FR2428916A1 - Dispositif de refroidissement pour composants electroniques de puissance - Google Patents
Dispositif de refroidissement pour composants electroniques de puissanceInfo
- Publication number
- FR2428916A1 FR2428916A1 FR7817504A FR7817504A FR2428916A1 FR 2428916 A1 FR2428916 A1 FR 2428916A1 FR 7817504 A FR7817504 A FR 7817504A FR 7817504 A FR7817504 A FR 7817504A FR 2428916 A1 FR2428916 A1 FR 2428916A1
- Authority
- FR
- France
- Prior art keywords
- cooling device
- electronic power
- power components
- reservoir
- carries
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Dispositif économique capable de refroidir plusieurs dispositifs à semi-conducteurs de forte puissance. Il comprend un dispositif d'échange de chaleur 11 dont le réservoir 12 est fermé par une plaque 20 qui porte sur la face extérieure un élément isolant 48 destiné au montage des composants électroniques. Application aux semi-conducteurs de puissance.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/805,734 US4145708A (en) | 1977-06-13 | 1977-06-13 | Power module with isolated substrates cooled by integral heat-energy-removal means |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2428916A1 true FR2428916A1 (fr) | 1980-01-11 |
FR2428916B1 FR2428916B1 (fr) | 1984-02-24 |
Family
ID=25192371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7817504A Granted FR2428916A1 (fr) | 1977-06-13 | 1978-06-12 | Dispositif de refroidissement pour composants electroniques de puissance |
Country Status (7)
Country | Link |
---|---|
US (1) | US4145708A (fr) |
JP (1) | JPS5417675A (fr) |
DE (1) | DE2825582C2 (fr) |
FR (1) | FR2428916A1 (fr) |
GB (1) | GB1592143A (fr) |
NL (1) | NL7806395A (fr) |
SE (1) | SE437199B (fr) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5749787A (en) * | 1980-09-08 | 1982-03-23 | Hitachi Ltd | Boiling cooler |
FR2492169A1 (fr) * | 1980-10-09 | 1982-04-16 | Aerospatiale | Support pour cellule photovoltaique, batterie de cellules photovoltaiques pourvues d'un tel support et generateur solaire pourvu d'une telle batterie |
JPS60116155A (ja) * | 1983-11-29 | 1985-06-22 | Fujitsu Ltd | 液冷型高周波固体装置 |
US4514746A (en) * | 1983-12-01 | 1985-04-30 | Flakt Aktiebolag | Apparatus for cooling telecommunications equipment in a rack |
DE3402003A1 (de) * | 1984-01-21 | 1985-07-25 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul |
US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
DE3504992A1 (de) * | 1985-02-14 | 1986-08-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit integriertem waermerohr |
US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
JPH0679543B2 (ja) * | 1986-07-09 | 1994-10-12 | 日清製粉株式会社 | 酸性化代用乳 |
FR2604827B1 (fr) * | 1986-10-06 | 1989-12-29 | Alsthom | Dispositif de refroidissement par vaporisation pour semi-conducteurs de puissance |
ATE75074T1 (de) * | 1986-10-29 | 1992-05-15 | Bbc Brown Boveri & Cie | Vorrichtung zur kuehlung von halbleiterbauelementen. |
US4757370A (en) * | 1987-01-12 | 1988-07-12 | International Business Machines Corp. | Circuit package cooling technique with liquid film spreading downward across package surface without separation |
US4912548A (en) * | 1987-01-28 | 1990-03-27 | National Semiconductor Corporation | Use of a heat pipe integrated with the IC package for improving thermal performance |
US5040053A (en) * | 1988-05-31 | 1991-08-13 | Ncr Corporation | Cryogenically cooled integrated circuit apparatus |
