SE7501777L - - Google Patents

Info

Publication number
SE7501777L
SE7501777L SE7501777A SE7501777A SE7501777L SE 7501777 L SE7501777 L SE 7501777L SE 7501777 A SE7501777 A SE 7501777A SE 7501777 A SE7501777 A SE 7501777A SE 7501777 L SE7501777 L SE 7501777L
Authority
SE
Sweden
Prior art keywords
plating
feb
regions
optionally
gold
Prior art date
Application number
SE7501777A
Other languages
English (en)
Other versions
SE446751B (sv
Inventor
K R Newby
E D Winters
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US443625A external-priority patent/US3873428A/en
Priority claimed from US443624A external-priority patent/US3926747A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7501777L publication Critical patent/SE7501777L/xx
Publication of SE446751B publication Critical patent/SE446751B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7501777A 1974-02-19 1975-02-18 Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade SE446751B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443625A US3873428A (en) 1974-02-19 1974-02-19 Preferential gold electroplating
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices

Publications (2)

Publication Number Publication Date
SE7501777L true SE7501777L (enExample) 1975-08-20
SE446751B SE446751B (sv) 1986-10-06

Family

ID=27033593

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7501777A SE446751B (sv) 1974-02-19 1975-02-18 Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade

Country Status (7)

Country Link
JP (1) JPS5440056B2 (enExample)
DE (1) DE2506990C3 (enExample)
FR (1) FR2261352B1 (enExample)
GB (1) GB1494394A (enExample)
IT (1) IT1031886B (enExample)
NL (1) NL160034C (enExample)
SE (1) SE446751B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226167C2 (de) * 1992-08-07 1996-10-24 Sel Alcatel Ag Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik
DE69832380T2 (de) * 1997-03-10 2006-08-03 Asahi Kasei Kabushiki Kaisha Herstellungsmethode für die verdrahtung von halbleiteranordnungen

Also Published As

Publication number Publication date
FR2261352A1 (enExample) 1975-09-12
FR2261352B1 (enExample) 1978-04-21
DE2506990A1 (de) 1975-08-28
JPS50124841A (enExample) 1975-10-01
SE446751B (sv) 1986-10-06
JPS5440056B2 (enExample) 1979-12-01
IT1031886B (it) 1979-05-10
GB1494394A (en) 1977-12-07
DE2506990C3 (de) 1979-09-13
DE2506990B2 (de) 1979-01-25
NL160034C (nl) 1979-09-17
NL160034B (nl) 1979-04-17
NL7501908A (nl) 1975-08-21

Similar Documents

Publication Publication Date Title
SE8305319L (sv) Bindning av silverpartiklar i silverbeleggning pa elektrosubstrat
GB1157989A (en) Improvements in and relating to Cleaning Selected Surface Areas of Substrates
JPS4916708B1 (enExample)
DE1521625A1 (de) Verfahren zur Herstellung von Halbleiterstueckchen kleiner raeumlicher Abmessungen
SE7501777L (enExample)
MY108081A (en) Anode for chromium plating and processes for producing and using the same.
Hillert et al. On the Use of Grain Boundary Diffusion in Surface Alloying
GB1255039A (en) Improvements relating to the manufacture of semiconductor devices
JPS5360567A (en) Electrode formation method of semiconductor device
JPS6449274A (en) Superhigh-speed semiconductor device
JPS5266374A (en) Galvanization of non electrolytic nickel for semiconductor substrate
IE40092L (en) Electrolysis electrode
Muramaki et al. THE ACTION OF EDGE PROTECTIVES IN ETCHING OF COPPER
GB1353675A (en) Electrophoretic coating
DE1614583C3 (de) Verfahren zum Herstellen einer Kontaktmetallschicht für eine mit mindestens einem pn-übergang versehene Halbleiteranordnung
Noninski et al. Influence of a Magnetic Field on Potential Distribution During Copper Deposition in the Tafel Potentials Range
Winters Selective Gold Plating on Palladium--Titanium Conductor Patterns
JPS5931900A (ja) 部分銀メツキにおける下地銅メツキのはみ出し部分剥離方法および銀メツキ表面仕上げ方法
Szabo et al. Investigation of the Adsorption of Lead and Tin on Platinized Platinum
JPS56160078A (en) Forming method of electrode of solar battery
JPS5641394A (en) Electrolytic electrode
Rosenene et al. A Study of the Process of Electrodeposition of Cu in Nitrate Solutions. I.--Effect of pH
JPS6463929A (en) Matrix array substrate
JPS57152127A (en) Fabrication of electrode of semiconductor device
JPS5263068A (en) Formation of electrode of semiconductor device

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 7501777-2

Effective date: 19870914

Format of ref document f/p: F