RU2016124648A - Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления - Google Patents

Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления Download PDF

Info

Publication number
RU2016124648A
RU2016124648A RU2016124648A RU2016124648A RU2016124648A RU 2016124648 A RU2016124648 A RU 2016124648A RU 2016124648 A RU2016124648 A RU 2016124648A RU 2016124648 A RU2016124648 A RU 2016124648A RU 2016124648 A RU2016124648 A RU 2016124648A
Authority
RU
Russia
Prior art keywords
amorphous silicon
temperature
low
thin film
layer
Prior art date
Application number
RU2016124648A
Other languages
English (en)
Other versions
RU2647561C2 (ru
Inventor
Лунсянь ЧЖАН
Original Assignee
Шэньчжэнь Чайна Стар Оптоэлектроникс Текнолоджи Ко., Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Шэньчжэнь Чайна Стар Оптоэлектроникс Текнолоджи Ко., Лтд. filed Critical Шэньчжэнь Чайна Стар Оптоэлектроникс Текнолоджи Ко., Лтд.
Publication of RU2016124648A publication Critical patent/RU2016124648A/ru
Application granted granted Critical
Publication of RU2647561C2 publication Critical patent/RU2647561C2/ru

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/02068Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/08Reaction chambers; Selection of materials therefor
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/10Heating of the reaction chamber or the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/183Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02422Non-crystalline insulating materials, e.g. glass, polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02488Insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02499Monolayers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02587Structure
    • H01L21/0259Microstructure
    • H01L21/02592Microstructure amorphous
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02587Structure
    • H01L21/0259Microstructure
    • H01L21/02595Microstructure polycrystalline
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02658Pretreatments
    • H01L21/02661In-situ cleaning
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686Pulsed laser beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/32115Planarisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Recrystallisation Techniques (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Claims (20)

1. Способ предварительной очистки тонкой пленки низкотемпературного поликремния, который включает: нагрев слоя аморфного кремния до температуры выше комнатной и выполнение предварительной очистки поверхности слоя аморфного кремния.
2. Способ предварительной очистки тонкой пленки низкотемпературного поликремния по п. 1, отличающийся тем, что нагрев слоя аморфного кремния доводит температуру слоя аморфного кремния до 25°-40°.
3. Способ получения тонкой пленки низкотемпературного поликремния, который включает:
этап 1: выращивание буферного слоя и затем слоя аморфного кремния на подложке;
этап 2: нагрев слоя аморфного кремния до температуры выше комнатной и выполнение предварительной очистки поверхности слоя аморфного кремния;
этап 3: использование отжига эксимерным лазером (ELA) для облучения предварительно очищенного слоя аморфного кремния на этапе 2, чтобы преобразовать аморфный кремний в поликремний.
4. Способ получения тонкой пленки низкотемпературного поликремния по п. 3, отличающийся тем, что температура слоя аморфного кремния на этапе 2 составляет 25°-40°.
5. Способ получения тонкой пленки низкотемпературного поликремния по п. 4, отличающийся тем, что слой аморфного кремния на этапе 2 включает первую часть относительно большей толщины и вторую часть относительно меньшей толщины, и температура нагрева первой части выше температуры нагрева второй части.
6. Способ получения тонкой пленки низкотемпературного поликремния по п. 3, отличающийся тем, что очиститель, применяемый для предварительной очистки, является водным раствором плавиковой кислоты в концентрации 1-3%.
7. Способ получения тонкой пленки низкотемпературного поликремния по п. 5, отличающийся тем, что плавиковую кислоту применяют в течение 45-60 с при расходе 40-60 литров в минуту (л/мин) в ходе предварительной очистки.
8. Система для изготовления тонкой пленки низкотемпературного поликремния, которая включает:
рабочий стол;
аппарат для эпитаксиального выращивания, расположенный над рабочим столом и приспособленный для обеспечения выращивания слоя аморфного кремния;
эксимерный лазер, расположенный над рабочим столом, предназначенный для преобразования слоя аморфного кремния в слой поликремния; а также включающая:
аппарат для предварительной очистки, расположенный над рабочим столом и предназначенный для выполнения предварительной очистки слоя аморфного кремния, и
устройство для регулировки температуры, расположенное на рабочем столе и предназначенное для выполнения нагрева слоя аморфного кремния.
9. Система для изготовления тонкой пленки низкотемпературного поликремния по п. 8, отличающаяся тем, что аппарат для предварительной очистки включает несколько равномерно распределенных форсунок.
10. Система для изготовления тонкой пленки низкотемпературного поликремния по п. 8, отличающаяся тем, что устройство для регулировки температуры включает несколько равномерно распределенных
средств нагрева, и каждое из средств нагрева включает независимые термостат и устройство для контроля температуры.
11. Система для изготовления тонкой пленки низкотемпературного поликремния по п. 10, отличающаяся тем, что средством нагрева является блок сопротивления или провод высокого сопротивления.
RU2016124648A 2013-12-25 2013-12-27 Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления RU2647561C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201310728592.4A CN103681244B (zh) 2013-12-25 2013-12-25 低温多晶硅薄膜的制备方法及其制作系统
CN201310728592.4 2013-12-25
PCT/CN2013/090627 WO2015096113A1 (zh) 2013-12-25 2013-12-27 低温多晶硅薄膜的预清洗方法及其制备方法、制作系统