US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
US5305338A (en) * | 1990-09-25 | 1994-04-19 | Mitsubishi Denki Kabushiki Kaisha | Switch device for laser |
JP3067399B2 (ja) * | 1992-07-03 | 2000-07-17 | 株式会社日立製作所 | 半導体冷却装置 |
US5405808A (en) * | 1993-08-16 | 1995-04-11 | Lsi Logic Corporation | Fluid-filled and gas-filled semiconductor packages |
JPH0853100A (ja) * | 1994-08-10 | 1996-02-27 | Mitsubishi Electric Corp | ヒートパイプ埋め込みハニカムサンドイッチパネル |
US5923085A (en) * | 1996-05-02 | 1999-07-13 | Chrysler Corporation | IGBT module construction |
JPH10154781A (ja) * | 1996-07-19 | 1998-06-09 | Denso Corp | 沸騰冷却装置 |
US5880524A (en) * | 1997-05-05 | 1999-03-09 | Intel Corporation | Heat pipe lid for electronic packages |
JP3828673B2 (ja) * | 1999-02-23 | 2006-10-04 | ローム株式会社 | 半導体装置 |
US6896039B2 (en) * | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
KR100419318B1 (ko) * | 2000-12-07 | 2004-02-19 | 한국전력공사 | 써모사이펀을 이용한 액체금속로의 잔열제거장치 |
US20020185726A1 (en) * | 2001-06-06 | 2002-12-12 | North Mark T. | Heat pipe thermal management of high potential electronic chip packages |
US6388882B1 (en) | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
JP3918502B2 (ja) * | 2001-10-25 | 2007-05-23 | 株式会社デンソー | 沸騰冷却装置 |
US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
JP2004125381A (ja) * | 2002-08-02 | 2004-04-22 | Mitsubishi Alum Co Ltd | ヒートパイプユニット及びヒートパイプ冷却器 |
US7106589B2 (en) * | 2003-12-23 | 2006-09-12 | Aall Power Heatsinks, Inc. | Heat sink, assembly, and method of making |
US20050178532A1 (en) * | 2004-02-18 | 2005-08-18 | Huang Meng-Cheng | Structure for expanding thermal conducting performance of heat sink |
TWM261983U (en) * | 2004-08-23 | 2005-04-11 | Inventec Corp | Tubular radiator |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
US7965511B2 (en) * | 2006-08-17 | 2011-06-21 | Ati Technologies Ulc | Cross-flow thermal management device and method of manufacture thereof |
US20080216994A1 (en) * | 2007-03-08 | 2008-09-11 | Convergence Technologies Limited | Vapor-Augmented Heat Spreader Device |
US20100014251A1 (en) * | 2008-07-15 | 2010-01-21 | Advanced Micro Devices, Inc. | Multidimensional Thermal Management Device for an Integrated Circuit Chip |
US8910706B2 (en) * | 2009-02-05 | 2014-12-16 | International Business Machines Corporation | Heat sink apparatus with extendable pin fins |
JP5338012B2 (ja) * | 2010-09-30 | 2013-11-13 | ツォンシャン ウェイキアン テクノロジー カンパニー、リミテッド | ハイパワー放熱モジュール |
US8800643B2 (en) * | 2010-12-27 | 2014-08-12 | Hs Marston Aerospace Ltd. | Surface cooler having channeled fins |
CN103323299B (zh) * | 2013-04-26 | 2015-08-26 | 李宜强 | 手持式含油砂岩冷冻磨片装置 |
GB2543790A (en) * | 2015-10-28 | 2017-05-03 | Sustainable Engine Systems Ltd | Pin fin heat exchanger |
US20170156240A1 (en) * | 2015-11-30 | 2017-06-01 | Abb Technology Oy | Cooled power electronic assembly |
US10045464B1 (en) * | 2017-03-31 | 2018-08-07 | International Business Machines Corporation | Heat pipe and vapor chamber heat dissipation |
WO2020170428A1 (fr) * | 2019-02-22 | 2020-08-27 | 三菱電機株式会社 | Dispositif de refroidissement et dispositif de conversion de puissance |
US11435144B2 (en) * | 2019-08-05 | 2022-09-06 | Asia Vital Components (China) Co., Ltd. | Heat dissipation device |
CN116263309A (zh) * | 2021-12-15 | 2023-06-16 | 亚浩电子五金塑胶(惠州)有限公司 | 立体传热装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3739234A (en) * | 1970-02-24 | 1973-06-12 | Asea Ab | Semiconductor device having heat pipe cooling means |
