FR2261352A1 - - Google Patents

Info

Publication number
FR2261352A1
FR2261352A1 FR7505153A FR7505153A FR2261352A1 FR 2261352 A1 FR2261352 A1 FR 2261352A1 FR 7505153 A FR7505153 A FR 7505153A FR 7505153 A FR7505153 A FR 7505153A FR 2261352 A1 FR2261352 A1 FR 2261352A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7505153A
Other languages
French (fr)
Other versions
FR2261352B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US443625A external-priority patent/US3873428A/en
Priority claimed from US443624A external-priority patent/US3926747A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2261352A1 publication Critical patent/FR2261352A1/fr
Application granted granted Critical
Publication of FR2261352B1 publication Critical patent/FR2261352B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10P14/47—
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H10W20/40—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR7505153A 1974-02-19 1975-02-19 Expired FR2261352B1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443625A US3873428A (en) 1974-02-19 1974-02-19 Preferential gold electroplating
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices

Publications (2)

Publication Number Publication Date
FR2261352A1 true FR2261352A1 (enExample) 1975-09-12
FR2261352B1 FR2261352B1 (enExample) 1978-04-21

Family

ID=27033593

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7505153A Expired FR2261352B1 (enExample) 1974-02-19 1975-02-19

Country Status (7)

Country Link
JP (1) JPS5440056B2 (enExample)
DE (1) DE2506990C3 (enExample)
FR (1) FR2261352B1 (enExample)
GB (1) GB1494394A (enExample)
IT (1) IT1031886B (enExample)
NL (1) NL160034C (enExample)
SE (1) SE446751B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226167C2 (de) * 1992-08-07 1996-10-24 Sel Alcatel Ag Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik
US6384484B1 (en) * 1997-03-10 2002-05-07 Asahi Kasei Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
JPS5440056B2 (enExample) 1979-12-01
NL7501908A (nl) 1975-08-21
SE7501777L (enExample) 1975-08-20
FR2261352B1 (enExample) 1978-04-21
IT1031886B (it) 1979-05-10
DE2506990A1 (de) 1975-08-28
NL160034B (nl) 1979-04-17
GB1494394A (en) 1977-12-07
DE2506990C3 (de) 1979-09-13
DE2506990B2 (de) 1979-01-25
SE446751B (sv) 1986-10-06
NL160034C (nl) 1979-09-17
JPS50124841A (enExample) 1975-10-01

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Legal Events

Date Code Title Description
ST Notification of lapse