Publications (2)

Publication Number Publication Date
RU2016124648A true RU2016124648A (ru) 2017-12-26
RU2647561C2 RU2647561C2 (ru) 2018-03-16

Family

ID=50318455

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2016124648A RU2647561C2 (ru) 2013-12-25 2013-12-27 Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления

Country Status (8)

Country Link
US (1) US9287108B2 (ru)
JP (1) JP6286547B2 (ru)
KR (1) KR101944598B1 (ru)
CN (1) CN103681244B (ru)
DE (1) DE112013007733T5 (ru)
GB (1) GB2535369B (ru)
RU (1) RU2647561C2 (ru)
WO (1) WO2015096113A1 (ru)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104037060B (zh) * 2014-05-14 2017-06-30 京东方科技集团股份有限公司 多晶金属氧化物图形的制备方法
CN104597609A (zh) 2015-02-06 2015-05-06 京东方科技集团股份有限公司 像素阵列、显示装置以及显示方法
CN106024707B (zh) * 2016-08-10 2018-11-13 昆山国显光电有限公司 阵列基板及其制备方法
CN106981416B (zh) * 2017-05-17 2019-11-26 武汉华星光电技术有限公司 利用准分子激光退火制作低温多晶硅的系统及其承载装置
CN107275198B (zh) * 2017-05-31 2020-03-10 昆山国显光电有限公司 激光退火方法及激光退火系统
WO2018232698A1 (zh) * 2017-06-22 2018-12-27 深圳市柔宇科技有限公司 阵列基板的制作设备及阵列基板的制作方法
CN108155118A (zh) * 2017-12-06 2018-06-12 中建材浚鑫科技有限公司 一种多晶硅片清洗系统及其清洗方法
CN108231558B (zh) * 2018-01-02 2020-07-28 京东方科技集团股份有限公司 一种准分子激光退火温度控制系统及方法和退火装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833545B2 (ja) * 1995-03-06 1998-12-09 日本電気株式会社 半導体装置の製造方法
US6083849A (en) * 1995-11-13 2000-07-04 Micron Technology, Inc. Methods of forming hemispherical grain polysilicon
JPH11111683A (ja) * 1997-09-30 1999-04-23 Sony Corp 半導体装置の製造方法
JPH11162876A (ja) * 1997-11-28 1999-06-18 Nec Corp 半導体装置の製造装置及び製造方法
JP3331999B2 (ja) * 1999-02-09 2002-10-07 日本電気株式会社 半導体薄膜の製造方法
JP2002043274A (ja) * 2000-07-25 2002-02-08 Kanto Chem Co Inc ポリシリコン膜の表面処理剤及びそれを用いたポリシリコン膜の表面処理方法
TW452892B (en) * 2000-08-09 2001-09-01 Lin Jing Wei Re-crystallization method of polysilicon thin film of thin film transistor
US6580053B1 (en) * 2000-08-31 2003-06-17 Sharp Laboratories Of America, Inc. Apparatus to control the amount of oxygen incorporated into polycrystalline silicon film during excimer laser processing of silicon films
KR100737911B1 (ko) * 2001-02-01 2007-07-10 삼성전자주식회사 저온 다결정 실리콘형 박막 트랜지스터 제조 방법
JP4599734B2 (ja) * 2001-03-14 2010-12-15 ソニー株式会社 多結晶性半導体薄膜の形成方法、及び半導体装置の製造方法
JP2003133560A (ja) * 2001-10-30 2003-05-09 Sony Corp 薄膜トランジスタの製造方法
JP2003158135A (ja) * 2001-11-26 2003-05-30 Matsushita Electric Ind Co Ltd 薄膜トランジスタの製造方法およびそれを備える表示装置の製造方法
US7235466B2 (en) * 2002-10-31 2007-06-26 Au Optronics Corporation Method of fabricating a polysilicon layer
KR100947180B1 (ko) * 2003-06-03 2010-03-15 엘지디스플레이 주식회사 폴리실리콘 박막트랜지스터의 제조방법
JP2005349301A (ja) * 2004-06-10 2005-12-22 Seiko Epson Corp 洗浄装置および洗浄方法
US20060240647A1 (en) * 2005-04-25 2006-10-26 Toshiba Matsushita Display Technology Co., Ltd. Film control method and device thereof
JP2006332589A (ja) * 2005-04-25 2006-12-07 Toshiba Matsushita Display Technology Co Ltd 膜制御方法およびその装置
KR100753432B1 (ko) * 2005-11-08 2007-08-31 경희대학교 산학협력단 다결정 실리콘 및 그의 결정화 방법
JP2007188953A (ja) * 2006-01-11 2007-07-26 Toshiba Matsushita Display Technology Co Ltd 多結晶シリコン層の製造方法
JP4001906B2 (ja) * 2006-12-22 2007-10-31 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN101971298A (zh) * 2007-11-02 2011-02-09 佳能安内华股份有限公司 表面处理设备和表面处理方法
RU2431215C1 (ru) * 2010-06-02 2011-10-10 Учреждение Российской академии наук Институт физики полупроводников им. А.В. Ржанова Сибирского отделения РАН (ИФП СО РАН) Способ получения слоя поликристаллического кремния
CN102021580A (zh) * 2010-10-30 2011-04-20 江苏顺风光电科技有限公司 太阳能电池晶硅硅片改良清水水洗工艺
KR101298220B1 (ko) * 2012-01-20 2013-08-22 주식회사 엠엠테크 콤팩트한 기판 표면처리 시스템 및 기판 표면처리 방법
JP5964107B2 (ja) * 2012-03-29 2016-08-03 株式会社ニューフレアテクノロジー 半導体製造装置および半導体製造方法
CN103346065A (zh) * 2013-06-08 2013-10-09 上海和辉光电有限公司 激光退火的方法及装置

