RU2374363C2 - Усовершенствованное гальванопокрытие металлической полосы - Google Patents

Усовершенствованное гальванопокрытие металлической полосы Download PDF

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Publication number
RU2374363C2
RU2374363C2 RU2006126703/02A RU2006126703A RU2374363C2 RU 2374363 C2 RU2374363 C2 RU 2374363C2 RU 2006126703/02 A RU2006126703/02 A RU 2006126703/02A RU 2006126703 A RU2006126703 A RU 2006126703A RU 2374363 C2 RU2374363 C2 RU 2374363C2
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RU
Russia
Prior art keywords
tin
anode
strip
anodes
fraction
Prior art date
Application number
RU2006126703/02A
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English (en)
Russian (ru)
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RU2006126703A (ru
Inventor
Кокки ШНЕТЦ (NL)
Кокки ШНЕТЦ
ВРЕГД Даниель Адриан ДЕ (NL)
ВРЕГД Даниель Адриан ДЕ
Эрик Боб ВЕЙНБЕК (NL)
Эрик Боб ВЕЙНБЕК
Жак Хюберт Ольга Йозеф ВЕЙЕНБЕРГ (NL)
Жак Хюберт Ольга Йозеф ВЕЙЕНБЕРГ
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Корус Стал Бв
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Application filed by Корус Стал Бв filed Critical Корус Стал Бв
Publication of RU2006126703A publication Critical patent/RU2006126703A/ru
Application granted granted Critical
Publication of RU2374363C2 publication Critical patent/RU2374363C2/ru

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
RU2006126703/02A 2003-12-23 2004-12-23 Усовершенствованное гальванопокрытие металлической полосы RU2374363C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03078988.7 2003-12-23
EP03078988 2003-12-23

Publications (2)

Publication Number Publication Date
RU2006126703A RU2006126703A (ru) 2008-01-27
RU2374363C2 true RU2374363C2 (ru) 2009-11-27

Family

ID=34717202

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2006126703/02A RU2374363C2 (ru) 2003-12-23 2004-12-23 Усовершенствованное гальванопокрытие металлической полосы

Country Status (15)

