SE7501777L - - Google Patents

Info

Publication number
SE7501777L
SE7501777L SE7501777A SE7501777A SE7501777L SE 7501777 L SE7501777 L SE 7501777L SE 7501777 A SE7501777 A SE 7501777A SE 7501777 A SE7501777 A SE 7501777A SE 7501777 L SE7501777 L SE 7501777L
Authority
SE
Sweden
Prior art keywords
plating
feb
regions
optionally
gold
Prior art date
Application number
SE7501777A
Other versions
SE446751B (en
Inventor
K R Newby
E D Winters
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US443625A external-priority patent/US3873428A/en
Priority claimed from US443624A external-priority patent/US3926747A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7501777L publication Critical patent/SE7501777L/xx
Publication of SE446751B publication Critical patent/SE446751B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1494394 Selective gold electro-plating WESTERN ELECTRIC CO Inc 19 Feb 1975 [19 Feb 1974(2)] 7091/75 Heading C7B [Also in Division H1] A composite surface comprising regions of Ti and regions of Pt, Pd and/or Au is selectively gold electro-plated on the latter by controlling the cathodic potential of the surface below that at which gold deposition occurs on the Ti, by which is meant less than 50000 Au nucleation sites per cm<SP>2</SP> on the Ti. Conventional baths are used, with optionally 20 ppb to 2 ppm of Pb present. Details of plating onset potentials for Pd, Pt and Au in relation to Ti are given, and control may be effected via a calomel electrode and potentiostat, although two-electrode systems are possible. The potential may be increased stepwise or continuously during plating. The Ti may be a layer on a conventional semi-conductor substrate, e.g. based on Si, and bear a printed circuit pattern of the Pt, Pd and/or Au. It may optionally be protected with a photo-resist during plating.
SE7501777A 1974-02-19 1975-02-18 PROCEDURE FOR SELECTIVE ELECTROPLETING OF SOFT GOLD IN A PRECIOUS METAL AREA SE446751B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443625A US3873428A (en) 1974-02-19 1974-02-19 Preferential gold electroplating
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices

Publications (2)

Publication Number Publication Date
SE7501777L true SE7501777L (en) 1975-08-20
SE446751B SE446751B (en) 1986-10-06

Family

ID=27033593

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7501777A SE446751B (en) 1974-02-19 1975-02-18 PROCEDURE FOR SELECTIVE ELECTROPLETING OF SOFT GOLD IN A PRECIOUS METAL AREA

Country Status (7)

Country Link
JP (1) JPS5440056B2 (en)
DE (1) DE2506990C3 (en)
FR (1) FR2261352B1 (en)
GB (1) GB1494394A (en)
IT (1) IT1031886B (en)
NL (1) NL160034C (en)
SE (1) SE446751B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226167C2 (en) * 1992-08-07 1996-10-24 Sel Alcatel Ag Method for electrically conductive connection using flip-chip technology
AU6120898A (en) * 1997-03-10 1998-09-29 Asahi Kasei Kogyo Kabushiki Kaisha Wiring forming method for semiconductor device and semiconductor device

Also Published As

Publication number Publication date
DE2506990A1 (en) 1975-08-28
DE2506990C3 (en) 1979-09-13
FR2261352A1 (en) 1975-09-12
JPS50124841A (en) 1975-10-01
SE446751B (en) 1986-10-06
NL7501908A (en) 1975-08-21
NL160034C (en) 1979-09-17
DE2506990B2 (en) 1979-01-25
NL160034B (en) 1979-04-17
JPS5440056B2 (en) 1979-12-01
IT1031886B (en) 1979-05-10
GB1494394A (en) 1977-12-07
FR2261352B1 (en) 1978-04-21

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