SE0950364L - Komponentbandsmatare - Google Patents

Komponentbandsmatare

Info

Publication number
SE0950364L
SE0950364L SE0950364A SE0950364A SE0950364L SE 0950364 L SE0950364 L SE 0950364L SE 0950364 A SE0950364 A SE 0950364A SE 0950364 A SE0950364 A SE 0950364A SE 0950364 L SE0950364 L SE 0950364L
Authority
SE
Sweden
Prior art keywords
module
component
input modules
electronic components
operably connected
Prior art date
Application number
SE0950364A
Other languages
English (en)
Other versions
SE534456C2 (sv
Inventor
Peter Davis
Dean Tarrant
Michael Summers
Original Assignee
Hover Davis Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hover Davis Inc filed Critical Hover Davis Inc
Publication of SE0950364L publication Critical patent/SE0950364L/sv
Publication of SE534456C2 publication Critical patent/SE534456C2/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • B65H5/32—Saddle-like members over which partially-unfolded sheets or signatures are fed to signature-gathering, stitching, or like machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F17/00—Coin-freed apparatus for hiring articles; Coin-freed facilities or services
    • G07F17/16—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for devices exhibiting advertisements, announcements, pictures or the like
    • G07F17/163—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for devices exhibiting advertisements, announcements, pictures or the like for film projection apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • B65H5/06—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • B65H5/28—Feeding articles stored in rolled or folded bands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Textile Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SE0950364A 2006-10-23 2007-09-21 Komponentbandsmatare SE534456C2 (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/551,934 US7850040B2 (en) 2006-10-23 2006-10-23 Component tape feeder
PCT/US2007/079128 WO2008051669A2 (en) 2006-10-23 2007-09-21 Component tape feeder

Publications (2)

Publication Number Publication Date
SE0950364L true SE0950364L (sv) 2009-05-22
SE534456C2 SE534456C2 (sv) 2011-08-30

Family

ID=39316959

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0950364A SE534456C2 (sv) 2006-10-23 2007-09-21 Komponentbandsmatare

Country Status (7)