Also Published As

Publication number Publication date
CN103681244B (zh) 2016-09-14
KR101944598B1 (ko) 2019-01-31
GB2535369B (en) 2018-12-05
US9287108B2 (en) 2016-03-15
GB2535369A (en) 2016-08-17
JP2017511592A (ja) 2017-04-20
GB201607360D0 (en) 2016-06-15
RU2647561C2 (ru) 2018-03-16
CN103681244A (zh) 2014-03-26
DE112013007733T5 (de) 2017-01-12
KR20160088405A (ko) 2016-07-25
JP6286547B2 (ja) 2018-02-28
WO2015096113A1 (zh) 2015-07-02
US20150214036A1 (en) 2015-07-30

Similar Documents

Publication Publication Date Title
RU2016124648A (ru) Способ предварительной очистки и способ получения тонкой пленки низкотемпературного поликремния, жидкокристаллическое устройство отображения и система для ее изготовления
JP2012222330A5 (ru)
JP2012044204A5 (ja) メンテナンス方法、露光装置、及びデバイス製造方法
JP2015082525A5 (ru)
JP2010034523A5 (ru)
JP2011512645A5 (ru)
CN104392913B (zh) 准分子激光退火装置及低温多晶硅薄膜的制备方法
TW200625458A (en) Method for annealing silicon thin films using conductive layer and polycrystalline silicon thin films prepared therefrom
JP2008270780A5 (ru)
MY161721A (en) Bonding Wire for Semiconductor Device Use and Method of Production of Same
EP2105957A3 (en) Method for manufacturing soi substrate and method for manufacturing semiconductor device
EP2741314A3 (en) Method of manufacturing a poly-crystalline silicon layer, method of manufacturing an organic light-emitting display apparatus including the same, and organic light-emitting display apparatus manufactured by using the same
JP2012015344A5 (ja) 半導体装置の製造方法、基板処理方法及び基板処理装置
JP2012064968A5 (ru)
CN103361734A (zh) 一种提高多晶硅产出效率的方法
CN109371456B (zh) 人造石英晶体籽晶片的腐蚀装置及腐蚀方法
JP2010087487A5 (ru)
JP2021502943A5 (ru)
WO2011105830A3 (ko) 다결정 실리콘층 제조방법 및 이를 위한 금속 혼입층 형성장치
US9490124B2 (en) Polycrystalline silicon substrate and manufacturing method thereof
WO2009075321A1 (ja) GaN層含有積層基板及びその製造方法並びにデバイス
WO2015070464A1 (zh) 提升多晶硅层均一性的多晶硅制作方法
CN107119329A (zh) 一种多晶硅的晶化方法、晶化设备及多晶硅
JP2017220526A5 (ru)
RU2013100517A (ru) Способ очистки карбид-кремниевой трубы