ES2004089A6 - Dispositivo interruptor de encendid - Google Patents
Dispositivo interruptor de encendidInfo
- Publication number
- ES2004089A6 ES2004089A6 ES8700290A ES8700290A ES2004089A6 ES 2004089 A6 ES2004089 A6 ES 2004089A6 ES 8700290 A ES8700290 A ES 8700290A ES 8700290 A ES8700290 A ES 8700290A ES 2004089 A6 ES2004089 A6 ES 2004089A6
- Authority
- ES
- Spain
- Prior art keywords
- base
- aluminium nitride
- switching device
- plastic housing
- ignition switching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P3/00—Other installations
- F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
- F02P3/04—Layout of circuits
- F02P3/0407—Opening or closing the primary coil circuit with electronic switching means
- F02P3/0435—Opening or closing the primary coil circuit with electronic switching means with semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Ignition Installations For Internal Combustion Engines (AREA)
Abstract
DISPOSITIVO INTERRUPTOR DE ENCENDIDO, PARA INSTALACIONES DE ENCENDIDO DE VEHICULOS AUTOMOVILES, QUE ESTA CONSTITUIDO POR ELEMENTOS CONSTRUCTIVOS, CONECTADOS CON CINTAS CONDUCTORAS, EN FORMA DE CHIP O BIEN EN CAPA GRUESA IMPRESA, QUE PRESENTA UN CUERPO DE BASE DISIPADOR DEL CALOR ASI COMO UNA CASA DE MATERIAL SINTETICO. EN CONTRA DE LO QUE OCURRE CON LOS CUERPOS DE BASE USUALES HASTA EL PRESENTE, QUE ESTAN CONSTITUIDOS POR UNA PLACA METALICA, ESTA CONSTITUIDO AHORA EL CUERPO DE BASE POR NITRURO DE ALUMINIO. PREFERENTEMENTE, EL CUERPO DE BASE DE NITRURO DE ALUMINIO PORTA UNA CAPA METALICA, QUE SIRVE, AL MISMO TIEMPO, DE CONEXION. LA CARCASA DE MATERIAL SINTETICO ESTA PEGADA CON EL CUERPO DE BASE DE NITRURO DE ALUMINIO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19863604074 DE3604074A1 (de) | 1986-02-08 | 1986-02-08 | Zuendschaltgeraet |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2004089A6 true ES2004089A6 (es) | 1988-12-01 |
Family
ID=6293753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8700290A Expired ES2004089A6 (es) | 1986-02-08 | 1987-02-06 | Dispositivo interruptor de encendid |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0258295A1 (es) |
AU (1) | AU6937187A (es) |
DE (1) | DE3604074A1 (es) |
ES (1) | ES2004089A6 (es) |
WO (1) | WO1987004859A1 (es) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3833146A1 (de) * | 1988-09-29 | 1989-03-02 | Siemens Ag | Verfahren zur herstellung eines steuergeraetes |
DE3837975A1 (de) * | 1988-11-09 | 1990-05-10 | Telefunken Electronic Gmbh | Elektronisches steuergeraet |
DE3837974A1 (de) * | 1988-11-09 | 1990-05-10 | Telefunken Electronic Gmbh | Elektronisches steuergeraet |
DE3843863A1 (de) * | 1988-12-24 | 1990-06-28 | Bosch Gmbh Robert | Hochtemperatur-heizelement, verfahren zu seiner herstellung und verwendung desselben |
DE3910699A1 (de) * | 1989-04-03 | 1990-10-04 | Omt Oberflaechen Materialtech | Leiterplatte fuer integrierte schaltungen |
DE3916899C2 (de) * | 1989-05-24 | 2003-04-03 | Bosch Gmbh Robert | Gehäuse zur Aufnahme einer elektronischen Schaltung |
DE3937183A1 (de) * | 1989-07-22 | 1991-01-24 | Bosch Gmbh Robert | Verfahren zu stoerstrahlungsdaempfung an leiterplatten |
US5008492A (en) * | 1989-10-20 | 1991-04-16 | Hughes Aircraft Company | High current feedthrough package |
US5168919A (en) * | 1990-06-29 | 1992-12-08 | Digital Equipment Corporation | Air cooled heat exchanger for multi-chip assemblies |
DE19515622C2 (de) * | 1995-04-28 | 2000-06-08 | Telefunken Microelectron | Steuermodul von Kraftfahrzeugen |
DE19549099C2 (de) * | 1995-12-29 | 1999-05-20 | Tele Quarz Gmbh | Temperaturstabilisierter Quarzkristall einer Ostzillatorschaltung |
DE102004040591A1 (de) * | 2004-08-21 | 2006-02-23 | Robert Bosch Gmbh | Elektrische Vorrichtung |
TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | Ceramtec Ag | 構件或電路用的攜帶體 |
EP2535928A3 (de) * | 2007-04-26 | 2014-08-20 | CeramTec GmbH | Kühldose für Bauelemente oder Schaltungen |
DE102014107217A1 (de) * | 2014-05-19 | 2015-11-19 | Ceram Tec Gmbh | Leistungshalbleitermodul |
DE102020211078A1 (de) * | 2020-09-02 | 2022-03-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | Steuervorrichtung, insbesondere Lenkungssteuervorrichtung |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5854268B2 (ja) * | 1977-02-09 | 1983-12-03 | 株式会社日立製作所 | 無接点点火装置 |
DE3247985C2 (de) * | 1982-12-24 | 1992-04-16 | W.C. Heraeus Gmbh, 6450 Hanau | Keramischer Träger |
JPS60178652A (ja) * | 1984-02-27 | 1985-09-12 | Toshiba Corp | 回路基板 |
JPS617647A (ja) * | 1984-06-21 | 1986-01-14 | Toshiba Corp | 回路基板 |
-
1986
- 1986-02-08 DE DE19863604074 patent/DE3604074A1/de not_active Withdrawn
-
1987
- 1987-02-05 EP EP87901024A patent/EP0258295A1/de not_active Withdrawn
- 1987-02-05 AU AU69371/87A patent/AU6937187A/en not_active Abandoned
- 1987-02-05 WO PCT/DE1987/000045 patent/WO1987004859A1/de unknown
- 1987-02-06 ES ES8700290A patent/ES2004089A6/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
WO1987004859A1 (en) | 1987-08-13 |
EP0258295A1 (de) | 1988-03-09 |
DE3604074A1 (de) | 1987-08-13 |
AU6937187A (en) | 1987-08-25 |
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