RU2738440C1 - Устройство и способ изготовления устройства - Google Patents

Устройство и способ изготовления устройства Download PDF

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Publication number
RU2738440C1
RU2738440C1 RU2020103381A RU2020103381A RU2738440C1 RU 2738440 C1 RU2738440 C1 RU 2738440C1 RU 2020103381 A RU2020103381 A RU 2020103381A RU 2020103381 A RU2020103381 A RU 2020103381A RU 2738440 C1 RU2738440 C1 RU 2738440C1
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RU
Russia
Prior art keywords
substrate
electronic components
component
component substrate
components
Prior art date
Application number
RU2020103381A
Other languages
English (en)
Russian (ru)
Inventor
Мариус Иосиф БОАМФА
Францискус Антониус КНЕПКЕНС
Бастиан Вильгельмус Мария МУСКОПС
Рико ВЕРХАГЕН
Джонатан Аламбра ПАЛЕРО
Франк Антон ВАН АБЕЛЕН
Original Assignee
Конинклейке Филипс Н.В.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Конинклейке Филипс Н.В. filed Critical Конинклейке Филипс Н.В.
Application granted granted Critical
Publication of RU2738440C1 publication Critical patent/RU2738440C1/ru

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
RU2020103381A 2017-06-26 2018-06-21 Устройство и способ изготовления устройства RU2738440C1 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17177821.0 2017-06-26
EP17177821.0A EP3422826A1 (de) 2017-06-26 2017-06-26 Vorrichtung und verfahren zur herstellung einer vorrichtung
PCT/EP2018/066502 WO2019002059A1 (en) 2017-06-26 2018-06-21 APPARATUS AND METHOD FOR MANUFACTURING AN APPARATUS

Publications (1)

Publication Number Publication Date
RU2738440C1 true RU2738440C1 (ru) 2020-12-14

Family

ID=59257992

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2020103381A RU2738440C1 (ru) 2017-06-26 2018-06-21 Устройство и способ изготовления устройства

Country Status (6)

Country Link
US (1) US11482510B2 (de)
EP (2) EP3422826A1 (de)
JP (1) JP6741886B2 (de)
CN (1) CN110800380A (de)
RU (1) RU2738440C1 (de)
WO (1) WO2019002059A1 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594153B1 (en) * 2000-06-27 2003-07-15 Intel Corporation Circuit package for electronic systems
RU2546963C1 (ru) * 2013-10-21 2015-04-10 Юрий Иванович Сакуненко Устройство для отвода тепла от тепловыделяющих компонентов
RU2587810C2 (ru) * 2011-09-06 2016-06-27 Конинклейке Филипс Н.В. Способ изготовления платы с межкомпонентными соединениями

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133366A (ja) 2001-10-25 2003-05-09 Texas Instr Japan Ltd 半導体装置及びその製造方法
US6732905B2 (en) 2002-04-16 2004-05-11 Agilent Technologies, Inc. Vented cavity, hermetic solder seal
JP2005039064A (ja) * 2003-07-15 2005-02-10 Matsushita Electric Ind Co Ltd シート状基板および電子部品
JP5103012B2 (ja) 2003-08-18 2012-12-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 低強度光学発毛制御装置及び方法
US20060293728A1 (en) 2005-06-24 2006-12-28 Roersma Michiel E Device and method for low intensity optical hair growth control
JP2007027538A (ja) * 2005-07-20 2007-02-01 Orion Denki Kk 回路基板
US8414566B2 (en) 2008-03-07 2013-04-09 Koninklijke Philips Electronics N.V. Photo-epilation device
JP5659519B2 (ja) 2009-11-19 2015-01-28 豊田合成株式会社 発光装置、発光装置の製造方法、発光装置の実装方法及び光源装置
CN102339941A (zh) 2010-07-28 2012-02-01 展晶科技(深圳)有限公司 发光二极管封装结构及发光二极管模组
US8889485B2 (en) * 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
CN103828076B (zh) * 2011-08-01 2017-07-07 四国计测工业株式会社 半导体装置及其制造方法
US8925793B2 (en) * 2012-01-05 2015-01-06 Dunan Microstaq, Inc. Method for making a solder joint
KR101306247B1 (ko) * 2012-05-11 2013-09-17 (주)포인트엔지니어링 백라이트 유닛용 광소자 제조 방법 및 이에 의해 제조된 광소자와 그 어레이
TWI651871B (zh) * 2013-06-27 2019-02-21 晶元光電股份有限公司 發光組件及製作方法
KR102409963B1 (ko) * 2017-08-22 2022-06-15 삼성전자주식회사 솔더 범프를 구비한 반도체 발광소자 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594153B1 (en) * 2000-06-27 2003-07-15 Intel Corporation Circuit package for electronic systems
RU2587810C2 (ru) * 2011-09-06 2016-06-27 Конинклейке Филипс Н.В. Способ изготовления платы с межкомпонентными соединениями
RU2546963C1 (ru) * 2013-10-21 2015-04-10 Юрий Иванович Сакуненко Устройство для отвода тепла от тепловыделяющих компонентов

Also Published As

Publication number Publication date
EP3613265B1 (de) 2020-08-05
JP6741886B2 (ja) 2020-08-19
EP3613265A1 (de) 2020-02-26
WO2019002059A1 (en) 2019-01-03
CN110800380A (zh) 2020-02-14
US20210134764A1 (en) 2021-05-06
JP2020524409A (ja) 2020-08-13
EP3422826A1 (de) 2019-01-02
US11482510B2 (en) 2022-10-25

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