PL2590757T3 - Sposób wytwarzania subtelnie strukturyzowanych powierzchni - Google Patents

Sposób wytwarzania subtelnie strukturyzowanych powierzchni

Info

Publication number
PL2590757T3
PL2590757T3 PL11738658T PL11738658T PL2590757T3 PL 2590757 T3 PL2590757 T3 PL 2590757T3 PL 11738658 T PL11738658 T PL 11738658T PL 11738658 T PL11738658 T PL 11738658T PL 2590757 T3 PL2590757 T3 PL 2590757T3
Authority
PL
Poland
Prior art keywords
structured surfaces
finely structured
producing finely
producing
structured
Prior art date
Application number
PL11738658T
Other languages
English (en)
Inventor
Eduard Arzt
Elmar Kroner
Oliveira Peter William De
Sam Parmak Ebru Devrim
Florian Büsch
Dieter Urban
Reinhold Schwalm
Benedikt BLÄSI
Michael Nitsche
Hannes Spiecker
Claas Müller
Original Assignee
Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44486974&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2590757(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh filed Critical Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh
Publication of PL2590757T3 publication Critical patent/PL2590757T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/31—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive effect being based on a Gecko structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PL11738658T 2010-07-07 2011-07-06 Sposób wytwarzania subtelnie strukturyzowanych powierzchni PL2590757T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010026490A DE102010026490A1 (de) 2010-07-07 2010-07-07 Verfahren zur Herstellung von feinstrukturierten Oberflächen
EP11738658.1A EP2590757B1 (de) 2010-07-07 2011-07-06 Verfahren zur herstellung von feinstrukturierten oberflächen

Publications (1)

Publication Number Publication Date
PL2590757T3 true PL2590757T3 (pl) 2017-06-30

Family

ID=44486974

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11738658T PL2590757T3 (pl) 2010-07-07 2011-07-06 Sposób wytwarzania subtelnie strukturyzowanych powierzchni

Country Status (8)

Country Link
US (1) US10005103B2 (pl)
EP (1) EP2590757B1 (pl)
JP (1) JP5889294B2 (pl)
CN (1) CN103209770B (pl)
DE (1) DE102010026490A1 (pl)
ES (1) ES2605956T3 (pl)
PL (1) PL2590757T3 (pl)
WO (1) WO2012004319A1 (pl)

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CN102887477B (zh) * 2012-10-11 2015-04-22 无锡英普林纳米科技有限公司 聚合物表面纳米线阵列及其制备方法
US9962863B2 (en) * 2013-01-03 2018-05-08 Elwha Llc Nanoimprint lithography
US9561603B2 (en) 2013-01-03 2017-02-07 Elwha, Llc Nanoimprint lithography
US9302424B2 (en) 2013-01-03 2016-04-05 Elwha, Llc Nanoimprint lithography
KR20160020427A (ko) * 2013-06-14 2016-02-23 코베스트로 도이칠란트 아게 저-오일링, 내스크래치성, 및 내용매성 폴리카르보네이트 필름
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CN107405815A (zh) * 2014-12-10 2017-11-28 查尔斯斯塔克布料实验室公司 微小楔形物的聚合物及其制造方法
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US10394126B2 (en) * 2015-07-17 2019-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Photolithography process and materials
DE102015115004A1 (de) 2015-09-07 2017-03-09 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Verfahren zur Herstellung von strukturierten Oberflächen
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DE102015122788A1 (de) 2015-12-23 2017-06-29 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Verfahren zur Herstellung von leitfähigen Strukturen
DE102016113956A1 (de) * 2016-07-28 2018-02-01 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Vorrichtung mit einer strukturierten Beschichtung
TWI651203B (zh) * 2017-03-30 2019-02-21 台虹科技股份有限公司 無膠膠帶的製造方法
PL3415316T3 (pl) * 2017-06-13 2020-10-05 Hymmen GmbH Maschinen- und Anlagenbau Sposób i urządzenie do wytwarzania strukturyzowanej powierzchni
US10569298B2 (en) * 2017-09-27 2020-02-25 Intel Corporation Substrate with epoxy cured by ultraviolet laser
JP6640941B2 (ja) * 2018-08-27 2020-02-05 住友精化株式会社 ポジ型フォトレジスト
CN109264875B (zh) * 2018-10-12 2021-09-28 山东理工大学 Per-pamam和pesa无磷复合阻垢剂
DE102019206431A1 (de) 2019-05-03 2020-11-05 Hymmen GmbH Maschinen- und Anlagenbau Verfahren zum Herstellen einer Struktur auf einer Oberfläche
CN113905890A (zh) * 2019-06-03 2022-01-07 巴斯夫涂料有限公司 通过用于转移的压花工具的预处理将压花结构转移到涂料组合物的方法
CN111142336A (zh) * 2020-01-17 2020-05-12 天津瑞宏汽车配件制造有限公司 一种柔性光刻胶组合物
DE102020108107B3 (de) * 2020-03-24 2020-10-15 Simonswerk Gmbh Befestigung von Abdeckplatten

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Also Published As

Publication number Publication date
CN103209770A (zh) 2013-07-17
US20130101796A1 (en) 2013-04-25
US10005103B2 (en) 2018-06-26
ES2605956T3 (es) 2017-03-17
EP2590757B1 (de) 2016-09-07
EP2590757A1 (de) 2013-05-15
CN103209770B (zh) 2014-12-17
WO2012004319A1 (de) 2012-01-12
DE102010026490A1 (de) 2012-01-12
JP2013539201A (ja) 2013-10-17
JP5889294B2 (ja) 2016-03-22

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