RU2016124648A - Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления - Google Patents
Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления Download PDFInfo
- Publication number
- RU2016124648A RU2016124648A RU2016124648A RU2016124648A RU2016124648A RU 2016124648 A RU2016124648 A RU 2016124648A RU 2016124648 A RU2016124648 A RU 2016124648A RU 2016124648 A RU2016124648 A RU 2016124648A RU 2016124648 A RU2016124648 A RU 2016124648A
- Authority
- RU
- Russia
- Prior art keywords
- amorphous silicon
- temperature
- low
- thin film
- layer
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title claims 12
- 238000004519 manufacturing process Methods 0.000 title claims 7
- 238000000034 method Methods 0.000 title claims 7
- 238000004140 cleaning Methods 0.000 title claims 6
- 239000004973 liquid crystal related substance Substances 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 15
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 13
- 229920005591 polysilicon Polymers 0.000 claims 13
- 238000010438 heat treatment Methods 0.000 claims 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 4
- 238000002203 pretreatment Methods 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000005224 laser annealing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02499—Monolayers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02592—Microstructure amorphous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
- H01L21/02661—In-situ cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Recrystallisation Techniques (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Claims (20)
1. Способ предварительной очистки тонкой пленки низкотемпературного поликремния, который включает: нагрев слоя аморфного кремния до температуры выше комнатной и выполнение предварительной очистки поверхности слоя аморфного кремния.
2. Способ предварительной очистки тонкой пленки низкотемпературного поликремния по п. 1, отличающийся тем, что нагрев слоя аморфного кремния доводит температуру слоя аморфного кремния до 25°-40°.
3. Способ получения тонкой пленки низкотемпературного поликремния, который включает:
этап 1: выращивание буферного слоя и затем слоя аморфного кремния на подложке;
этап 2: нагрев слоя аморфного кремния до температуры выше комнатной и выполнение предварительной очистки поверхности слоя аморфного кремния;
этап 3: использование отжига эксимерным лазером (ELA) для облучения предварительно очищенного слоя аморфного кремния на этапе 2, чтобы преобразовать аморфный кремний в поликремний.
4. Способ получения тонкой пленки низкотемпературного поликремния по п. 3, отличающийся тем, что температура слоя аморфного кремния на этапе 2 составляет 25°-40°.
5. Способ получения тонкой пленки низкотемпературного поликремния по п. 4, отличающийся тем, что слой аморфного кремния на этапе 2 включает первую часть относительно большей толщины и вторую часть относительно меньшей толщины, и температура нагрева первой части выше температуры нагрева второй части.
6. Способ получения тонкой пленки низкотемпературного поликремния по п. 3, отличающийся тем, что очиститель, применяемый для предварительной очистки, является водным раствором плавиковой кислоты в концентрации 1-3%.
7. Способ получения тонкой пленки низкотемпературного поликремния по п. 5, отличающийся тем, что плавиковую кислоту применяют в течение 45-60 с при расходе 40-60 литров в минуту (л/мин) в ходе предварительной очистки.
8. Система для изготовления тонкой пленки низкотемпературного поликремния, которая включает:
рабочий стол;
аппарат для эпитаксиального выращивания, расположенный над рабочим столом и приспособленный для обеспечения выращивания слоя аморфного кремния;
эксимерный лазер, расположенный над рабочим столом, предназначенный для преобразования слоя аморфного кремния в слой поликремния; а также включающая:
аппарат для предварительной очистки, расположенный над рабочим столом и предназначенный для выполнения предварительной очистки слоя аморфного кремния, и
устройство для регулировки температуры, расположенное на рабочем столе и предназначенное для выполнения нагрева слоя аморфного кремния.
9. Система для изготовления тонкой пленки низкотемпературного поликремния по п. 8, отличающаяся тем, что аппарат для предварительной очистки включает несколько равномерно распределенных форсунок.
10. Система для изготовления тонкой пленки низкотемпературного поликремния по п. 8, отличающаяся тем, что устройство для регулировки температуры включает несколько равномерно распределенных
средств нагрева, и каждое из средств нагрева включает независимые термостат и устройство для контроля температуры.