Country Link
US (1) US20070227632A1 (ja)
EP (1) EP1699949B1 (ja)
JP (1) JP2007515557A (ja)
KR (1) KR20060127076A (ja)
CN (1) CN1918328A (ja)
AT (1) ATE435933T1 (ja)
AU (1) AU2004309087B2 (ja)
BR (1) BRPI0418111A (ja)
CA (1) CA2551273A1 (ja)
DE (1) DE602004021961D1 (ja)
ES (1) ES2327239T3 (ja)
MX (1) MXPA06007170A (ja)
PT (1) PT1699949E (ja)
RU (1) RU2374363C2 (ja)
WO (1) WO2005064043A2 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4902346B2 (ja) * 2006-12-28 2012-03-21 Ｊｆｅスチール株式会社 Ｓｎメッキ用電極支持体及びその使用方法
FR2918674B1 (fr) * 2007-07-12 2010-10-01 Siemens Vai Metals Tech Sas Installation et procede pour l'etamage electrolytique de bandes d'acier mettant en oeuvre une anode soluble
JP5884169B2 (ja) * 2012-03-01 2016-03-15 Ｊｆｅスチール株式会社 電気めっき鋼板の製造ラインの自溶性電極の消費量自動監視システム及び方法
JP5900213B2 (ja) * 2012-07-18 2016-04-06 Ｊｆｅスチール株式会社 電気めっき鋼板の製造装置
JP6084112B2 (ja) * 2013-05-09 2017-02-22 株式会社荏原製作所 Ｓｎ合金めっき装置およびＳｎ合金めっき方法
WO2015011130A1 (en) * 2013-07-26 2015-01-29 Tata Steel Ijmuiden B.V. Anode system for use in an electroplating cell for the coating of a moving metal strip and a method using said anode system
JP6233334B2 (ja) * 2015-03-04 2017-11-22 Ｊｆｅスチール株式会社 方向性電磁鋼帯の連続電解エッチング方法および方向性電磁鋼帯の連続電解エッチング装置
CN105696059B (zh) * 2016-02-02 2018-03-06 上海大学 磁场下高强高导铜‑纳米碳管复合材料的制备方法及装置
CN107740173B (zh) * 2017-09-15 2020-12-15 首钢京唐钢铁联合有限责任公司 一种高锡量镀锡板的边部质量控制方法
EP3540098A3 (en) 2018-03-16 2019-11-06 Airbus Defence and Space GmbH Apparatus and method for the continuous metallization of an object
EP3763850A1 (en) 2019-07-10 2021-01-13 Tata Steel IJmuiden B.V. Anode and method for electrolytically depositing a metal layer onto a metal substrate
CN214612819U (zh) * 2021-03-25 2021-11-05 宁德时代新能源科技股份有限公司 一种过滤机构及用于生产导电材料的设备
CN116516445A (zh) * 2022-11-28 2023-08-01 粤海中粤(中山)马口铁工业有限公司 可溶性阳极的边部屏蔽装置及方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE20788E (en) * 1930-02-04 1938-07-12 Method of plating steel
US2690424A (en) * 1950-11-20 1954-09-28 Nat Steel Corp Apparatus for reduction of heavy edge coating in electroplating
US2719820A (en) * 1951-01-26 1955-10-04 United States Steel Corp Method for coating steel strip
US3300396A (en) * 1965-11-24 1967-01-24 Charles T Walker Electroplating techniques and anode assemblies therefor
US4164454A (en) * 1977-11-01 1979-08-14 Borg-Warner Corporation Continuous line for plating on metal strip material
US4367125A (en) * 1979-03-21 1983-01-04 Republic Steel Corporation Apparatus and method for plating metallic strip
JPS62151593A (ja) * 1985-12-25 1987-07-06 Nippon Kokan Kk <Nkk> 金属ストリツプの連続電気メツキ装置
JPH01159400A (ja) * 1987-12-16 1989-06-22 Kawasaki Steel Corp 電気錫めっき装置
NL8801511A (nl) * 1988-06-14 1990-01-02 Hoogovens Groep Bv Werkwijze voor het elektrolytisch bekleden van een metalen substraat met een metalen bekledingslaag.
JPH0459997A (ja) * 1990-06-27 1992-02-26 Kawasaki Steel Corp 金属ストリップの電解処理装置および電解処理方法
US5454929A (en) * 1994-06-16 1995-10-03 National Semiconductor Corporation Process for preparing solderable integrated circuit lead frames by plating with tin and palladium
FR2725215B1 (fr) * 1994-09-29 1996-11-22 Lorraine Laminage Cellule d'electrodeposition en continu d'alliages metalliques
JPH08313223A (ja) * 1995-05-16 1996-11-29 Ls Electro Galvanizing Co 移動ストリップを監視する方法と装置
US6280596B1 (en) * 1995-05-23 2001-08-28 Weirton Steel Corporation Electrolytic tinplating of steel substrate and apparatus
JPH0971894A (ja) * 1995-09-01 1997-03-18 Kawasaki Steel Corp 鋼帯の電気メッキ方法
JP3103753B2 (ja) * 1995-10-13 2000-10-30 株式会社イデヤ 帯状部材のめっき装置
US5804053A (en) * 1995-12-07 1998-09-08 Eltech Systems Corporation Continuously electroplated foam of improved weight distribution
JP3528453B2 (ja) * 1996-08-23 2004-05-17 Ｊｆｅスチール株式会社 金属ストリップの片面連続電気めっき装置
US5776327A (en) * 1996-10-16 1998-07-07 Mitsubishi Semiconuctor Americe, Inc. Method and apparatus using an anode basket for electroplating a workpiece

Also Published As

Publication number Publication date
EP1699949B1 (en) 2009-07-08
EP1699949A2 (en) 2006-09-13
ATE435933T1 (de) 2009-07-15
DE602004021961D1 (de) 2009-08-20
WO2005064043A2 (en) 2005-07-14
RU2006126703A (ru) 2008-01-27
BRPI0418111A (pt) 2007-04-17
CN1918328A (zh) 2007-02-21
MXPA06007170A (es) 2006-09-04
KR20060127076A (ko) 2006-12-11
AU2004309087A1 (en) 2005-07-14
CA2551273A1 (en) 2005-07-14
JP2007515557A (ja) 2007-06-14
ES2327239T3 (es) 2009-10-27
WO2005064043A3 (en) 2005-09-09
US20070227632A1 (en) 2007-10-04
AU2004309087B2 (en) 2009-10-22
PT1699949E (pt) 2009-08-03

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MM4A The patent is invalid due to non-payment of fees

Effective date: 20101224