RU2490837C2 - Способ монтажа микроэлектронных компонентов - Google Patents

Способ монтажа микроэлектронных компонентов Download PDF

Info

Publication number
RU2490837C2
RU2490837C2 RU2011143150/07A RU2011143150A RU2490837C2 RU 2490837 C2 RU2490837 C2 RU 2490837C2 RU 2011143150/07 A RU2011143150/07 A RU 2011143150/07A RU 2011143150 A RU2011143150 A RU 2011143150A RU 2490837 C2 RU2490837 C2 RU 2490837C2
Authority
RU
Russia
Prior art keywords
microelectronic components
polymer
microelectronic
height
mounting
Prior art date
Application number
RU2011143150/07A
Other languages
English (en)
Russian (ru)
Other versions
RU2011143150A (ru
Inventor
Хироки МИЯДЗАКИ
Original Assignee
Шарп Кабусики Кайся
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Шарп Кабусики Кайся filed Critical Шарп Кабусики Кайся
Publication of RU2011143150A publication Critical patent/RU2011143150A/ru
Application granted granted Critical
Publication of RU2490837C2 publication Critical patent/RU2490837C2/ru

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
    • H01L2224/2733—Manufacturing methods by local deposition of the material of the layer connector in solid form
    • H01L2224/27334—Manufacturing methods by local deposition of the material of the layer connector in solid form using preformed layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
RU2011143150/07A 2009-03-26 2009-11-04 Способ монтажа микроэлектронных компонентов RU2490837C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-075336 2009-03-26
JP2009075336 2009-03-26
PCT/JP2009/068787 WO2010109718A1 (fr) 2009-03-26 2009-11-04 Structure de montage de composants de type puce, procédé de montage de composants de type puce et dispositif d'affichage à cristaux liquides

Publications (2)

Publication Number Publication Date
RU2011143150A RU2011143150A (ru) 2013-05-10
RU2490837C2 true RU2490837C2 (ru) 2013-08-20

Family

ID=42780421

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2011143150/07A RU2490837C2 (ru) 2009-03-26 2009-11-04 Способ монтажа микроэлектронных компонентов

Country Status (6)

Country Link
US (1) US8692968B2 (fr)
EP (1) EP2413676A4 (fr)
JP (1) JP5285144B2 (fr)
CN (1) CN102342189B (fr)
RU (1) RU2490837C2 (fr)
WO (1) WO2010109718A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2571880C1 (ru) * 2015-01-30 2015-12-27 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" Способ монтажа микроэлектронных компонентов

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6206021B2 (ja) * 2013-09-12 2017-10-04 三菱電機株式会社 電力用半導体装置の製造方法および電力用半導体装置
JP2018531411A (ja) * 2015-12-11 2018-10-25 シェンジェン ロイオル テクノロジーズ カンパニー リミテッドＳｈｅｎｚｈｅｎ Ｒｏｙｏｌｅ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．， Ｌｔｄ． フレキシブルディスプレイモジュールのボンディング方法
US10147702B2 (en) * 2016-10-24 2018-12-04 Palo Alto Research Center Incorporated Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste
CN109920335A (zh) * 2019-04-16 2019-06-21 鸿创柔幕光电科技有限公司 Cof柔性显示屏

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2120651C1 (ru) * 1996-04-15 1998-10-20 Поларайзер Интернэшнл, ЛЛСи Жидкокристаллический индикаторный элемент
US5930603A (en) * 1996-12-02 1999-07-27 Fujitsu Limited Method for producing a semiconductor device
RU2208267C2 (ru) * 1998-06-02 2003-07-10 Тин Филм Электроникс Аса Устройство хранения и обработки данных и способ его изготовления
RU2226293C2 (ru) * 2001-10-02 2004-03-27 ОПТИВА, Инк. Панель дисплея и многослойная пластина для ее изготовления

