SE508000C2 - Halvledarbricka för integrerade halvledarkretsar och identifieringskrets för densamma - Google Patents

Halvledarbricka för integrerade halvledarkretsar och identifieringskrets för densamma

Info

Publication number
SE508000C2
SE508000C2 SE9002701A SE9002701A SE508000C2 SE 508000 C2 SE508000 C2 SE 508000C2 SE 9002701 A SE9002701 A SE 9002701A SE 9002701 A SE9002701 A SE 9002701A SE 508000 C2 SE508000 C2 SE 508000C2
Authority
SE
Sweden
Prior art keywords
voltage
semiconductor wafer
terminals
mos transistors
semiconductor
Prior art date
Application number
SE9002701A
Other languages
English (en)
Swedish (sv)
Other versions
SE9002701L (sv
SE9002701D0 (sv
Inventor
Dong-Su Jeon
Yong-Sik Seok
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SE9002701D0 publication Critical patent/SE9002701D0/xx
Publication of SE9002701L publication Critical patent/SE9002701L/xx
Publication of SE508000C2 publication Critical patent/SE508000C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/006—Identification
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1015—Read-write modes for single port memories, i.e. having either a random port or a serial port
    • G11C7/1045—Read-write mode select circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C2029/4402—Internal storage of test result, quality data, chip identification, repair information
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Memories (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Dram (AREA)
SE9002701A 1990-05-23 1990-08-20 Halvledarbricka för integrerade halvledarkretsar och identifieringskrets för densamma SE508000C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900007481A KR920007535B1 (ko) 1990-05-23 1990-05-23 식별회로를 구비한 반도체 집적회로 칩

Publications (3)

Publication Number Publication Date
SE9002701D0 SE9002701D0 (sv) 1990-08-20
SE9002701L SE9002701L (sv) 1991-11-24
SE508000C2 true SE508000C2 (sv) 1998-08-10

Family

ID=19299365

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9002701A SE508000C2 (sv) 1990-05-23 1990-08-20 Halvledarbricka för integrerade halvledarkretsar och identifieringskrets för densamma

Country Status (12)

Country Link
US (1) US5103166A (ko)
JP (2) JPH079753B2 (ko)
KR (1) KR920007535B1 (ko)
CN (1) CN1025261C (ko)
DE (1) DE4026326C2 (ko)
FR (1) FR2662505B1 (ko)
GB (1) GB2244339B (ko)
HK (1) HK21896A (ko)
IT (1) IT1242519B (ko)
NL (1) NL194814C (ko)
RU (1) RU2034306C1 (ko)
SE (1) SE508000C2 (ko)

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US7319935B2 (en) * 2003-02-12 2008-01-15 Micron Technology, Inc. System and method for analyzing electrical failure data
JP4272968B2 (ja) * 2003-10-16 2009-06-03 エルピーダメモリ株式会社 半導体装置および半導体チップ制御方法
KR100688518B1 (ko) * 2005-01-12 2007-03-02 삼성전자주식회사 개별 칩들의 디바이스 정보를 직접 판독할 수 있는시그너처 식별 장치를 갖는 멀티 칩 패키지
GB0617697D0 (en) * 2006-09-08 2006-10-18 Algotronix Ltd Method of actively tagging electronic designs and intellectual property cores
KR101161966B1 (ko) * 2010-07-09 2012-07-04 에스케이하이닉스 주식회사 칩 어드레스 회로를 포함하는 멀티 칩 패키지 장치
US9879897B2 (en) 2010-12-02 2018-01-30 Frosty Cold, Llc Cooling agent for cold packs and food and beverage containers
US10155698B2 (en) 2010-12-02 2018-12-18 Frosty Cold, Llc Cooling agent for cold packs and food and beverage containers
CN104228347B (zh) * 2013-06-18 2016-08-17 研能科技股份有限公司 喷墨头芯片
JP6091393B2 (ja) * 2013-10-01 2017-03-08 三菱電機株式会社 半導体装置
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Also Published As

Publication number Publication date
JP2001135796A (ja) 2001-05-18
US5103166A (en) 1992-04-07
NL194814C (nl) 2003-03-04
HK21896A (en) 1996-02-09
IT9021274A1 (it) 1991-11-24
KR920007535B1 (ko) 1992-09-05
NL194814B (nl) 2002-11-01
RU2034306C1 (ru) 1995-04-30
CN1056770A (zh) 1991-12-04
DE4026326C2 (de) 1995-07-27
CN1025261C (zh) 1994-06-29
GB2244339B (en) 1994-04-27
DE4026326A1 (de) 1991-11-28
GB9017779D0 (en) 1990-09-26
GB2244339A (en) 1991-11-27
IT1242519B (it) 1994-05-16
NL9001837A (nl) 1991-12-16
JP3343345B2 (ja) 2002-11-11
FR2662505A1 (fr) 1991-11-29
IT9021274A0 (it) 1990-08-14
FR2662505B1 (fr) 1994-09-09
KR910020883A (ko) 1991-12-20
JPH079753B2 (ja) 1995-02-01
SE9002701L (sv) 1991-11-24
SE9002701D0 (sv) 1990-08-20
JPH0428088A (ja) 1992-01-30

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