PT3034657T - Porta-substrato para deposição galvânica vertical de metal - Google Patents

Porta-substrato para deposição galvânica vertical de metal

Info

Publication number
PT3034657T
PT3034657T PT14199449T PT14199449T PT3034657T PT 3034657 T PT3034657 T PT 3034657T PT 14199449 T PT14199449 T PT 14199449T PT 14199449 T PT14199449 T PT 14199449T PT 3034657 T PT3034657 T PT 3034657T
Authority
PT
Portugal
Prior art keywords
substrate holder
metal deposition
galvanic metal
vertical galvanic
vertical
Prior art date
Application number
PT14199449T
Other languages
English (en)
Inventor
Fendel Arnulf
Rauenbusch Ralph
Bussenius Tobias
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PT3034657T publication Critical patent/PT3034657T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)
PT14199449T 2014-12-19 2014-12-19 Porta-substrato para deposição galvânica vertical de metal PT3034657T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14199449.1A EP3034657B1 (en) 2014-12-19 2014-12-19 Substrate holder for vertical galvanic metal deposition

Publications (1)

Publication Number Publication Date
PT3034657T true PT3034657T (pt) 2019-05-31

Family

ID=52278413

Family Applications (1)

Application Number Title Priority Date Filing Date
PT14199449T PT3034657T (pt) 2014-12-19 2014-12-19 Porta-substrato para deposição galvânica vertical de metal

Country Status (8)

Country Link
US (1) US10407793B2 (pt)
EP (1) EP3034657B1 (pt)
JP (1) JP6590933B2 (pt)
KR (1) KR102010681B1 (pt)
CN (1) CN107109682B (pt)
PT (1) PT3034657T (pt)
TW (1) TWI679726B (pt)
WO (1) WO2016096946A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3309279B1 (en) 2016-10-14 2020-07-15 ATOTECH Deutschland GmbH Wafer-like substrate processing method, apparatus and use thereof
EP3376530B1 (en) 2017-03-16 2019-08-14 ATOTECH Deutschland GmbH Automated substrate holder loading device
JP2019002065A (ja) * 2017-06-20 2019-01-10 株式会社荏原製作所 めっき装置、及びプログラムを記録した記録媒体
JP6952007B2 (ja) * 2017-06-28 2021-10-20 株式会社荏原製作所 基板ホルダ及びめっき装置
WO2019003891A1 (ja) 2017-06-28 2019-01-03 株式会社荏原製作所 基板ホルダ及びめっき装置
JP6971780B2 (ja) * 2017-10-27 2021-11-24 上村工業株式会社 ワーク保持治具及びロードアンロード装置
JP7003005B2 (ja) 2018-06-25 2022-01-20 株式会社荏原製作所 基板ホルダ及びめっき装置
JP7136679B2 (ja) * 2018-12-13 2022-09-13 株式会社荏原製作所 基板ホルダに使用するシール
CN111705355A (zh) * 2020-07-02 2020-09-25 上海戴丰科技有限公司 一种晶圆立式旋转电镀治具及电镀装置
CN112663120B (zh) * 2020-12-05 2022-08-02 绍兴同芯成集成电路有限公司 用于晶圆双面电镀的电镀装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0325564U (pt) * 1989-07-18 1991-03-15
US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
JP3328812B2 (ja) 2000-10-06 2002-09-30 株式会社山本鍍金試験器 電気めっき試験器の陰極カートリッジおよび陽極カートリッジ
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
CN100370578C (zh) * 2002-06-21 2008-02-20 株式会社荏原制作所 基片保持装置和电镀设备
JP3827627B2 (ja) * 2002-08-13 2006-09-27 株式会社荏原製作所 めっき装置及びめっき方法
KR100629363B1 (ko) * 2004-10-15 2006-09-29 고민실 절연 처리된 도금장치
WO2010054677A1 (en) * 2008-11-14 2010-05-20 Replisaurus Technologies Inc. A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof
US8236151B1 (en) * 2009-10-30 2012-08-07 Cypress Semiconductor Corporation Substrate carrier for wet chemical processing
ES2634088T3 (es) * 2010-07-15 2017-09-26 Luxembourg Institute Of Science And Technology (List) Dispositivo sistema y procedimiento para su utilización en máquinas para la replicación electroquímica de patrones
US8900425B2 (en) * 2011-11-29 2014-12-02 Applied Materials, Inc. Contact ring for an electrochemical processor
CN202671687U (zh) * 2012-06-08 2013-01-16 东莞市开美电路板设备有限公司 封装基板电镀治具
DE102012019389B4 (de) 2012-10-02 2018-03-29 Atotech Deutschland Gmbh Haltevorrichtung für eine Ware und Behandlungsverfahren

Also Published As

Publication number Publication date
JP6590933B2 (ja) 2019-10-16
EP3034657A1 (en) 2016-06-22
EP3034657B1 (en) 2019-02-27
CN107109682A (zh) 2017-08-29
KR102010681B1 (ko) 2019-08-13
CN107109682B (zh) 2019-05-28
US20170321344A1 (en) 2017-11-09
TWI679726B (zh) 2019-12-11
TW201635426A (zh) 2016-10-01
JP2018503745A (ja) 2018-02-08
KR20170096029A (ko) 2017-08-23
WO2016096946A1 (en) 2016-06-23
US10407793B2 (en) 2019-09-10

Similar Documents

Publication Publication Date Title
PT3034657T (pt) Porta-substrato para deposição galvânica vertical de metal
SG11201607671YA (en) Methods for forming metal organic tungsten for middle of the line (mol) applications
SG11201702568QA (en) Holder for objects
GB201420312D0 (en) Carrier Mounting
GB2553071B (en) Container holder
IL254550A0 (en) Toilet paper roll holder
SG10201500801YA (en) Electroplating methods for semiconductor substrates
SG10201501105UA (en) Clamping mechanism for processing of a substrate within a substrate carrier
BR112017002975A2 (pt) meios de eletrodeposição para formação de revestimentos protetores eletroquimicamente depositados sobre sustratos metálicos
PL3149079T3 (pl) Powłoki podkładowe do stosowania na podłoża
ZA201700176B (en) Cell for metal electrowinning
HK1224025A1 (zh) 體式電成型金屬部件
GB201609631D0 (en) Container holder
GB201515985D0 (en) Deposition process
SG11201700604RA (en) Process for depositing metal or metalloid chalcogenides
EP4039224C0 (de) Werkstückträger
SG11201801454QA (en) Substrate carrier
SG10201603626RA (en) Methods for increasing the rate of electrochemical deposition
GB201602867D0 (en) Devcice holder
PT3384071T (pt) Método para deposição de metal galvanizado
SG11201606347XA (en) Deposition apparatus
PT3287550T (pt) Dispositivo para deposição galvânica vertical de metal num substrato
HK1212179A1 (en) Holder for metal heat insulation cup
PL2985084T3 (pl) Proces powlekania korpusu podłoża
PL3311060T3 (pl) Nośnik rury