SE446751B - Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade - Google Patents

Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade

Info

Publication number
SE446751B
SE446751B SE7501777A SE7501777A SE446751B SE 446751 B SE446751 B SE 446751B SE 7501777 A SE7501777 A SE 7501777A SE 7501777 A SE7501777 A SE 7501777A SE 446751 B SE446751 B SE 446751B
Authority
SE
Sweden
Prior art keywords
electropleting
selective
procedure
precious metal
metal area
Prior art date
Application number
SE7501777A
Other languages
English (en)
Swedish (sv)
Other versions
SE7501777L (enExample
Inventor
K R Newby
E D Winters
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US443625A external-priority patent/US3873428A/en
Priority claimed from US443624A external-priority patent/US3926747A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7501777L publication Critical patent/SE7501777L/xx
Publication of SE446751B publication Critical patent/SE446751B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7501777A 1974-02-19 1975-02-18 Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade SE446751B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443625A US3873428A (en) 1974-02-19 1974-02-19 Preferential gold electroplating
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices

Publications (2)

Publication Number Publication Date
SE7501777L SE7501777L (enExample) 1975-08-20
SE446751B true SE446751B (sv) 1986-10-06

Family

ID=27033593

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7501777A SE446751B (sv) 1974-02-19 1975-02-18 Forfarande for selektiv elektropletering av mjukt guld pa ett edelmetallomrade

Country Status (7)

Country Link
JP (1) JPS5440056B2 (enExample)
DE (1) DE2506990C3 (enExample)
FR (1) FR2261352B1 (enExample)
GB (1) GB1494394A (enExample)
IT (1) IT1031886B (enExample)
NL (1) NL160034C (enExample)
SE (1) SE446751B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226167C2 (de) * 1992-08-07 1996-10-24 Sel Alcatel Ag Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik
DE69832380T2 (de) * 1997-03-10 2006-08-03 Asahi Kasei Kabushiki Kaisha Herstellungsmethode für die verdrahtung von halbleiteranordnungen

Also Published As

Publication number Publication date
FR2261352A1 (enExample) 1975-09-12
FR2261352B1 (enExample) 1978-04-21
DE2506990A1 (de) 1975-08-28
JPS50124841A (enExample) 1975-10-01
JPS5440056B2 (enExample) 1979-12-01
IT1031886B (it) 1979-05-10
GB1494394A (en) 1977-12-07
DE2506990C3 (de) 1979-09-13
DE2506990B2 (de) 1979-01-25
NL160034C (nl) 1979-09-17
SE7501777L (enExample) 1975-08-20
NL160034B (nl) 1979-04-17
NL7501908A (nl) 1975-08-21

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