JP6741886B2 - 装置及び装置を製造するための方法 - Google Patents
装置及び装置を製造するための方法 Download PDFInfo
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- JP6741886B2 JP6741886B2 JP2019570133A JP2019570133A JP6741886B2 JP 6741886 B2 JP6741886 B2 JP 6741886B2 JP 2019570133 A JP2019570133 A JP 2019570133A JP 2019570133 A JP2019570133 A JP 2019570133A JP 6741886 B2 JP6741886 B2 JP 6741886B2
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- 238000000034 method Methods 0.000 title claims description 76
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 claims description 184
- 239000000470 constituent Substances 0.000 claims description 66
- 229910000679 solder Inorganic materials 0.000 claims description 63
- 238000005476 soldering Methods 0.000 claims description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 238000001020 plasma etching Methods 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 2
- 238000009760 electrical discharge machining Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 230000003779 hair growth Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
Claims (15)
- ベース基板と、
少なくとも2つの電子部品が配置された構成基板と、
を有し、
前記構成基板の厚さ全体に亘って少なくとも1つの開口が形成され、前記少なくとも1つの開口は、前記少なくとも2つの電子部品の間の空間に形成され、
前記構成基板は、はんだ接合を用いて前記ベース基板に結合された、装置。 - 前記少なくとも2つの電子部品のそれぞれは、発光ダイオード素子を有する、請求項1に記載の装置。
- 前記少なくとも1つの開口は、前記構成基板の厚さと少なくとも等しい幅を持つ、請求項1又は2に記載の装置。
- 前記少なくとも1つの開口は、50マイクロメートルと300マイクロメートルとの間の幅を持つ、請求項1乃至3のいずれか一項に記載の装置。
- 前記少なくとも1つの開口はスリットを有する、請求項1乃至4のいずれか一項に記載の装置。
- 前記構成基板はシリコン基板を有する、請求項1乃至5のいずれか一項に記載の装置。
- 前記構成基板の厚さ全体に亘って複数の開口が形成され、前記複数の開口は、前記少なくとも2つの電子部品の間の空間において少なくとも一本の略直線上に配置された、請求項1乃至6のいずれか一項に記載の装置。
- それぞれがはんだ接合により前記ベース基板に結合され、それぞれが発光ダイオード素子のアレイを配置された、構成基板のアレイを有し、各前記構成基板において、前記発光ダイオード素子の間の複数の空間において前記構成基板の厚さ全体に亘り複数の開口が形成された、請求項2に記載の装置。
- 請求項1乃至8のいずれか一項に記載の装置を持つ処置光源を有する、パーソナルケア装置。
- 前記パーソナルケア装置は皮膚処置装置又は毛処置装置である、請求項9に記載のパーソナルケア装置。
- 請求項1乃至10のいずれか一項に記載の装置を製造する方法であって、
ベース基板を備えるステップと、
構成基板を備えるステップと、
前記構成基板上に少なくとも2つの電子部品を配置するステップと、
前記少なくとも2つの電子部品の間の空間において前記構成基板の厚さ全体に亘って少なくとも1つの開口を形成するステップと、
前記構成基板と前記ベース基板との間にはんだ接合を形成するステップと、
を有する方法。 - 前記少なくとも1つの開口を形成するステップは、ウェットプラズマエッチング工程、ドライプラズマエッチング工程、レーザ切断工程、超音波穿孔工程、機械穿孔工程、高圧水穿孔工程又は切断工程、サンドブラスト工程、研磨ウォータージェット加工工程、及び放電加工工程のうち少なくとも1つを用いて前記少なくとも1つの開口を形成するステップを有する、請求項11に記載の方法。
- 前記はんだ接合を形成するステップは、リフローはんだ付け工程を用いてはんだ接合を形成するステップを有する、請求項11又は12に記載の方法。
- 前記少なくとも1つの開口を形成するステップは、リソグラフィー沈着工程又は構成基板を切り取る工程の間に実行される、請求項11乃至13のいずれか一項に記載の方法。
- 前記少なくとも2つの電子部品のそれぞれは、発光ダイオード素子を有する、請求項11乃至14のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17177821.0 | 2017-06-26 | ||
EP17177821.0A EP3422826A1 (en) | 2017-06-26 | 2017-06-26 | An apparatus and a method of manufacturing an apparatus |
PCT/EP2018/066502 WO2019002059A1 (en) | 2017-06-26 | 2018-06-21 | APPARATUS AND METHOD FOR MANUFACTURING AN APPARATUS |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020524409A JP2020524409A (ja) | 2020-08-13 |
JP6741886B2 true JP6741886B2 (ja) | 2020-08-19 |
Family