11. Система для изготовления тонкой пленки низкотемпературного поликремния по п. 10, отличающаяся тем, что средством нагрева является блок сопротивления или провод высокого сопротивления.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310728592.4A CN103681244B (zh) | 2013-12-25 | 2013-12-25 | 低温多晶硅薄膜的制备方法及其制作系统 |
CN201310728592.4 | 2013-12-25 | ||
PCT/CN2013/090627 WO2015096113A1 (zh) | 2013-12-25 | 2013-12-27 | 低温多晶硅薄膜的预清洗方法及其制备方法、制作系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
RU2016124648A true RU2016124648A (ru) | 2017-12-26 |
RU2647561C2 RU2647561C2 (ru) | 2018-03-16 |
Family
ID=50318455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2016124648A RU2647561C2 (ru) | 2013-12-25 | 2013-12-27 | Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления |
Country Status (8)
Country | Link |
---|---|
US (1) | US9287108B2 (ru) |
JP (1) | JP6286547B2 (ru) |
KR (1) | KR101944598B1 (ru) |
CN (1) | CN103681244B (ru) |
DE (1) | DE112013007733T5 (ru) |
GB (1) | GB2535369B (ru) |
RU (1) | RU2647561C2 (ru) |
WO (1) | WO2015096113A1 (ru) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104037060B (zh) * | 2014-05-14 | 2017-06-30 | 京东方科技集团股份有限公司 | 多晶金属氧化物图形的制备方法 |
CN104597609A (zh) | 2015-02-06 | 2015-05-06 | 京东方科技集团股份有限公司 | 像素阵列、显示装置以及显示方法 |
CN106024707B (zh) * | 2016-08-10 | 2018-11-13 | 昆山国显光电有限公司 | 阵列基板及其制备方法 |
CN106981416B (zh) * | 2017-05-17 | 2019-11-26 | 武汉华星光电技术有限公司 | 利用准分子激光退火制作低温多晶硅的系统及其承载装置 |
CN107275198B (zh) * | 2017-05-31 | 2020-03-10 | 昆山国显光电有限公司 | 激光退火方法及激光退火系统 |
WO2018232698A1 (zh) * | 2017-06-22 | 2018-12-27 | 深圳市柔宇科技有限公司 | 阵列基板的制作设备及阵列基板的制作方法 |
CN108155118A (zh) * | 2017-12-06 | 2018-06-12 | 中建材浚鑫科技有限公司 | 一种多晶硅片清洗系统及其清洗方法 |
CN108231558B (zh) * | 2018-01-02 | 2020-07-28 | 京东方科技集团股份有限公司 | 一种准分子激光退火温度控制系统及方法和退火装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2833545B2 (ja) * | 1995-03-06 | 1998-12-09 | 日本電気株式会社 | 半導体装置の製造方法 |
US6083849A (en) * | 1995-11-13 | 2000-07-04 | Micron Technology, Inc. | Methods of forming hemispherical grain polysilicon |
JPH11111683A (ja) * | 1997-09-30 | 1999-04-23 | Sony Corp | 半導体装置の製造方法 |
JPH11162876A (ja) * | 1997-11-28 | 1999-06-18 | Nec Corp | 半導体装置の製造装置及び製造方法 |
JP3331999B2 (ja) * | 1999-02-09 | 2002-10-07 | 日本電気株式会社 | 半導体薄膜の製造方法 |
JP2002043274A (ja) * | 2000-07-25 | 2002-02-08 | Kanto Chem Co Inc | ポリシリコン膜の表面処理剤及びそれを用いたポリシリコン膜の表面処理方法 |
TW452892B (en) * | 2000-08-09 | 2001-09-01 | Lin Jing Wei | Re-crystallization method of polysilicon thin film of thin film transistor |
US6580053B1 (en) * | 2000-08-31 | 2003-06-17 | Sharp Laboratories Of America, Inc. | Apparatus to control the amount of oxygen incorporated into polycrystalline silicon film during excimer laser processing of silicon films |
KR100737911B1 (ko) * | 2001-02-01 | 2007-07-10 | 삼성전자주식회사 | 저온 다결정 실리콘형 박막 트랜지스터 제조 방법 |
JP4599734B2 (ja) * | 2001-03-14 | 2010-12-15 | ソニー株式会社 | 多結晶性半導体薄膜の形成方法、及び半導体装置の製造方法 |
JP2003133560A (ja) * | 2001-10-30 | 2003-05-09 | Sony Corp | 薄膜トランジスタの製造方法 |
JP2003158135A (ja) * | 2001-11-26 | 2003-05-30 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタの製造方法およびそれを備える表示装置の製造方法 |
US7235466B2 (en) * | 2002-10-31 | 2007-06-26 | Au Optronics Corporation | Method of fabricating a polysilicon layer |
KR100947180B1 (ko) * | 2003-06-03 | 2010-03-15 | 엘지디스플레이 주식회사 | 폴리실리콘 박막트랜지스터의 제조방법 |
JP2005349301A (ja) * | 2004-06-10 | 2005-12-22 | Seiko Epson Corp | 洗浄装置および洗浄方法 |
US20060240647A1 (en) * | 2005-04-25 | 2006-10-26 | Toshiba Matsushita Display Technology Co., Ltd. | Film control method and device thereof |
JP2006332589A (ja) * | 2005-04-25 | 2006-12-07 | Toshiba Matsushita Display Technology Co Ltd | 膜制御方法およびその装置 |
