SE437199B - Anordning avsedd for vermeavledning vid halvledare innefattande ett enligt termosifonprincipen arbetande vermeavledande organ - Google Patents

Anordning avsedd for vermeavledning vid halvledare innefattande ett enligt termosifonprincipen arbetande vermeavledande organ

Info

Publication number
SE437199B
SE437199B SE7806388A SE7806388A SE437199B SE 437199 B SE437199 B SE 437199B SE 7806388 A SE7806388 A SE 7806388A SE 7806388 A SE7806388 A SE 7806388A SE 437199 B SE437199 B SE 437199B
Authority
SE
Sweden
Prior art keywords
heat
electrodes
semiconductor
disc
coolant
Prior art date
Application number
SE7806388A
Other languages
English (en)
Swedish (sv)
Other versions
SE7806388L (sv
Inventor
A P Ferro
Jr J D Harnden
M H Mclaughlin
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of SE7806388L publication Critical patent/SE7806388L/xx
Publication of SE437199B publication Critical patent/SE437199B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE7806388A 1977-06-13 1978-05-31 Anordning avsedd for vermeavledning vid halvledare innefattande ett enligt termosifonprincipen arbetande vermeavledande organ SE437199B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/805,734 US4145708A (en) 1977-06-13 1977-06-13 Power module with isolated substrates cooled by integral heat-energy-removal means

Publications (2)

Publication Number Publication Date
SE7806388L SE7806388L (sv) 1978-12-14
SE437199B true SE437199B (sv) 1985-02-11

Family

ID=25192371

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7806388A SE437199B (sv) 1977-06-13 1978-05-31 Anordning avsedd for vermeavledning vid halvledare innefattande ett enligt termosifonprincipen arbetande vermeavledande organ

Country Status (7)

Country Link
US (1) US4145708A (nl)
JP (1) JPS5417675A (nl)
DE (1) DE2825582C2 (nl)
FR (1) FR2428916A1 (nl)
GB (1) GB1592143A (nl)
NL (1) NL7806395A (nl)
SE (1) SE437199B (nl)