US3826957A (en) * | 1973-07-02 | 1974-07-30 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly using compression rods |
US3852805A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit |
US3852804A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly |
US3852803A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat sink cooled power semiconductor device assembly having liquid metal interface |
US3852806A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes |
FR2288395A1 (fr) * | 1974-10-17 | 1976-05-14 | Gen Electric | Dispositif a semi-conducteur refroidi au moyen de tubes de refroidissement |
FR2288396A1 (fr) * | 1974-10-17 | 1976-05-14 | Gen Electric | Dispositif a semi-conducteur refroidi au moyen de tubes de refroidissement |
US4012770A (en) * | 1972-09-28 | 1977-03-15 | Dynatherm Corporation | Cooling a heat-producing electrical or electronic component |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1439407A1 (de) * | 1964-06-30 | 1969-03-27 | Siemens Ag | Anordnung zur Transistorkuehlung |
JPS5512739B2 (fr) * | 1973-10-17 | 1980-04-03 | ||
DE2449338A1 (de) * | 1974-10-17 | 1976-04-22 | Gen Electric | Waermerohrgekuehlte leistungshalbleitervorrichtungsanordnung |
US4069497A (en) * | 1975-08-13 | 1978-01-17 | Emc Technology, Inc. | High heat dissipation mounting for solid state devices and circuits |
US4037270A (en) * | 1976-05-24 | 1977-07-19 | Control Data Corporation | Circuit packaging and cooling |
-
1977
- 1977-06-13 US US05/805,734 patent/US4145708A/en not_active Expired - Lifetime
-
1978
- 1978-05-18 GB GB20481/78A patent/GB1592143A/en not_active Expired
- 1978-05-31 SE SE7806388A patent/SE437199B/sv not_active IP Right Cessation
- 1978-06-10 DE DE2825582A patent/DE2825582C2/de not_active Expired
- 1978-06-12 FR FR7817504A patent/FR2428916A1/fr active Granted
- 1978-06-13 NL NL7806395A patent/NL7806395A/xx not_active Application Discontinuation
- 1978-06-13 JP JP7044978A patent/JPS5417675A/ja active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3739234A (en) * | 1970-02-24 | 1973-06-12 | Asea Ab | Semiconductor device having heat pipe cooling means |
US4012770A (en) * | 1972-09-28 | 1977-03-15 | Dynatherm Corporation | Cooling a heat-producing electrical or electronic component |
US3852804A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly |
US3852806A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes |
US3852805A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit |
US3852803A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat sink cooled power semiconductor device assembly having liquid metal interface |
FR2233710A1 (fr) * | 1973-06-18 | 1975-01-10 | Gen Electric | |
US3826957A (en) * | 1973-07-02 | 1974-07-30 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly using compression rods |
FR2288395A1 (fr) * | 1974-10-17 | 1976-05-14 | Gen Electric | Dispositif a semi-conducteur refroidi au moyen de tubes de refroidissement |
FR2288396A1 (fr) * | 1974-10-17 | 1976-05-14 | Gen Electric | Dispositif a semi-conducteur refroidi au moyen de tubes de refroidissement |
Also Published As
Publication number | Publication date |
---|---|
DE2825582A1 (de) | 1978-12-21 |
DE2825582C2 (de) | 1985-10-24 |
SE437199B (sv) | 1985-02-11 |
SE7806388L (sv) | 1978-12-14 |
US4145708A (en) | 1979-03-20 |
NL7806395A (nl) | 1978-12-15 |
JPS5417675A (en) | 1979-02-09 |
GB1592143A (en) | 1981-07-01 |
FR2428916B1 (fr) | 1984-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |