JPS57136354A - Heat dissipating device for electronic apparatus - Google Patents

Heat dissipating device for electronic apparatus

Info

Publication number
JPS57136354A
JPS57136354A JP2255681A JP2255681A JPS57136354A JP S57136354 A JPS57136354 A JP S57136354A JP 2255681 A JP2255681 A JP 2255681A JP 2255681 A JP2255681 A JP 2255681A JP S57136354 A JPS57136354 A JP S57136354A
Authority
JP
Japan
Prior art keywords
heat
transmitting plate
generating part
planary
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2255681A
Other languages
Japanese (ja)
Inventor
Kiyokazu Okamoto
Kan Adachi
Akira Fujii
Kunio Yamada
Koji Kawate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2255681A priority Critical patent/JPS57136354A/en
Publication of JPS57136354A publication Critical patent/JPS57136354A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To directly connect a heat generating part to a planary circuit for improved heat dissipation by a method wherein a flat heat transmitting plate a heat pipe provided with transmitting plate is furnished with a hole through which the heat generating part on the heat transmitting plate is connected with the planary circuit with leads. CONSTITUTION:A heat generating part 28 is mounted on a heat transmitting plate 23 provided with a finned heat pipe 21 via an insulating sheet 29 and an insulating bush 30. The heat transmitting plate 23 is furnished with a hole 24 that runs from the part mounting side through to the other side. After the whole heat transmitting plate 23 is mounted on a planary circuit substrate 15, leads can be taken out without electric contact with the heat transmitting plate 23, the leads 32 of the heat generating part being connected to the land 26 of the substrate 15 through the through hole 24. This setup realizes a compact system with the heat generating part 28 directly connected to the planary circuit substrate 15. The heat transmitting plate 23 and a heat pipe 21 contribute to a high efficiency dissipation of heat.
JP2255681A 1981-02-18 1981-02-18 Heat dissipating device for electronic apparatus Pending JPS57136354A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2255681A JPS57136354A (en) 1981-02-18 1981-02-18 Heat dissipating device for electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2255681A JPS57136354A (en) 1981-02-18 1981-02-18 Heat dissipating device for electronic apparatus

Publications (1)

Publication Number Publication Date
JPS57136354A true JPS57136354A (en) 1982-08-23

Family

ID=12086123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2255681A Pending JPS57136354A (en) 1981-02-18 1981-02-18 Heat dissipating device for electronic apparatus

Country Status (1)

Country Link
JP (1) JPS57136354A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331510A (en) * 1991-08-30 1994-07-19 Hitachi, Ltd. Electronic equipment and computer with heat pipe
US6152213A (en) * 1997-03-27 2000-11-28 Fujitsu Limited Cooling system for electronic packages

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331510A (en) * 1991-08-30 1994-07-19 Hitachi, Ltd. Electronic equipment and computer with heat pipe
US6152213A (en) * 1997-03-27 2000-11-28 Fujitsu Limited Cooling system for electronic packages
US6530419B1 (en) 1997-03-27 2003-03-11 Fujitsu Limited Cooling system for electronic packages

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