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FR2492169A1 (fr) * 1980-10-09 1982-04-16 Aerospatiale Support pour cellule photovoltaique, batterie de cellules photovoltaiques pourvues d'un tel support et generateur solaire pourvu d'une telle batterie
JPS60116155A (ja) * 1983-11-29 1985-06-22 Fujitsu Ltd 液冷型高周波固体装置
US4514746A (en) * 1983-12-01 1985-04-30 Flakt Aktiebolag Apparatus for cooling telecommunications equipment in a rack
DE3402003A1 (de) * 1984-01-21 1985-07-25 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
US4633371A (en) * 1984-09-17 1986-12-30 Amdahl Corporation Heat pipe heat exchanger for large scale integrated circuits
DE3504992A1 (de) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit integriertem waermerohr
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
JPH0679543B2 (ja) * 1986-07-09 1994-10-12 日清製粉株式会社 酸性化代用乳
FR2604827B1 (fr) * 1986-10-06 1989-12-29 Alsthom Dispositif de refroidissement par vaporisation pour semi-conducteurs de puissance
ATE75074T1 (de) * 1986-10-29 1992-05-15 Bbc Brown Boveri & Cie Vorrichtung zur kuehlung von halbleiterbauelementen.
US4757370A (en) * 1987-01-12 1988-07-12 International Business Machines Corp. Circuit package cooling technique with liquid film spreading downward across package surface without separation
US4912548A (en) * 1987-01-28 1990-03-27 National Semiconductor Corporation Use of a heat pipe integrated with the IC package for improving thermal performance
US5040053A (en) * 1988-05-31 1991-08-13 Ncr Corporation Cryogenically cooled integrated circuit apparatus
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung
US5305338A (en) * 1990-09-25 1994-04-19 Mitsubishi Denki Kabushiki Kaisha Switch device for laser
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
US5405808A (en) * 1993-08-16 1995-04-11 Lsi Logic Corporation Fluid-filled and gas-filled semiconductor packages
JPH0853100A (ja) * 1994-08-10 1996-02-27 Mitsubishi Electric Corp ヒートパイプ埋め込みハニカムサンドイッチパネル
US5923085A (en) * 1996-05-02 1999-07-13 Chrysler Corporation IGBT module construction
JPH10154781A (ja) * 1996-07-19 1998-06-09 Denso Corp 沸騰冷却装置
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
JP3828673B2 (ja) * 1999-02-23 2006-10-04 ローム株式会社 半導体装置
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
KR100419318B1 (ko) * 2000-12-07 2004-02-19 한국전력공사 써모사이펀을 이용한 액체금속로의 잔열제거장치
US20020185726A1 (en) * 2001-06-06 2002-12-12 North Mark T. Heat pipe thermal management of high potential electronic chip packages
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
JP3918502B2 (ja) * 2001-10-25 2007-05-23 株式会社デンソー 沸騰冷却装置
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
JP2004125381A (ja) * 2002-08-02 2004-04-22 Mitsubishi Alum Co Ltd ヒートパイプユニット及びヒートパイプ冷却器
US7106589B2 (en) * 2003-12-23 2006-09-12 Aall Power Heatsinks, Inc. Heat sink, assembly, and method of making
US20050178532A1 (en) * 2004-02-18 2005-08-18 Huang Meng-Cheng Structure for expanding thermal conducting performance of heat sink
TWM261983U (en) * 2004-08-23 2005-04-11 Inventec Corp Tubular radiator
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
US7974096B2 (en) * 2006-08-17 2011-07-05 Ati Technologies Ulc Three-dimensional thermal spreading in an air-cooled thermal device
TW200848683A (en) * 2007-03-08 2008-12-16 Convergence Technologies Ltd Heat transfer device
US20100014251A1 (en) * 2008-07-15 2010-01-21 Advanced Micro Devices, Inc. Multidimensional Thermal Management Device for an Integrated Circuit Chip
US8910706B2 (en) * 2009-02-05 2014-12-16 International Business Machines Corporation Heat sink apparatus with extendable pin fins
JP5338012B2 (ja) * 2010-09-30 2013-11-13 ツォンシャン ウェイキアン テクノロジー カンパニー、リミテッド ハイパワー放熱モジュール
US8800643B2 (en) * 2010-12-27 2014-08-12 Hs Marston Aerospace Ltd. Surface cooler having channeled fins
CN103323299B (zh) * 2013-04-26 2015-08-26 李宜强 手持式含油砂岩冷冻磨片装置
GB2543790A (en) * 2015-10-28 2017-05-03 Sustainable Engine Systems Ltd Pin fin heat exchanger
US20170156240A1 (en) * 2015-11-30 2017-06-01 Abb Technology Oy Cooled power electronic assembly
US10045464B1 (en) 2017-03-31 2018-08-07 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
US11818868B2 (en) * 2019-02-22 2023-11-14 Mitsubishi Electric Corporation Cooling device and power conversion device
US11435144B2 (en) * 2019-08-05 2022-09-06 Asia Vital Components (China) Co., Ltd. Heat dissipation device
CN116263309A (zh) * 2021-12-15 2023-06-16 亚浩电子五金塑胶（惠州）有限公司 立体传热装置

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DE1439407A1 (de) * 1964-06-30 1969-03-27 Siemens Ag Anordnung zur Transistorkuehlung
SE354943B (nl) * 1970-02-24 1973-03-26 Asea Ab
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US3852804A (en) * 1973-05-02 1974-12-03 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly
US3852806A (en) * 1973-05-02 1974-12-03 Gen Electric Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
US3852805A (en) * 1973-06-18 1974-12-03 Gen Electric Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit
US3852803A (en) * 1973-06-18 1974-12-03 Gen Electric Heat sink cooled power semiconductor device assembly having liquid metal interface
US3826957A (en) * 1973-07-02 1974-07-30 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly using compression rods
JPS5512739B2 (nl) * 1973-10-17 1980-04-03
DE2449338A1 (de) * 1974-10-17 1976-04-22 Gen Electric Waermerohrgekuehlte leistungshalbleitervorrichtungsanordnung
FR2288396A1 (fr) * 1974-10-17 1976-05-14 Gen Electric Dispositif a semi-conducteur refroidi au moyen de tubes de refroidissement
FR2288395A1 (fr) * 1974-10-17 1976-05-14 Gen Electric Dispositif a semi-conducteur refroidi au moyen de tubes de refroidissement
US4069497A (en) * 1975-08-13 1978-01-17 Emc Technology, Inc. High heat dissipation mounting for solid state devices and circuits
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling

Also Published As

Publication number Publication date
FR2428916B1 (nl) 1984-02-24
DE2825582A1 (de) 1978-12-21
FR2428916A1 (fr) 1980-01-11
US4145708A (en) 1979-03-20
SE7806388L (sv) 1978-12-14
NL7806395A (nl) 1978-12-15
JPS5417675A (en) 1979-02-09
DE2825582C2 (de) 1985-10-24
GB1592143A (en) 1981-07-01

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