JPS5654047A - Compound semiconductor device - Google Patents
Compound semiconductor deviceInfo
- Publication number
- JPS5654047A JPS5654047A JP12971679A JP12971679A JPS5654047A JP S5654047 A JPS5654047 A JP S5654047A JP 12971679 A JP12971679 A JP 12971679A JP 12971679 A JP12971679 A JP 12971679A JP S5654047 A JPS5654047 A JP S5654047A
- Authority
- JP
- Japan
- Prior art keywords
- case
- gaas
- heat
- semiconductor device
- compound semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
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- H01L2224/04026—Bonding areas specifically adapted for layer connectors
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- H01L2224/29001—Core members of the layer connector
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- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/1025—Semiconducting materials
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- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
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- H01L2924/151—Die mounting substrate
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- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To improve the reliability and the performance of the compound semiconductor device with lowering of heat resistance by applying Au to the back of a GaAs pellet through at least one of Pt, W and Mo. CONSTITUTION:Ti 5, Pt 6 and Au 7 are continuously evaporated on the ground back of a GaAs substrate 4 having a source, a gate and a drain electrode 1-3 on the surface. The substrate is separated into pellets 8. While a case 9 is heated, the back of the pellets 8 is placed on an AuSi solder 10 fused in N2 until they are broken in sufficiently and then fixed in the case after cooled. Each electrode and the case 9 are connected and sealed with a ceramic cover. This enables more effective dissipation of heat them it would when the back is made of Au alone thereby significantly easing adverse effect on the micro wave characteristics and the reliability of a GaAs FET due to heat.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12971679A JPS5654047A (en) | 1979-10-08 | 1979-10-08 | Compound semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12971679A JPS5654047A (en) | 1979-10-08 | 1979-10-08 | Compound semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5654047A true JPS5654047A (en) | 1981-05-13 |
JPS6322060B2 JPS6322060B2 (en) | 1988-05-10 |
Family
ID=15016437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12971679A Granted JPS5654047A (en) | 1979-10-08 | 1979-10-08 | Compound semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5654047A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6144492A (en) * | 1985-07-22 | 1986-03-04 | Hitachi Ltd | Semiconductor device |
JPS6220338A (en) * | 1985-07-19 | 1987-01-28 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device |
EP0253691A2 (en) * | 1986-06-17 | 1988-01-20 | Fairchild Semiconductor Corporation | Silicon die bonding process |
JPH01149428A (en) * | 1987-12-07 | 1989-06-12 | Nec Corp | Semiconductor device |
JPH01299114A (en) * | 1988-04-29 | 1989-12-01 | Fael Sa | Guide apparatus for frame of box having non-circular section |
US5077599A (en) * | 1989-06-16 | 1991-12-31 | Sumitomo Electric Industries, Ltd. | Electrode structure for iii-v compound semiconductor element and method of manufacturing the same |
US5179041A (en) * | 1989-06-16 | 1993-01-12 | Sumitomo Electric Industries, Ltd. | Method for manufacturing an electrode structure for III-V compound semiconductor element |
US6577005B1 (en) * | 1997-11-27 | 2003-06-10 | Kabushiki Kaishia Toshiba | Fine protuberance structure and method of production thereof |
GB2427071B (en) * | 2005-06-07 | 2011-03-09 | Denso Corp | Semiconductor device having SiC substrate and method for manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5353256A (en) * | 1976-10-25 | 1978-05-15 | Mitsubishi Electric Corp | Semiconductor device |
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1979
- 1979-10-08 JP JP12971679A patent/JPS5654047A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5353256A (en) * | 1976-10-25 | 1978-05-15 | Mitsubishi Electric Corp | Semiconductor device |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6220338A (en) * | 1985-07-19 | 1987-01-28 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device |
JPS6144492A (en) * | 1985-07-22 | 1986-03-04 | Hitachi Ltd | Semiconductor device |
EP0253691A2 (en) * | 1986-06-17 | 1988-01-20 | Fairchild Semiconductor Corporation | Silicon die bonding process |
JPH01149428A (en) * | 1987-12-07 | 1989-06-12 | Nec Corp | Semiconductor device |
JPH01299114A (en) * | 1988-04-29 | 1989-12-01 | Fael Sa | Guide apparatus for frame of box having non-circular section |
US5077599A (en) * | 1989-06-16 | 1991-12-31 | Sumitomo Electric Industries, Ltd. | Electrode structure for iii-v compound semiconductor element and method of manufacturing the same |
US5179041A (en) * | 1989-06-16 | 1993-01-12 | Sumitomo Electric Industries, Ltd. | Method for manufacturing an electrode structure for III-V compound semiconductor element |
US6577005B1 (en) * | 1997-11-27 | 2003-06-10 | Kabushiki Kaishia Toshiba | Fine protuberance structure and method of production thereof |
GB2427071B (en) * | 2005-06-07 | 2011-03-09 | Denso Corp | Semiconductor device having SiC substrate and method for manufacturing the same |
Also Published As
Publication number | Publication date |
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JPS6322060B2 (en) | 1988-05-10 |
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