SE446751B - PROCEDURE FOR SELECTIVE ELECTROPLETING OF SOFT GOLD IN A PRECIOUS METAL AREA - Google Patents

PROCEDURE FOR SELECTIVE ELECTROPLETING OF SOFT GOLD IN A PRECIOUS METAL AREA

Info

Publication number
SE446751B
SE446751B SE7501777A SE7501777A SE446751B SE 446751 B SE446751 B SE 446751B SE 7501777 A SE7501777 A SE 7501777A SE 7501777 A SE7501777 A SE 7501777A SE 446751 B SE446751 B SE 446751B
Authority
SE
Sweden
Prior art keywords
electropleting
selective
procedure
precious metal
metal area
Prior art date
Application number
SE7501777A
Other languages
Swedish (sv)
Other versions
SE7501777L (en
Inventor
K R Newby
E D Winters
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US443624A external-priority patent/US3926747A/en
Priority claimed from US443625A external-priority patent/US3873428A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7501777L publication Critical patent/SE7501777L/xx
Publication of SE446751B publication Critical patent/SE446751B/en

Links

Classifications

    • H10P14/47—
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H10W20/40—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7501777A 1974-02-19 1975-02-18 PROCEDURE FOR SELECTIVE ELECTROPLETING OF SOFT GOLD IN A PRECIOUS METAL AREA SE446751B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices
US443625A US3873428A (en) 1974-02-19 1974-02-19 Preferential gold electroplating

Publications (2)

Publication Number Publication Date
SE7501777L SE7501777L (en) 1975-08-20
SE446751B true SE446751B (en) 1986-10-06

Family

ID=27033593

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7501777A SE446751B (en) 1974-02-19 1975-02-18 PROCEDURE FOR SELECTIVE ELECTROPLETING OF SOFT GOLD IN A PRECIOUS METAL AREA

Country Status (7)

Country Link
JP (1) JPS5440056B2 (en)
DE (1) DE2506990C3 (en)
FR (1) FR2261352B1 (en)
GB (1) GB1494394A (en)
IT (1) IT1031886B (en)
NL (1) NL160034C (en)
SE (1) SE446751B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226167C2 (en) * 1992-08-07 1996-10-24 Sel Alcatel Ag Method for electrically conductive connection using flip-chip technology
US6384484B1 (en) * 1997-03-10 2002-05-07 Asahi Kasei Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
GB1494394A (en) 1977-12-07
JPS5440056B2 (en) 1979-12-01
NL7501908A (en) 1975-08-21
SE7501777L (en) 1975-08-20
NL160034B (en) 1979-04-17
JPS50124841A (en) 1975-10-01
NL160034C (en) 1979-09-17
FR2261352B1 (en) 1978-04-21
IT1031886B (en) 1979-05-10
DE2506990C3 (en) 1979-09-13
DE2506990B2 (en) 1979-01-25
DE2506990A1 (en) 1975-08-28
FR2261352A1 (en) 1975-09-12

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