Country Link
US (1) US7850040B2 (sv)
JP (1) JP4856761B2 (sv)
KR (1) KR101382485B1 (sv)
CN (1) CN101522547B (sv)
DE (1) DE112007002387B4 (sv)
SE (1) SE534456C2 (sv)
WO (1) WO2008051669A2 (sv)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8353424B2 (en) * 2009-01-27 2013-01-15 Hitachi High-Tech Instruments Co., Ltd. Component feeder
JP2010212681A (ja) * 2009-03-09 2010-09-24 Koshoku Kin 部品実装機用キャリアテープ自動供給装置
JP5538123B2 (ja) * 2010-08-03 2014-07-02 株式会社日立ハイテクインスツルメンツ フィーダ及び電子部品装着装置
JP5761941B2 (ja) * 2010-08-03 2015-08-12 ヤマハ発動機株式会社 フィーダ
JP2012069669A (ja) * 2010-09-22 2012-04-05 Fuji Mach Mfg Co Ltd テープフィーダ，部品供給装置および部品供給方法
JP5797087B2 (ja) * 2011-11-01 2015-10-21 富士機械製造株式会社 テープフィーダ
JP5748284B2 (ja) * 2011-11-01 2015-07-15 富士機械製造株式会社 テープフィーダ
JP5872969B2 (ja) * 2012-06-08 2016-03-01 ヤマハ発動機株式会社 部品供給装置及び表面実装機
JP6114509B2 (ja) * 2012-06-28 2017-04-12 ヤマハ発動機株式会社 部品供給装置及び部品実装装置
WO2014002911A1 (ja) 2012-06-29 2014-01-03 株式会社日立ハイテクインスツルメンツ フィーダ及びフィーダ制御方法並びに電子部品装着装置
JP5902569B2 (ja) * 2012-06-29 2016-04-13 ヤマハ発動機株式会社 電子部品の装着方法及びその装着装置
JP6033588B2 (ja) * 2012-06-29 2016-11-30 ヤマハ発動機株式会社 フィーダ及びフィーダ制御方法並びに電子部品装着装置
JP5985275B2 (ja) * 2012-06-29 2016-09-06 ヤマハ発動機株式会社 フィーダ制御方法及び電子部品装着装置
CN104663013B (zh) * 2012-08-27 2017-03-08 雅马哈发动机株式会社 元件供给装置及电子元件安装装置
KR101650789B1 (ko) 2012-09-28 2016-08-24 야마하하쓰도키 가부시키가이샤 부품 공급 유닛
JP5967542B2 (ja) * 2012-10-22 2016-08-10 パナソニックＩｐマネジメント株式会社 キャリアテープのトップテープ剥離装置および剥離方法
JP6004270B2 (ja) * 2012-12-25 2016-10-05 パナソニックＩｐマネジメント株式会社 カバーテープ剥離方法、および、テープフィーダ
CN104272893B (zh) 2013-02-15 2017-12-01 松下知识产权经营株式会社 部件供给装置及部件供给方法
JP5521129B1 (ja) * 2013-02-15 2014-06-11 パナソニック株式会社 部品供給装置および部品供給方法
JPWO2015029121A1 (ja) * 2013-08-26 2017-03-02 富士機械製造株式会社 部品供給装置
JP6097937B2 (ja) * 2014-01-27 2017-03-22 パナソニックＩｐマネジメント株式会社 部品照合方法および部品照合システム
JP6097938B2 (ja) * 2014-01-27 2017-03-22 パナソニックＩｐマネジメント株式会社 部品照合方法および部品照合システム
WO2016098235A1 (ja) * 2014-12-18 2016-06-23 富士機械製造株式会社 フィーダ
US9743569B2 (en) * 2015-01-06 2017-08-22 Panasonic Intellectual Property Management Co., Ltd. Electronic component supply apparatus
US11570940B2 (en) 2015-03-02 2023-01-31 Fuji Corporation Component mounting apparatus with feeder control device
JP6894021B2 (ja) * 2015-08-24 2021-06-23 株式会社Ｆｕｊｉ マルチフィーダ装置
DE102015120015B4 (de) 2015-11-18 2018-10-11 Asm Assembly Systems Gmbh & Co. Kg Abrüsten eines Bauelement-Gurtes von einer Bauelement-Zuführvorrichtung entgegen der Gurt-Transportrichtung
EP3393224B1 (en) * 2015-12-16 2021-05-19 Fuji Corporation Tape feeder
JP6707626B2 (ja) * 2016-03-30 2020-06-10 ヤマハ発動機株式会社 部品供給装置
KR102148146B1 (ko) 2016-09-01 2020-08-26 에스티에스 주식회사 진공 형성 구조를 가진 캐리어 테이프 피더 및 그에 의한 전자부품의 픽업 방법
JP6322257B2 (ja) * 2016-10-24 2018-05-09 ヤマハ発動機株式会社 電子部品装着装置及び電子部品装着装置における自動ローディング方法
JP6496908B2 (ja) * 2016-10-28 2019-04-10 パナソニックＩｐマネジメント株式会社 部品実装システム
JP6534049B2 (ja) * 2017-11-24 2019-06-26 パナソニックＩｐマネジメント株式会社 部品供給装置
JP6782468B2 (ja) * 2019-05-15 2020-11-11 パナソニックＩｐマネジメント株式会社 部品供給装置
JP6755372B2 (ja) * 2019-08-21 2020-09-16 株式会社Ｆｕｊｉ 部品種配置の最適化方法
JP6830186B2 (ja) * 2019-08-26 2021-02-17 パナソニックＩｐマネジメント株式会社 部品供給システムおよび部品供給方法
JP7164922B2 (ja) * 2020-02-05 2022-11-02 株式会社Fuji キャリアテープ装填方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4432481A (en) * 1982-06-14 1984-02-21 Owens-Illinois, Inc. Splice-in-register control
JPH07114319B2 (ja) * 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
US5259500A (en) * 1991-12-23 1993-11-09 Joseph Alvite Tape packaging system with removeable covers
JPH06302992A (ja) * 1993-04-14 1994-10-28 Toshiba Corp 部品実装機のカートリッジ構造及び部品実装機の管理システム
US5725140A (en) * 1996-09-09 1998-03-10 Amistar Corporation Tape feeder for a surface mount placement system
US6162007A (en) * 1999-01-14 2000-12-19 Witte; Stefan Apparatus for feeding electronic component tape
US6368045B1 (en) * 2000-04-05 2002-04-09 Delaware Capital Formation, Inc. Multiple index tape feeder and method
WO2002041681A1 (en) * 2000-11-14 2002-05-23 Koninklijke Philips Electronics N.V. Device for supplying electronic components to a pick-up position.
US6592217B2 (en) * 2001-03-16 2003-07-15 Canon Kabushiki Kaisha Recording apparatus
EP1626618B1 (en) * 2001-09-19 2011-11-30 Mydata Automation AB Tape guide, arrangement and system for guiding component tapes
JP3901030B2 (ja) * 2002-06-18 2007-04-04 松下電器産業株式会社 テープフィーダ
JP3994809B2 (ja) * 2002-07-09 2007-10-24 株式会社日立ハイテクノロジーズ 電子回路部品の打ち抜き装置及びその供給リール交換方法
WO2004026014A1 (ja) * 2002-09-12 2004-03-25 Matsushita Electric Industrial Co., Ltd. 部品供給装置及び部品供給方法
US6879869B2 (en) * 2003-03-28 2005-04-12 Accu-Assembly Incorporated Placement of electronic components

Also Published As

Publication number Publication date
CN101522547A (zh) 2009-09-02
KR101382485B1 (ko) 2014-04-08
WO2008051669A3 (en) 2008-07-03
US7850040B2 (en) 2010-12-14
JP4856761B2 (ja) 2012-01-18
JP2010507908A (ja) 2010-03-11
SE534456C2 (sv) 2011-08-30
KR20090068336A (ko) 2009-06-26
DE112007002387T5 (de) 2009-11-19
DE112007002387B4 (de) 2016-03-31
CN101522547B (zh) 2012-11-28
WO2008051669A2 (en) 2008-05-02
US20080093375A1 (en) 2008-04-24

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