SE502520C2 - Bad, sätt och användning vid elektroplätering med tenn- vismutlegeringar - Google Patents

Bad, sätt och användning vid elektroplätering med tenn- vismutlegeringar

Info

Publication number
SE502520C2
SE502520C2 SE9002096A SE9002096A SE502520C2 SE 502520 C2 SE502520 C2 SE 502520C2 SE 9002096 A SE9002096 A SE 9002096A SE 9002096 A SE9002096 A SE 9002096A SE 502520 C2 SE502520 C2 SE 502520C2
Authority
SE
Sweden
Prior art keywords
bismuth
tin
bath
electroplating
plating
Prior art date
Application number
SE9002096A
Other languages
English (en)
Swedish (sv)
Other versions
SE9002096L (sv
SE9002096D0 (sv
Inventor
Harold P Wilson
Original Assignee
Atochem North America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22208944&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE502520(C2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atochem North America filed Critical Atochem North America
Publication of SE9002096L publication Critical patent/SE9002096L/
Publication of SE9002096D0 publication Critical patent/SE9002096D0/xx
Publication of SE502520C2 publication Critical patent/SE502520C2/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
SE9002096A 1988-10-14 1990-06-12 Bad, sätt och användning vid elektroplätering med tenn- vismutlegeringar SE502520C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1988/003536 WO1990004048A1 (en) 1988-10-14 1988-10-14 A method, bath and cell for the electrodeposition of tin-bismuth alloys

Publications (3)

Publication Number Publication Date
SE9002096L SE9002096L (sv) 1990-06-12
SE9002096D0 SE9002096D0 (sv) 1990-06-12
SE502520C2 true SE502520C2 (sv) 1995-11-06

Family

ID=22208944

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9002096A SE502520C2 (sv) 1988-10-14 1990-06-12 Bad, sätt och användning vid elektroplätering med tenn- vismutlegeringar

Country Status (13)

Country Link
EP (1) EP0397663B1 (ja)
JP (1) JP2983548B2 (ja)
KR (1) KR960008155B1 (ja)
AT (1) ATE105877T1 (ja)
BR (1) BR8807847A (ja)
DE (1) DE3889667T2 (ja)
DK (1) DK143590A (ja)
HK (1) HK103095A (ja)
LU (1) LU87746A1 (ja)
NL (1) NL194005C (ja)
NO (1) NO902630L (ja)
SE (1) SE502520C2 (ja)
WO (1) WO1990004048A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
ES2189064T3 (es) * 1997-10-22 2003-07-01 Goldschmidt Ag Th Proceso para la fabricacion de compuestos de bismuto.
AU2003272790A1 (en) 2002-10-08 2004-05-04 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
JP2005002368A (ja) * 2003-06-09 2005-01-06 Ishihara Chem Co Ltd ホイスカー防止用スズメッキ浴
DE102005016819B4 (de) * 2005-04-12 2009-10-01 Dr.-Ing. Max Schlötter GmbH & Co KG Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
KR100849439B1 (ko) * 2007-08-13 2008-07-30 다이섹(주) 노광장비의 스텝퍼척 제조방법
JP2020169360A (ja) * 2019-04-03 2020-10-15 奥野製薬工業株式会社 電気めっき用Ｂｉ−Ｓｂ合金めっき液

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198877A (en) * 1962-02-09 1965-08-03 Anaconda Wire & Cable Co Pothead closure sealed with bismuth-tin alloy
US3360446A (en) * 1964-05-08 1967-12-26 M & T Chemicals Inc Electrodepositing a tin-bismuth alloy and additives therefor
FR2071199A5 (ja) * 1969-12-19 1971-09-17 Ibm France
SU467145A1 (ru) * 1972-08-15 1975-04-15 Предприятие П/Я Х-5885 Электролит дл осаждени сплава олово-висмут
SU463747A1 (ru) * 1972-12-26 1975-03-15 Морской Гидрофизический Институт Ан Укр.Сср Электролит дл осаждени сплава олово-висмут
SU697610A1 (ru) * 1977-11-22 1979-11-15 Харьковский Ордена Ленина Политехнический Институт Им.В.И.Ленина Электролит дл нанесени покрытий сплавом олово-висмут
US4252618A (en) * 1980-02-11 1981-02-24 Pitt Metals & Chemicals, Inc. Method of electroplating tin and alkaline electroplating bath therefor
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US4565610A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴

Also Published As

Publication number Publication date
BR8807847A (pt) 1990-11-13
DE3889667T2 (de) 1994-10-13
NO902630L (no) 1990-08-06
EP0397663A4 (en) 1991-01-09
JP2983548B2 (ja) 1999-11-29
LU87746A1 (en) 1991-05-07
HK103095A (en) 1995-07-07
NL8820893A (nl) 1990-10-01
EP0397663A1 (en) 1990-11-22
JPH03503068A (ja) 1991-07-11
WO1990004048A1 (en) 1990-04-19
EP0397663B1 (en) 1994-05-18
ATE105877T1 (de) 1994-06-15
SE9002096L (sv) 1990-06-12
NL194005B (nl) 2000-12-01
KR960008155B1 (ko) 1996-06-20
NL194005C (nl) 2001-04-03
DE3889667D1 (de) 1994-06-23
SE9002096D0 (sv) 1990-06-12
DK143590A (da) 1990-07-27
DK143590D0 (da) 1990-06-12
NO902630D0 (no) 1990-06-13
KR900702085A (ko) 1990-12-05

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Legal Events

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NUG Patent has lapsed