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5858806A (en) 1995-03-24 1999-01-12 Matsushita Electric Industrial Co., Ltd. Method of bonding IC component to flat panel display
EP1448033A1 (fr) * 1996-12-27 2004-08-18 Matsushita Electric Industrial Co., Ltd. Procedé et dispositif pour monter des composants électroniques sur une plaquette de circuit
JP3663931B2 (ja) * 1998-08-25 2005-06-22 セイコーエプソン株式会社 圧着方法、圧着装置及び液晶表示装置の製造方法
JP2001015551A (ja) * 1999-06-29 2001-01-19 Toshiba Corp 半導体装置およびその製造方法
US6853087B2 (en) * 2000-09-19 2005-02-08 Nanopierce Technologies, Inc. Component and antennae assembly in radio frequency identification devices
CN1319140C (zh) * 2001-09-12 2007-05-30 日机装株式会社 电路元件安装方法
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Ind Co Ltd Module with built-in components and the manufacturing method thereof
JP2004273853A (ja) * 2003-03-10 2004-09-30 Matsushita Electric Ind Co Ltd 樹脂層付チップ部品とそれを用いた部品内蔵モジュール及びそれらの製造方法
JP3891133B2 (ja) * 2003-03-26 2007-03-14 セイコーエプソン株式会社 電子部品の製造方法および電子部品の実装方法
WO2006112383A1 (fr) * 2005-04-14 2006-10-26 Matsushita Electric Industrial Co., Ltd. Dispositif de circuit électronique et son procédé de fabrication
US8291582B2 (en) * 2006-02-13 2012-10-23 Panasonic Corporation Circuit board and process for producing the same
JP4902229B2 (ja) 2006-03-07 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2120651C1 (ru) * 1996-04-15 1998-10-20 Поларайзер Интернэшнл, ЛЛСи Жидкокристаллический индикаторный элемент
US5930603A (en) * 1996-12-02 1999-07-27 Fujitsu Limited Method for producing a semiconductor device
RU2208267C2 (ru) * 1998-06-02 2003-07-10 Тин Филм Электроникс Аса Устройство хранения и обработки данных и способ его изготовления
RU2226293C2 (ru) * 2001-10-02 2004-03-27 ОПТИВА, Инк. Панель дисплея и многослойная пластина для ее изготовления

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2571880C1 (ru) * 2015-01-30 2015-12-27 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" Способ монтажа микроэлектронных компонентов

Also Published As

Publication number Publication date
US8692968B2 (en) 2014-04-08
EP2413676A4 (fr) 2013-03-27
CN102342189B (zh) 2014-03-19
CN102342189A (zh) 2012-02-01
US20120008064A1 (en) 2012-01-12
JP5285144B2 (ja) 2013-09-11
WO2010109718A1 (fr) 2010-09-30
JPWO2010109718A1 (ja) 2012-09-27
RU2011143150A (ru) 2013-05-10
EP2413676A1 (fr) 2012-02-01

Similar Documents

Publication Publication Date Title
EP1763295A2 (fr) Panneau avec des composants enterrés et méthode de fabrication associée
KR100242613B1 (ko) 액정장치, 액정장치의 제조 방법 및 전자기기
US8497432B2 (en) Electronic component mounting structure
KR100747336B1 (ko) 이방성 도전 필름을 이용한 회로기판의 접속 구조체, 이를위한 제조 방법 및 이를 이용한 접속 상태 평가방법
RU2490837C2 (ru) Способ монтажа микроэлектронных компонентов
WO2020006999A1 (fr) Panneau d'affichage et appareil d'affichage
KR20060044486A (ko) 반도체 장치 및 그 제조 방법과, 상기 반도체 장치를 구비한 액정 모듈 및 반도체 모듈
CN101316485A (zh) 电子元器件组件及电子元器件组件的制造方法
JP5125314B2 (ja) 電子装置
KR100551388B1 (ko) 회로기판의평탄화방법및반도체장치의제조방법
KR101525158B1 (ko) 인쇄회로기판 조립체 및 그 제조방법
US8227914B2 (en) Mounting structure of electronic component
JP4133756B2 (ja) プリント配線基板の接続方法
KR101272625B1 (ko) 터치 패널용 패드와 기판의 결합체
JP3743716B2 (ja) フレキシブル配線基板及び半導体素子の実装方法
JPH06314866A (ja) フレキシブル基板およびその接続方法
JP2004193277A (ja) 配線基板およびこれを有する電子回路素子
JP3813766B2 (ja) プリント配線基板の接続構造
JP3054944B2 (ja) 表示装置の製造方法
KR100807352B1 (ko) 전극 패드 상에 다수 개의 돌기부들을 구비하는 전극, 이를 구비하는 부품 실장 구조를 갖는 전자기기 및 전자기기의 부품 실장 방법
KR20070030700A (ko) 전자 부품 내장 기판 및 그 제조 방법
JP4484750B2 (ja) 配線基板およびそれを備えた電子回路素子ならびに表示装置
JP5485510B2 (ja) 電子デバイス、電子機器、及び電子デバイスの製造方法
US20120188733A1 (en) Substrate mounting structure, display device equipped therewith, and substrate mounting method
KR100646068B1 (ko) 이방성 도전 필름

Legal Events

Date Code Title Description
MM4A The patent is invalid due to non-payment of fees

Effective date: 20151105