOR EXPOSURE OF THE DISC TO MAKE SEMICONDUCTOR DEVICES.
SE8800837A SE456873B (en) 1979-05-11 1988-03-09 DEVICE FOR USE IN A STEP AND REPEATING SYSTEM FOR DIRECT EXPOSURE OF SEMICONDUCTOR DISCS

Country Status (8)

Country Link
JP (3) JPS5617019A (en)
DE (1) DE3017582C2 (en)
FR (1) FR2456338B1 (en)
GB (2) GB2052767B (en)
IL (1) IL59629A (en)
IT (1) IT1212414B (en)
NL (1) NL8002009A (en)
SE (3) SE457034B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4475122A (en) * 1981-11-09 1984-10-02 Tre Semiconductor Equipment Corporation Automatic wafer alignment technique
JPS5946026A (en) * 1982-09-09 1984-03-15 Toshiba Corp Measuring method for position of sample
GB2150105B (en) * 1983-11-23 1987-04-29 Alan Leslie Smith Device for expelling fluent contents from a container
JP2593440B2 (en) * 1985-12-19 1997-03-26 株式会社ニコン Projection type exposure equipment
GB8803171D0 (en) * 1988-02-11 1988-03-09 English Electric Valve Co Ltd Imaging apparatus
JP2682002B2 (en) * 1988-02-22 1997-11-26 日本精工株式会社 Exposure apparatus alignment method and apparatus
KR0144082B1 (en) * 1994-04-01 1998-08-17 김주용 Reticle and the setting method of blind using the same
JP2546537B2 (en) * 1994-06-20 1996-10-23 株式会社ニコン Projection exposure apparatus and method
JP2006213107A (en) 2005-02-02 2006-08-17 Yamaha Motor Co Ltd Saddle riding type vehicle

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2052603A (en) * 1932-09-09 1936-09-01 Johns Manville Article of manufacture
DE2222249C3 (en) * 1972-05-05 1979-04-12 Anatolij Petrovitsch Kornilov Double lens device for bringing a photomask into register with a substrate such as a semiconductor wafer
JPS4921467A (en) * 1972-06-20 1974-02-25
JPS593791B2 (en) * 1975-04-07 1984-01-26 キヤノン株式会社 Object image recognition method
JPS51123565A (en) * 1975-04-21 1976-10-28 Nippon Telegr & Teleph Corp <Ntt> Three-dimention-position differential adjustment of processing article
JPS51124938A (en) * 1975-04-25 1976-10-30 Hitachi Ltd Automatic focusing apparatus
JPS5932763B2 (en) * 1975-07-25 1984-08-10 株式会社日立製作所 automatic focusing device
JPS602772B2 (en) * 1976-11-01 1985-01-23 株式会社日立製作所 exposure equipment
DE2845603C2 (en) * 1978-10-19 1982-12-09 Censor Patent- und Versuchs-Anstalt, 9490 Vaduz Method and device for projection copying

Also Published As

Publication number Publication date
SE457034B (en) 1988-11-21
SE456872B (en) 1988-11-07
DE3017582A1 (en) 1980-11-13
IT1212414B (en) 1989-11-22
IL59629A (en) 1983-03-31
JPH0310221B2 (en) 1991-02-13
FR2456338B1 (en) 1986-05-09
JPH0125220B2 (en) 1989-05-16
NL8002009A (en) 1980-11-13
GB2052767A (en) 1981-01-28
SE8800836D0 (en) 1988-03-09
SE8003424L (en) 1980-11-12
GB2052767B (en) 1983-06-08
GB2111695B (en) 1984-01-11
JPS5816531A (en) 1983-01-31
FR2456338A1 (en) 1980-12-05
JPS638609B2 (en) 1988-02-23
DE3017582C2 (en) 1986-07-31
SE456873B (en) 1988-11-07
IL59629A0 (en) 1980-06-30
GB2111695A (en) 1983-07-06
SE8800837D0 (en) 1988-03-09
JPS5617019A (en) 1981-02-18
JPS5816532A (en) 1983-01-31
SE8800837L (en) 1988-03-09
IT8021931A0 (en) 1980-05-09

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