SE7415064L - - Google Patents
Info
- Publication number
- SE7415064L SE7415064L SE7415064A SE7415064A SE7415064L SE 7415064 L SE7415064 L SE 7415064L SE 7415064 A SE7415064 A SE 7415064A SE 7415064 A SE7415064 A SE 7415064A SE 7415064 L SE7415064 L SE 7415064L
- Authority
- SE
- Sweden
- Prior art keywords
- leads
- semi
- frame
- lead frame
- fingers
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42100473A | 1973-12-03 | 1973-12-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7415064L true SE7415064L (enrdf_load_stackoverflow) | 1975-06-04 |
| SE403852B SE403852B (sv) | 1978-09-04 |
Family
ID=23668787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7415064A SE403852B (sv) | 1973-12-03 | 1974-12-02 | Halvledarkapsel och sett att tillverka densamma |
Country Status (7)
| Country | Link |
|---|---|
| JP (2) | JPS5087587A (enrdf_load_stackoverflow) |
| CA (1) | CA1032276A (enrdf_load_stackoverflow) |
| CH (1) | CH585968A5 (enrdf_load_stackoverflow) |
| DE (1) | DE2456951A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2253282B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1458846A (enrdf_load_stackoverflow) |
| SE (1) | SE403852B (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2485262A1 (fr) * | 1980-06-19 | 1981-12-24 | Thomson Csf | Boitier d'encapsulation resistant a de fortes pressions externes |
| US4577214A (en) * | 1981-05-06 | 1986-03-18 | At&T Bell Laboratories | Low-inductance power/ground distribution in a package for a semiconductor chip |
| JPH04120765A (ja) * | 1990-09-12 | 1992-04-21 | Seiko Epson Corp | 半導体装置とその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3374537A (en) * | 1965-03-22 | 1968-03-26 | Philco Ford Corp | Method of connecting leads to a semiconductive device |
| US3436810A (en) * | 1967-07-17 | 1969-04-08 | Jade Corp | Method of packaging integrated circuits |
| DE2003423C3 (de) * | 1970-01-27 | 1975-11-13 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Kontaktieren von Halbleiteranordnungen |
| US3668770A (en) * | 1970-05-25 | 1972-06-13 | Rca Corp | Method of connecting semiconductor device to terminals of package |
| JPS4727491U (enrdf_load_stackoverflow) | 1971-04-17 | 1972-11-28 | ||
| US3659035A (en) * | 1971-04-26 | 1972-04-25 | Rca Corp | Semiconductor device package |
| JPS4836983A (enrdf_load_stackoverflow) | 1971-09-10 | 1973-05-31 |
-
1974
- 1974-10-16 CA CA211,500A patent/CA1032276A/en not_active Expired
- 1974-11-04 GB GB4763874A patent/GB1458846A/en not_active Expired
- 1974-12-02 FR FR7439403A patent/FR2253282B1/fr not_active Expired
- 1974-12-02 DE DE19742456951 patent/DE2456951A1/de not_active Withdrawn
- 1974-12-02 SE SE7415064A patent/SE403852B/xx not_active IP Right Cessation
- 1974-12-03 CH CH1603574A patent/CH585968A5/xx not_active IP Right Cessation
- 1974-12-03 JP JP13941974A patent/JPS5087587A/ja active Pending
-
1982
- 1982-07-06 JP JP10241582U patent/JPS5860940U/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5087587A (enrdf_load_stackoverflow) | 1975-07-14 |
| FR2253282A1 (enrdf_load_stackoverflow) | 1975-06-27 |
| DE2456951A1 (de) | 1975-06-05 |
| GB1458846A (en) | 1976-12-15 |
| CH585968A5 (enrdf_load_stackoverflow) | 1977-03-15 |
| JPS5860940U (ja) | 1983-04-25 |
| SE403852B (sv) | 1978-09-04 |
| FR2253282B1 (enrdf_load_stackoverflow) | 1980-09-12 |
| CA1032276A (en) | 1978-05-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
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