FR2261352A1 - - Google Patents
Info
- Publication number
- FR2261352A1 FR2261352A1 FR7505153A FR7505153A FR2261352A1 FR 2261352 A1 FR2261352 A1 FR 2261352A1 FR 7505153 A FR7505153 A FR 7505153A FR 7505153 A FR7505153 A FR 7505153A FR 2261352 A1 FR2261352 A1 FR 2261352A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US443624A US3926747A (en) | 1974-02-19 | 1974-02-19 | Selective electrodeposition of gold on electronic devices |
US443625A US3873428A (en) | 1974-02-19 | 1974-02-19 | Preferential gold electroplating |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2261352A1 true FR2261352A1 (en) | 1975-09-12 |
FR2261352B1 FR2261352B1 (en) | 1978-04-21 |
Family
ID=27033593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7505153A Expired FR2261352B1 (en) | 1974-02-19 | 1975-02-19 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5440056B2 (en) |
DE (1) | DE2506990C3 (en) |
FR (1) | FR2261352B1 (en) |
GB (1) | GB1494394A (en) |
IT (1) | IT1031886B (en) |
NL (1) | NL160034C (en) |
SE (1) | SE446751B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4226167C2 (en) * | 1992-08-07 | 1996-10-24 | Sel Alcatel Ag | Method for electrically conductive connection using flip-chip technology |
EP0984485B1 (en) * | 1997-03-10 | 2005-11-16 | Asahi Kasei Kabushiki Kaisha | Wiring forming method for semiconductor device |
-
1975
- 1975-02-18 SE SE7501777A patent/SE446751B/en not_active IP Right Cessation
- 1975-02-18 NL NL7501908A patent/NL160034C/en not_active IP Right Cessation
- 1975-02-19 DE DE19752506990 patent/DE2506990C3/en not_active Expired
- 1975-02-19 FR FR7505153A patent/FR2261352B1/fr not_active Expired
- 1975-02-19 JP JP2080875A patent/JPS5440056B2/ja not_active Expired
- 1975-02-19 IT IT2045275A patent/IT1031886B/en active
- 1975-02-19 GB GB709175A patent/GB1494394A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL160034C (en) | 1979-09-17 |
IT1031886B (en) | 1979-05-10 |
NL7501908A (en) | 1975-08-21 |
NL160034B (en) | 1979-04-17 |
FR2261352B1 (en) | 1978-04-21 |
SE7501777L (en) | 1975-08-20 |
DE2506990A1 (en) | 1975-08-28 |
JPS50124841A (en) | 1975-10-01 |
JPS5440056B2 (en) | 1979-12-01 |
DE2506990B2 (en) | 1979-01-25 |
GB1494394A (en) | 1977-12-07 |
SE446751B (en) | 1986-10-06 |
DE2506990C3 (en) | 1979-09-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |