ES2004089A6 - Dispositivo interruptor de encendid - Google Patents

Dispositivo interruptor de encendid

Info

Publication number
ES2004089A6
ES2004089A6 ES8700290A ES8700290A ES2004089A6 ES 2004089 A6 ES2004089 A6 ES 2004089A6 ES 8700290 A ES8700290 A ES 8700290A ES 8700290 A ES8700290 A ES 8700290A ES 2004089 A6 ES2004089 A6 ES 2004089A6
Authority
ES
Spain
Prior art keywords
base
aluminium nitride
switching device
plastic housing
ignition switching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8700290A
Other languages
English (en)
Inventor
Dieter Seipler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of ES2004089A6 publication Critical patent/ES2004089A6/es
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
    • F02P3/00—Other installations
    • F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
    • F02P3/04—Layout of circuits
    • F02P3/0407—Opening or closing the primary coil circuit with electronic switching means
    • F02P3/0435—Opening or closing the primary coil circuit with electronic switching means with semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)

Abstract

DISPOSITIVO INTERRUPTOR DE ENCENDIDO, PARA INSTALACIONES DE ENCENDIDO DE VEHICULOS AUTOMOVILES, QUE ESTA CONSTITUIDO POR ELEMENTOS CONSTRUCTIVOS, CONECTADOS CON CINTAS CONDUCTORAS, EN FORMA DE CHIP O BIEN EN CAPA GRUESA IMPRESA, QUE PRESENTA UN CUERPO DE BASE DISIPADOR DEL CALOR ASI COMO UNA CASA DE MATERIAL SINTETICO. EN CONTRA DE LO QUE OCURRE CON LOS CUERPOS DE BASE USUALES HASTA EL PRESENTE, QUE ESTAN CONSTITUIDOS POR UNA PLACA METALICA, ESTA CONSTITUIDO AHORA EL CUERPO DE BASE POR NITRURO DE ALUMINIO. PREFERENTEMENTE, EL CUERPO DE BASE DE NITRURO DE ALUMINIO PORTA UNA CAPA METALICA, QUE SIRVE, AL MISMO TIEMPO, DE CONEXION. LA CARCASA DE MATERIAL SINTETICO ESTA PEGADA CON EL CUERPO DE BASE DE NITRURO DE ALUMINIO.
ES8700290A 1986-02-08 1987-02-06 Dispositivo interruptor de encendid Expired ES2004089A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863604074 DE3604074A1 (de) 1986-02-08 1986-02-08 Zuendschaltgeraet

Publications (1)

Publication Number Publication Date
ES2004089A6 true ES2004089A6 (es) 1988-12-01

Family

ID=6293753

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8700290A Expired ES2004089A6 (es) 1986-02-08 1987-02-06 Dispositivo interruptor de encendid

Country Status (5)

Country Link
EP (1) EP0258295A1 (es)
AU (1) AU6937187A (es)
DE (1) DE3604074A1 (es)
ES (1) ES2004089A6 (es)
WO (1) WO1987004859A1 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3833146A1 (de) * 1988-09-29 1989-03-02 Siemens Ag Verfahren zur herstellung eines steuergeraetes
DE3837975A1 (de) * 1988-11-09 1990-05-10 Telefunken Electronic Gmbh Elektronisches steuergeraet
DE3837974A1 (de) * 1988-11-09 1990-05-10 Telefunken Electronic Gmbh Elektronisches steuergeraet
DE3843863A1 (de) * 1988-12-24 1990-06-28 Bosch Gmbh Robert Hochtemperatur-heizelement, verfahren zu seiner herstellung und verwendung desselben
DE3910699A1 (de) * 1989-04-03 1990-10-04 Omt Oberflaechen Materialtech Leiterplatte fuer integrierte schaltungen
DE3916899C2 (de) * 1989-05-24 2003-04-03 Bosch Gmbh Robert Gehäuse zur Aufnahme einer elektronischen Schaltung
DE3937183A1 (de) * 1989-07-22 1991-01-24 Bosch Gmbh Robert Verfahren zu stoerstrahlungsdaempfung an leiterplatten
US5008492A (en) * 1989-10-20 1991-04-16 Hughes Aircraft Company High current feedthrough package
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
DE19515622C2 (de) * 1995-04-28 2000-06-08 Telefunken Microelectron Steuermodul von Kraftfahrzeugen
DE19549099C2 (de) * 1995-12-29 1999-05-20 Tele Quarz Gmbh Temperaturstabilisierter Quarzkristall einer Ostzillatorschaltung
DE102004040591A1 (de) * 2004-08-21 2006-02-23 Robert Bosch Gmbh Elektrische Vorrichtung
TWI449137B (zh) * 2006-03-23 2014-08-11 Ceramtec Ag 構件或電路用的攜帶體
EP2535928A3 (de) * 2007-04-26 2014-08-20 CeramTec GmbH Kühldose für Bauelemente oder Schaltungen
DE102014107217A1 (de) * 2014-05-19 2015-11-19 Ceram Tec Gmbh Leistungshalbleitermodul
DE102020211078A1 (de) * 2020-09-02 2022-03-03 Robert Bosch Gesellschaft mit beschränkter Haftung Steuervorrichtung, insbesondere Lenkungssteuervorrichtung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854268B2 (ja) * 1977-02-09 1983-12-03 株式会社日立製作所 無接点点火装置
DE3247985C2 (de) * 1982-12-24 1992-04-16 W.C. Heraeus Gmbh, 6450 Hanau Keramischer Träger
JPS60178652A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 回路基板
JPS617647A (ja) * 1984-06-21 1986-01-14 Toshiba Corp 回路基板

Also Published As

Publication number Publication date
WO1987004859A1 (en) 1987-08-13
EP0258295A1 (de) 1988-03-09
DE3604074A1 (de) 1987-08-13
AU6937187A (en) 1987-08-25

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