ID=59257992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019570133A Expired - Fee Related JP6741886B2 (ja) | 2017-06-26 | 2018-06-21 | 装置及び装置を製造するための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11482510B2 (ja) |
EP (2) | EP3422826A1 (ja) |
JP (1) | JP6741886B2 (ja) |
CN (1) | CN110800380A (ja) |
RU (1) | RU2738440C1 (ja) |
WO (1) | WO2019002059A1 (ja) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6594153B1 (en) * | 2000-06-27 | 2003-07-15 | Intel Corporation | Circuit package for electronic systems |
JP2003133366A (ja) | 2001-10-25 | 2003-05-09 | Texas Instr Japan Ltd | 半導体装置及びその製造方法 |
US6732905B2 (en) | 2002-04-16 | 2004-05-11 | Agilent Technologies, Inc. | Vented cavity, hermetic solder seal |
JP2005039064A (ja) * | 2003-07-15 | 2005-02-10 | Matsushita Electric Ind Co Ltd | シート状基板および電子部品 |
JP5103012B2 (ja) | 2003-08-18 | 2012-12-19 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 低強度光学発毛制御装置及び方法 |
US20060293728A1 (en) | 2005-06-24 | 2006-12-28 | Roersma Michiel E | Device and method for low intensity optical hair growth control |
JP2007027538A (ja) * | 2005-07-20 | 2007-02-01 | Orion Denki Kk | 回路基板 |
US8414566B2 (en) | 2008-03-07 | 2013-04-09 | Koninklijke Philips Electronics N.V. | Photo-epilation device |
JP5659519B2 (ja) | 2009-11-19 | 2015-01-28 | 豊田合成株式会社 | 発光装置、発光装置の製造方法、発光装置の実装方法及び光源装置 |
CN102339941A (zh) | 2010-07-28 | 2012-02-01 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及发光二极管模组 |
US8889485B2 (en) * | 2011-06-08 | 2014-11-18 | Semprius, Inc. | Methods for surface attachment of flipped active componenets |
CN103828076B (zh) * | 2011-08-01 | 2017-07-07 | 四国计测工业株式会社 | 半导体装置及其制造方法 |
US8925793B2 (en) * | 2012-01-05 | 2015-01-06 | Dunan Microstaq, Inc. | Method for making a solder joint |
KR101306247B1 (ko) * | 2012-05-11 | 2013-09-17 | (주)포인트엔지니어링 | 백라이트 유닛용 광소자 제조 방법 및 이에 의해 제조된 광소자와 그 어레이 |
TWI651871B (zh) * | 2013-06-27 | 2019-02-21 | 晶元光電股份有限公司 | 發光組件及製作方法 |
RU2546963C1 (ru) * | 2013-10-21 | 2015-04-10 | Юрий Иванович Сакуненко | Устройство для отвода тепла от тепловыделяющих компонентов |
KR102409963B1 (ko) * | 2017-08-22 | 2022-06-15 | 삼성전자주식회사 | 솔더 범프를 구비한 반도체 발광소자 패키지 |
-
2017
- 2017-06-26 EP EP17177821.0A patent/EP3422826A1/en not_active Withdrawn
-
2018
- 2018-06-21 WO PCT/EP2018/066502 patent/WO2019002059A1/en unknown
- 2018-06-21 EP EP18734504.6A patent/EP3613265B1/en active Active
- 2018-06-21 CN CN201880043634.1A patent/CN110800380A/zh active Pending
- 2018-06-21 JP JP2019570133A patent/JP6741886B2/ja not_active Expired - Fee Related
- 2018-06-21 US US16/617,018 patent/US11482510B2/en active Active
- 2018-06-21 RU RU2020103381A patent/RU2738440C1/ru active
Also Published As
Publication number | Publication date |
---|---|
EP3613265B1 (en) | 2020-08-05 |
RU2738440C1 (ru) | 2020-12-14 |
EP3613265A1 (en) | 2020-02-26 |
WO2019002059A1 (en) | 2019-01-03 |
CN110800380A (zh) | 2020-02-14 |
US20210134764A1 (en) | 2021-05-06 |
JP2020524409A (ja) | 2020-08-13 |
EP3422826A1 (en) | 2019-01-02 |
US11482510B2 (en) | 2022-10-25 |
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