FR2327642A1 - Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant - Google Patents

Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant

Info

Publication number
FR2327642A1
FR2327642A1 FR7530527A FR7530527A FR2327642A1 FR 2327642 A1 FR2327642 A1 FR 2327642A1 FR 7530527 A FR7530527 A FR 7530527A FR 7530527 A FR7530527 A FR 7530527A FR 2327642 A1 FR2327642 A1 FR 2327642A1
Authority
FR
France
Prior art keywords
liquid
semiconductors
stack
immersed
metal casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7530527A
Other languages
English (en)
Other versions
FR2327642B1 (fr
Inventor
Michel Masselin
Bernard Legrand
Gilbert Vidal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cegelec SA
Original Assignee
Cegelec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cegelec SA filed Critical Cegelec SA
Priority to FR7530527A priority Critical patent/FR2327642A1/fr
Publication of FR2327642A1 publication Critical patent/FR2327642A1/fr
Application granted granted Critical
Publication of FR2327642B1 publication Critical patent/FR2327642B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7530527A 1975-10-06 1975-10-06 Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant Granted FR2327642A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7530527A FR2327642A1 (fr) 1975-10-06 1975-10-06 Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7530527A FR2327642A1 (fr) 1975-10-06 1975-10-06 Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant

Publications (2)

Publication Number Publication Date
FR2327642A1 true FR2327642A1 (fr) 1977-05-06
FR2327642B1 FR2327642B1 (fr) 1979-06-01

Family

ID=9160851

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7530527A Granted FR2327642A1 (fr) 1975-10-06 1975-10-06 Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant

Country Status (1)

Country Link
FR (1) FR2327642A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2477774A1 (fr) * 1980-03-04 1981-09-11 Alsthom Atlantique Traversee etanche d'une colonne de semiconducteurs de puissance disposee sans une enceinte
FR2477775A1 (fr) * 1980-03-04 1981-09-11 Alsthom Atlantique Dispositif pour le support des colonnes de semiconducteurs de puissance disposees dans une enceinte
FR2500959A1 (fr) * 1981-02-27 1982-09-03 Thomson Csf Boitier de dispositif electronique a forte dissipation thermique
EP0172554A2 (fr) * 1984-08-23 1986-02-26 Kabushiki Kaisha Toshiba Soupape à thyristor enfermée
TR22333A (tr) * 1983-12-14 1987-02-13 Licentia Gmbh Kapasite yari iletkenlerinin dogrudan dogruya kaynama sogutmasina mahsus duezen
FR2895589A1 (fr) * 2005-12-23 2007-06-29 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne.

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104802808B (zh) * 2015-05-25 2017-04-12 南车戚墅堰机车有限公司 螺栓连接式内燃机车减振冷却室结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2160997A1 (de) * 1971-11-24 1973-05-30 Bbc Brown Boveri & Cie Kuehlvorrichtung fuer eine halbleiteranordnung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2160997A1 (de) * 1971-11-24 1973-05-30 Bbc Brown Boveri & Cie Kuehlvorrichtung fuer eine halbleiteranordnung

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2477774A1 (fr) * 1980-03-04 1981-09-11 Alsthom Atlantique Traversee etanche d'une colonne de semiconducteurs de puissance disposee sans une enceinte
FR2477775A1 (fr) * 1980-03-04 1981-09-11 Alsthom Atlantique Dispositif pour le support des colonnes de semiconducteurs de puissance disposees dans une enceinte
FR2500959A1 (fr) * 1981-02-27 1982-09-03 Thomson Csf Boitier de dispositif electronique a forte dissipation thermique
TR22333A (tr) * 1983-12-14 1987-02-13 Licentia Gmbh Kapasite yari iletkenlerinin dogrudan dogruya kaynama sogutmasina mahsus duezen
EP0172554A2 (fr) * 1984-08-23 1986-02-26 Kabushiki Kaisha Toshiba Soupape à thyristor enfermée
EP0172554A3 (en) * 1984-08-23 1987-09-23 Kabushiki Kaisha Toshiba Enclosed thyristor valve
FR2895589A1 (fr) * 2005-12-23 2007-06-29 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne.
WO2007074289A2 (fr) * 2005-12-23 2007-07-05 Valeo Equipements Electriques Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne
WO2007074289A3 (fr) * 2005-12-23 2007-08-16 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne

Also Published As

Publication number Publication date
FR2327642B1 (fr) 1979-06-01

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Legal Events

Date Code Title Description
ST Notification of lapse