KR100753432B1 (ko) * | 2005-11-08 | 2007-08-31 | 경희대학교 산학협력단 | 다결정 실리콘 및 그의 결정화 방법 |
JP2007188953A (ja) * | 2006-01-11 | 2007-07-26 | Toshiba Matsushita Display Technology Co Ltd | 多結晶シリコン層の製造方法 |
JP4001906B2 (ja) * | 2006-12-22 | 2007-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
CN101971298A (zh) * | 2007-11-02 | 2011-02-09 | 佳能安内华股份有限公司 | 表面处理设备和表面处理方法 |
RU2431215C1 (ru) * | 2010-06-02 | 2011-10-10 | Учреждение Российской академии наук Институт физики полупроводников им. А.В. Ржанова Сибирского отделения РАН (ИФП СО РАН) | Способ получения слоя поликристаллического кремния |
CN102021580A (zh) * | 2010-10-30 | 2011-04-20 | 江苏顺风光电科技有限公司 | 太阳能电池晶硅硅片改良清水水洗工艺 |
KR101298220B1 (ko) * | 2012-01-20 | 2013-08-22 | 주식회사 엠엠테크 | 콤팩트한 기판 표면처리 시스템 및 기판 표면처리 방법 |
JP5964107B2 (ja) * | 2012-03-29 | 2016-08-03 | 株式会社ニューフレアテクノロジー | 半導体製造装置および半導体製造方法 |
CN103346065A (zh) * | 2013-06-08 | 2013-10-09 | 上海和辉光电有限公司 | 激光退火的方法及装置 |
-
2013
- 2013-12-25 CN CN201310728592.4A patent/CN103681244B/zh not_active Expired - Fee Related
- 2013-12-27 WO PCT/CN2013/090627 patent/WO2015096113A1/zh active Application Filing
- 2013-12-27 GB GB1607360.3A patent/GB2535369B/en not_active Expired - Fee Related
- 2013-12-27 DE DE112013007733.7T patent/DE112013007733T5/de not_active Ceased
- 2013-12-27 JP JP2016532049A patent/JP6286547B2/ja not_active Expired - Fee Related
- 2013-12-27 KR KR1020167016394A patent/KR101944598B1/ko active IP Right Grant
- 2013-12-27 US US14/234,144 patent/US9287108B2/en not_active Expired - Fee Related
- 2013-12-27 RU RU2016124648A patent/RU2647561C2/ru active
Also Published As
Publication number | Publication date |
---|---|
CN103681244B (zh) | 2016-09-14 |
KR101944598B1 (ko) | 2019-01-31 |
GB2535369B (en) | 2018-12-05 |
US9287108B2 (en) | 2016-03-15 |
GB2535369A (en) | 2016-08-17 |
JP2017511592A (ja) | 2017-04-20 |
GB201607360D0 (en) | 2016-06-15 |
RU2647561C2 (ru) | 2018-03-16 |
CN103681244A (zh) | 2014-03-26 |
DE112013007733T5 (de) | 2017-01-12 |
KR20160088405A (ko) | 2016-07-25 |
JP6286547B2 (ja) | 2018-02-28 |
WO2015096113A1 (zh) | 2015-07-02 |
US20150214036A1 (en) | 2015-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RU2016124648A (ru) | Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления | |
JP2012222330A5 (ru) | ||
JP2012044204A5 (ja) | メンテナンス方法、露光装置、及びデバイス製造方法 | |
JP2015082525A5 (ru) | ||
JP2010034523A5 (ru) | ||
JP2011512645A5 (ru) | ||
CN104392913B (zh) | 准分子激光退火装置及低温多晶硅薄膜的制备方法 | |
TW200625458A (en) | Method for annealing silicon thin films using conductive layer and polycrystalline silicon thin films prepared therefrom | |
JP2008270780A5 (ru) | ||
MY161721A (en) | Bonding Wire for Semiconductor Device Use and Method of Production of Same | |
EP2105957A3 (en) | Method for manufacturing soi substrate and method for manufacturing semiconductor device | |
EP2741314A3 (en) | Method of manufacturing a poly-crystalline silicon layer, method of manufacturing an organic light-emitting display apparatus including the same, and organic light-emitting display apparatus manufactured by using the same | |
JP2012015344A5 (ja) | 半導体装置の製造方法、基板処理方法及び基板処理装置 | |
JP2012064968A5 (ru) | ||
CN103361734A (zh) | 一种提高多晶硅产出效率的方法 | |
CN109371456B (zh) | 人造石英晶体籽晶片的腐蚀装置及腐蚀方法 | |
JP2010087487A5 (ru) | ||
JP2021502943A5 (ru) | ||
WO2011105830A3 (ko) | 다결정 실리콘층 제조방법 및 이를 위한 금속 혼입층 형성장치 | |
US9490124B2 (en) | Polycrystalline silicon substrate and manufacturing method thereof | |
WO2009075321A1 (ja) | GaN層含有積層基板及びその製造方法並びにデバイス | |
WO2015070464A1 (zh) | 提升多晶硅层均一性的多晶硅制作方法 | |
CN107119329A (zh) | 一种多晶硅的晶化方法、晶化设备及多晶硅 | |
JP2017220526A5 (ru) | ||
RU2013100517A (ru) | Способ очистки карбид-кремниевой трубы |