SE505383C2 - Förfarande för tillverkning av kontaktplattor på mönsterkort samt adapterkort för användning vid en apparat för testning av med elektriska ledningsbanor försedda mönsterkort - Google Patents

Förfarande för tillverkning av kontaktplattor på mönsterkort samt adapterkort för användning vid en apparat för testning av med elektriska ledningsbanor försedda mönsterkort

Info

Publication number
SE505383C2
SE505383C2 SE9503893A SE9503893A SE505383C2 SE 505383 C2 SE505383 C2 SE 505383C2 SE 9503893 A SE9503893 A SE 9503893A SE 9503893 A SE9503893 A SE 9503893A SE 505383 C2 SE505383 C2 SE 505383C2
Authority
SE
Sweden
Prior art keywords
contact
contact plates
electrically conductive
intended
printed circuit
Prior art date
Application number
SE9503893A
Other languages
English (en)
Swedish (sv)
Other versions
SE9503893L (sv
SE9503893D0 (sv
Inventor
Reinhold Strandberg
Original Assignee
Reinhold Strandberg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=20400078&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE505383(C2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Reinhold Strandberg filed Critical Reinhold Strandberg
Priority to SE9503893A priority Critical patent/SE505383C2/sv
Publication of SE9503893D0 publication Critical patent/SE9503893D0/xx
Priority to EP96938583A priority patent/EP0860101B1/de
Priority to DE69633678T priority patent/DE69633678D1/de
Priority to PCT/SE1996/001424 priority patent/WO1997017822A1/en
Publication of SE9503893L publication Critical patent/SE9503893L/xx
Publication of SE505383C2 publication Critical patent/SE505383C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
SE9503893A 1995-11-06 1995-11-06 Förfarande för tillverkning av kontaktplattor på mönsterkort samt adapterkort för användning vid en apparat för testning av med elektriska ledningsbanor försedda mönsterkort SE505383C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9503893A SE505383C2 (sv) 1995-11-06 1995-11-06 Förfarande för tillverkning av kontaktplattor på mönsterkort samt adapterkort för användning vid en apparat för testning av med elektriska ledningsbanor försedda mönsterkort
EP96938583A EP0860101B1 (de) 1995-11-06 1996-11-06 Verfahren zur herstellung von kontaktlöchern auf adapterplatten und adapterplatte zur prüfung von musterplatten
DE69633678T DE69633678D1 (de) 1995-11-06 1996-11-06 Verfahren zur herstellung von kontaktlöchern auf adapterplatten und adapterplatte zur prüfung von musterplatten
PCT/SE1996/001424 WO1997017822A1 (en) 1995-11-06 1996-11-06 Method for producing contact pads on pattern boards and adapter board for testing pattern boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9503893A SE505383C2 (sv) 1995-11-06 1995-11-06 Förfarande för tillverkning av kontaktplattor på mönsterkort samt adapterkort för användning vid en apparat för testning av med elektriska ledningsbanor försedda mönsterkort

Publications (3)

Publication Number Publication Date
SE9503893D0 SE9503893D0 (sv) 1995-11-06
SE9503893L SE9503893L (sv) 1997-05-07
SE505383C2 true SE505383C2 (sv) 1997-08-18

Family

ID=20400078

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9503893A SE505383C2 (sv) 1995-11-06 1995-11-06 Förfarande för tillverkning av kontaktplattor på mönsterkort samt adapterkort för användning vid en apparat för testning av med elektriska ledningsbanor försedda mönsterkort

Country Status (4)

Country Link
EP (1) EP0860101B1 (de)
DE (1) DE69633678D1 (de)
SE (1) SE505383C2 (de)
WO (1) WO1997017822A1 (de)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3638372A1 (de) * 1986-11-11 1988-05-26 Lang Dahlke Helmut Vorrichtung zum pruefen von elektrischen leiterplatten
SE458005B (sv) * 1987-11-16 1989-02-13 Reinhold Strandberg Foerfarande foer provning av kretskort samt apparat foer utfoerande av provningen
DE3925505A1 (de) * 1989-04-05 1990-10-11 Siemens Ag Vorrichtung zum pruefen von leiterplatten
DE4226069C2 (de) * 1992-08-06 1994-08-04 Test Plus Electronic Gmbh Adaptereinrichtung für eine Prüfeinrichtung für Schaltungsplatinen
JP2710544B2 (ja) * 1993-09-30 1998-02-10 インターナショナル・ビジネス・マシーンズ・コーポレイション プローブ構造、プローブ構造の形成方法

Also Published As

Publication number Publication date
WO1997017822A1 (en) 1997-05-15
EP0860101A1 (de) 1998-08-26
SE9503893L (sv) 1997-05-07
SE9503893D0 (sv) 1995-11-06
EP0860101B1 (de) 2004-10-20
DE69633678D1 (de) 2004-11-25

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