PT3216553T - Material de solda, massa de solda, solda de espuma, junta de solda e método para controlar material de solda - Google Patents

Material de solda, massa de solda, solda de espuma, junta de solda e método para controlar material de solda

Info

Publication number
PT3216553T
PT3216553T PT149056178T PT14905617T PT3216553T PT 3216553 T PT3216553 T PT 3216553T PT 149056178 T PT149056178 T PT 149056178T PT 14905617 T PT14905617 T PT 14905617T PT 3216553 T PT3216553 T PT 3216553T
Authority
PT
Portugal
Prior art keywords
solder
foam
controlling
paste
joint
Prior art date
Application number
PT149056178T
Other languages
English (en)
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of PT3216553T publication Critical patent/PT3216553T/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/30—Low melting point metals, i.e. Zn, Pb, Sn, Cd, In, Ga
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60277—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of conductive adhesives
PT149056178T 2014-11-05 2014-11-05 Material de solda, massa de solda, solda de espuma, junta de solda e método para controlar material de solda PT3216553T (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2014/079347 WO2016071971A1 (ja) 2014-11-05 2014-11-05 はんだ材料、はんだペースト、フォームはんだ、はんだ継手、およびはんだ材料の管理方法
EP14905617.8A EP3216553B1 (en) 2014-11-05 2014-11-05 Solder material, solder paste, foam solder, solder joint, and method for controlling solder material

Publications (1)

Publication Number Publication Date
PT3216553T true PT3216553T (pt) 2020-02-07

Family

ID=55169203

Family Applications (1)

Application Number Title Priority Date Filing Date
PT149056178T PT3216553T (pt) 2014-11-05 2014-11-05 Material de solda, massa de solda, solda de espuma, junta de solda e método para controlar material de solda

Country Status (8)

Country Link
US (1) US10717157B2 (pt)
EP (1) EP3216553B1 (pt)
JP (1) JP5846341B1 (pt)
KR (2) KR20180045051A (pt)
CN (1) CN107073656B (pt)
PT (1) PT3216553T (pt)
TW (1) TWI616265B (pt)
WO (1) WO2016071971A1 (pt)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6256616B2 (ja) * 2015-04-22 2018-01-10 日立金属株式会社 金属粒子およびその製造方法、被覆金属粒子、金属粉体
JP5850199B1 (ja) * 2015-06-29 2016-02-03 千住金属工業株式会社 はんだ材料、はんだ継手およびはんだ材料の検査方法
JP6217836B1 (ja) * 2016-12-07 2017-10-25 千住金属工業株式会社 核材料および半導体パッケージおよびバンプ電極の形成方法
JP6969070B2 (ja) * 2017-02-28 2021-11-24 千住金属工業株式会社 はんだ材料、はんだペースト、フォームはんだ及びはんだ継手
JP2018140427A (ja) * 2017-02-28 2018-09-13 千住金属工業株式会社 はんだ材料、はんだペースト、フォームはんだ及びはんだ継手
JP6861073B2 (ja) * 2017-03-31 2021-04-21 日鉄ケミカル＆マテリアル株式会社 ニッケル被覆銅粒子、接合材及び接合方法
JP6232157B1 (ja) * 2017-03-31 2017-11-15 日新製鋼株式会社 水蒸気処理製品の品質評価方法
CN107511603B (zh) * 2017-09-30 2019-08-09 北京康普锡威科技有限公司 一种核壳结构双金属复合焊粉及其制备方法
JP2018140436A (ja) * 2017-12-19 2018-09-13 千住金属工業株式会社 はんだ材料、はんだペースト、フォームはんだ及びはんだ継手
JP7184759B2 (ja) * 2017-12-22 2022-12-06 積水化学工業株式会社 導電材料、導電材料の保管方法、導電材料の製造方法及び接続構造体の製造方法
CN109967914A (zh) * 2017-12-27 2019-07-05 北京康普锡威科技有限公司 一种电子封装用铜芯结构的锡铜高温无铅预成型焊料
JP6439893B1 (ja) * 2018-05-25 2018-12-19 千住金属工業株式会社 ハンダボール、ハンダ継手および接合方法
JP6572998B1 (ja) * 2018-06-12 2019-09-11 千住金属工業株式会社 Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ
JP6485580B1 (ja) * 2018-06-12 2019-03-20 千住金属工業株式会社 Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ
JP6579253B1 (ja) * 2018-11-09 2019-09-25 千住金属工業株式会社 ハンダボール、ハンダ継手および接合方法
JP7003298B2 (ja) * 2019-01-18 2022-02-04 三菱電機株式会社 はんだ接合部の寿命予測手段及びはんだ接合部の寿命予測方法
CN111745155B (zh) * 2020-07-10 2022-07-12 郑州机械研究所有限公司 低熔包覆合金粉末及其制备方法和铁基金刚石胎体
JP6892621B1 (ja) * 2020-09-10 2021-06-23 千住金属工業株式会社 核材料、電子部品及びバンプ電極の形成方法
KR20220040307A (ko) * 2020-09-23 2022-03-30 삼성전자주식회사 하이브리드 접합 구조물, 이를 포함한 반도체 소자, 및 반도체 소자 제조방법
CN112621008B (zh) * 2020-12-15 2022-06-24 北京科技大学顺德研究生院 一种低热应力芯片封装用焊锡球及其制备方法
JP7189480B1 (ja) 2022-02-09 2022-12-14 千住金属工業株式会社 フラックスコートボール及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3420917B2 (ja) 1997-09-08 2003-06-30 富士通株式会社 半導体装置
SE515028C2 (sv) 1999-04-21 2001-05-28 Ericsson Telefon Ab L M Förbättrade lodkulor samt användning av dylika
JP2002153990A (ja) 2000-11-21 2002-05-28 Senju Metal Ind Co Ltd はんだボール用合金
JP4432041B2 (ja) 2004-05-28 2010-03-17 日立金属株式会社 はんだ合金およびはんだボール
JP2007287712A (ja) 2006-04-12 2007-11-01 Oki Electric Ind Co Ltd 半導体装置、半導体装置の実装構造、及びそれらの製造方法
JP2009034692A (ja) 2007-07-31 2009-02-19 Hitachi Metals Ltd はんだボールおよびそれを用いたはんだバンプ
WO2009090776A1 (ja) * 2008-01-17 2009-07-23 Horizon Technology Laboratory Co., Ltd. 半導体装置およびその製造方法
JP5071802B2 (ja) * 2008-04-08 2012-11-14 日立金属株式会社 はんだボール、はんだ層及びはんだバンプ
JP2010099694A (ja) * 2008-10-23 2010-05-06 Fujikura Ltd ハンダボール
JP5824214B2 (ja) * 2008-11-27 2015-11-25 日立金属株式会社 太陽電池用リード線の保管方法
JP5542360B2 (ja) 2009-03-30 2014-07-09 太陽ホールディングス株式会社 プリント配線板
JP5418894B2 (ja) * 2009-07-24 2014-02-19 日立金属株式会社 電子部品用複合ボールの製造方法
WO2012118202A1 (ja) 2011-03-02 2012-09-07 セントラル硝子株式会社 導電部付きガラス板用端子構造体及びこれを用いたガラス板物品
WO2012120982A1 (ja) * 2011-03-07 2012-09-13 Jx日鉱日石金属株式会社 α線量が少ない銅又は銅合金及び銅又は銅合金を原料とするボンディングワイヤ
KR102016864B1 (ko) 2012-12-06 2019-08-30 센주긴조쿠고교 가부시키가이샤 Cu 볼
CN104994974A (zh) * 2013-01-11 2015-10-21 千住金属工业株式会社 铜球
JP5590259B1 (ja) 2014-01-28 2014-09-17 千住金属工業株式会社 Ｃｕ核ボール、はんだペーストおよびはんだ継手
EP3103565B1 (en) * 2014-02-04 2018-10-24 Senju Metal Industry Co., Ltd Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM

Also Published As

Publication number Publication date
WO2016071971A1 (ja) 2016-05-12
KR20180045051A (ko) 2018-05-03
US20170312860A1 (en) 2017-11-02
CN107073656A (zh) 2017-08-18
JP5846341B1 (ja) 2016-01-20
EP3216553B1 (en) 2019-12-25
KR20170095841A (ko) 2017-08-23
TWI616265B (zh) 2018-03-01
KR101912550B1 (ko) 2018-10-26
EP3216553A4 (en) 2018-04-25
CN107073656B (zh) 2018-07-03
JPWO2016071971A1 (ja) 2017-04-27
US10717157B2 (en) 2020-07-21
EP3216553A1 (en) 2017-09-13
TW201630682A (zh) 2016-09-01

Similar Documents

Publication Publication Date Title
PT3216553T (pt) Material de solda, massa de solda, solda de espuma, junta de solda e método para controlar material de solda
EP2989723A4 (en) PORTABLE DEVICE AND METHOD FOR CONTROLLING THEREOF
PT3187299T (pt) Material de solda, uso de material de solda e método de produção para material de solda
SG11201608711RA (en) Material itq-55, method for preparation and use
GB201509495D0 (en) Communication apparatus, control method and program
SG10201406577PA (en) Method, apparatus, and program
PL3099945T3 (pl) Środek łączący i sposób łączenia dwóch części konstrukcyjnych
EP3238861A4 (en) Joining member, solder material, solder paste, foam solder, flux coating material, and solder joint
EP3124166A4 (en) Coated solder material and method for producing same
EP2987244A4 (en) MOBILE TERMINAL AND CONTROL FOR THE MOBILE TERMINAL
GB201607767D0 (en) Welding method
SG10201506399TA (en) Earset and control method for the same
SG10201500478WA (en) Communication apparatus, method of controlling the same, program, and computer-readable storage medium
EP3238872A4 (en) Flux for fast-heating method, and solder paste for fast-heating method
GB201412213D0 (en) Material,composition and method
EP3177744A4 (en) Material, method&component
HUE050434T2 (hu) Kötõanyag és azt alkalmazó kötõeljárás
EP3112082A4 (en) Welded joint and method for producing welded joint
ZA201603217B (en) Apparatus, program, and method
GB2545376B (en) Joint part determination method and joint material manufacturing method
SG11201706088TA (en) Communication apparatus, method of controlling the communication apparatus, and program
GB2562477B (en) Joining method
EP3103567A4 (en) Method for producing metal ball, joining material, and metal ball
EP3190751A4 (en) Method and device for delivering forwarding parameters
PL3113952T3 (pl) Sposób wytwarzania materiału opakowaniowego, materiał opakowaniowy i jego zastosowanie