PL3101042T3 - Kompozycja termoutwardzalnej żywicy, jej utwardzony produkt i elektryczny/elektroniczny komponent - Google Patents

Kompozycja termoutwardzalnej żywicy, jej utwardzony produkt i elektryczny/elektroniczny komponent

Info

Publication number
PL3101042T3
PL3101042T3 PL15743412T PL15743412T PL3101042T3 PL 3101042 T3 PL3101042 T3 PL 3101042T3 PL 15743412 T PL15743412 T PL 15743412T PL 15743412 T PL15743412 T PL 15743412T PL 3101042 T3 PL3101042 T3 PL 3101042T3
Authority
PL
Poland
Prior art keywords
electric
resin composition
electronic component
thermosetting resin
cured product
Prior art date
Application number
PL15743412T
Other languages
English (en)
Inventor
Ryujin Ishiuchi
Shotaro Itami
Hidekazu Fujita
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Publication of PL3101042T3 publication Critical patent/PL3101042T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/02—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonates or saturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/061—Polyesters; Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
    • C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
PL15743412T 2014-01-29 2015-01-15 Kompozycja termoutwardzalnej żywicy, jej utwardzony produkt i elektryczny/elektroniczny komponent PL3101042T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014014409 2014-01-29
EP15743412.7A EP3101042B1 (en) 2014-01-29 2015-01-15 Thermosetting resin composition, cured product thereof, and electric/electronic component
PCT/JP2015/050895 WO2015115186A1 (ja) 2014-01-29 2015-01-15 熱硬化性樹脂組成物、その硬化物、電気電子部品

Publications (1)

Publication Number Publication Date
PL3101042T3 true PL3101042T3 (pl) 2020-03-31

Family

ID=53756763

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15743412T PL3101042T3 (pl) 2014-01-29 2015-01-15 Kompozycja termoutwardzalnej żywicy, jej utwardzony produkt i elektryczny/elektroniczny komponent

Country Status (6)

Country Link
US (1) US20160326420A1 (pl)
EP (1) EP3101042B1 (pl)
JP (1) JP6419090B2 (pl)
CN (1) CN105934452B (pl)
PL (1) PL3101042T3 (pl)
WO (1) WO2015115186A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080040A1 (ja) * 2014-11-17 2016-05-26 昭和電工株式会社 不飽和ポリエステル樹脂組成物及びスイッチトリラクタンスモータ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199640A (ja) * 1986-02-28 1987-09-03 Nippon Shokubai Kagaku Kogyo Co Ltd 耐熱・耐熱水性硬化性組成物
JP2000053731A (ja) * 1998-06-04 2000-02-22 Mitsubishi Motors Corp 制振性樹脂組成物及び該樹脂組成物を用いた構造用制振性樹脂成形品
JP2005248019A (ja) * 2004-03-04 2005-09-15 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2009073975A (ja) * 2007-09-21 2009-04-09 Showa Highpolymer Co Ltd 不飽和ポリエステル樹脂組成物及びそれを用いた電気・電子部品成形品
JP5636169B2 (ja) * 2009-06-02 2014-12-03 昭和電工株式会社 熱硬化性樹脂組成物及び電気電子部品
JP2013256639A (ja) * 2012-05-18 2013-12-26 Nof Corp 熱可塑性エラストマー
CN103122075A (zh) * 2013-03-19 2013-05-29 苏州格瑞丰纳米科技有限公司 高导热薄层石墨烯基复合材料、其制备方法及应用

Also Published As

Publication number Publication date
CN105934452B (zh) 2018-10-26
EP3101042A1 (en) 2016-12-07
WO2015115186A1 (ja) 2015-08-06
CN105934452A (zh) 2016-09-07
US20160326420A1 (en) 2016-11-10
JPWO2015115186A1 (ja) 2017-03-23
EP3101042A4 (en) 2017-08-16
JP6419090B2 (ja) 2018-11-07
EP3101042B1 (en) 2019-07-03

Similar Documents

Publication Publication Date Title
EP3165549A4 (en) Epoxy resin composition for electronic material, cured product thereof and electronic member
EP3128540A4 (en) Thermosetting resin composition, semiconductor device and electrical/electronic component
EP3239206A4 (en) Epoxy resin, epoxy resin composition, inorganic-filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
EP3235845A4 (en) Photocurable and thermosetting resin composition, cured product and laminate
EP3115416A4 (en) Thermosetting resin composition and use thereof
EP2944675A4 (en) HARDENABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
EP2966106A4 (en) EPOXY RESIN COMPOSITION, CURED PRODUCT, THERMAL RADIATION MATERIAL, AND ELECTRONIC ELEMENT
ZA201704978B (en) Epoxy resin composition
SG11201701852VA (en) Thermosetting resin composition
EP3219758A4 (en) Thermosetting resin composition and prepreg and laminated board prepared therefrom
PT3121651T (pt) Composição de resina sensível a radiação e componente eletrónica
EP3196256A4 (en) Thermosetting resin composition
SG11201801738TA (en) Epoxy resin, epoxy resin composition, cured product and electrical or electronic component
HK1224083A1 (zh) 複合樹脂與電子設備
EP3173434A4 (en) Thermosetting resin composition and molded body thereof
ZA201703934B (en) Coating composition comprising an alkyd-comprising resin and a drier
EP3239199A4 (en) Thermosetting resin composition
PT3121652T (pt) Composição de resina sensível a radiação e componente eletrónica
EP3239241A4 (en) Resin composition, metal-resin composite, and preparation method and use thereof, and electronic product housing
ZA201608478B (en) Thermosetting biophotonic compositions and uses thereof
EP3378899A4 (en) THERMOSETTING MATERIAL AND CURED PRODUCT
EP3239200A4 (en) Thermosetting resin composition
HK1207100A1 (en) Thermosetting resin composition, cured product thereof, and display member using the same
EP3239242A4 (en) Anti-yellowing composition, resin composition, metal-resin composite, preparation method and use thereof, and electronic product housing
EP3118236A4 (en) Resin composition and cured product thereof