PL2099269T3 - Elastyczny, elektryczny zacisk przyłączeniowy do lutowania - Google Patents

Elastyczny, elektryczny zacisk przyłączeniowy do lutowania

Info

Publication number
PL2099269T3
PL2099269T3 PL09001910T PL09001910T PL2099269T3 PL 2099269 T3 PL2099269 T3 PL 2099269T3 PL 09001910 T PL09001910 T PL 09001910T PL 09001910 T PL09001910 T PL 09001910T PL 2099269 T3 PL2099269 T3 PL 2099269T3
Authority
PL
Poland
Prior art keywords
contact terminal
electric contact
insulating
elastic electric
coating layer
Prior art date
Application number
PL09001910T
Other languages
English (en)
Inventor
Sung-Ho Cho
Han-Jin Cheon
Hwan-Min Yeo
Sun-Ki Kim
Original Assignee
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080021640A external-priority patent/KR100839893B1/ko
Priority claimed from KR2020080005393U external-priority patent/KR200442316Y1/ko
Priority claimed from KR1020080063460A external-priority patent/KR101001354B1/ko
Application filed by Joinset Co Ltd filed Critical Joinset Co Ltd
Publication of PL2099269T3 publication Critical patent/PL2099269T3/pl

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • H05K3/4015Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0154Polyimide
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
PL09001910T 2008-03-07 2009-02-11 Elastyczny, elektryczny zacisk przyłączeniowy do lutowania PL2099269T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020080021640A KR100839893B1 (ko) 2008-03-07 2008-03-07 솔더링 가능한 탄성 전기접촉단자
KR2020080005393U KR200442316Y1 (ko) 2008-04-23 2008-04-23 절연탄성체를 내재한 전기접촉단자 어셈블리
KR1020080063460A KR101001354B1 (ko) 2008-07-01 2008-07-01 리플로우 솔더링이 가능한 탄성 전기접촉단자
EP09001910A EP2099269B1 (en) 2008-03-07 2009-02-11 Solderable elastic electric contact terminal

Publications (1)

Publication Number Publication Date
PL2099269T3 true PL2099269T3 (pl) 2012-09-28

Family

ID=40791589

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09001910T PL2099269T3 (pl) 2008-03-07 2009-02-11 Elastyczny, elektryczny zacisk przyłączeniowy do lutowania

Country Status (8)

Country Link
US (1) US7931475B2 (pl)
EP (1) EP2099269B1 (pl)
JP (1) JP4733752B2 (pl)
AT (1) ATE555644T1 (pl)
CA (1) CA2653315C (pl)
MY (1) MY147054A (pl)
PL (1) PL2099269T3 (pl)
TW (1) TWI387159B (pl)

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KR101084282B1 (ko) 2011-06-15 2011-11-17 김선기 솔더링이 가능한 탄성 전기접촉단자
DE102012100598A1 (de) * 2012-01-25 2013-07-25 Eugen Forschner Gmbh Abgedichteter Stecker und Verfahren zur Abdichtung eines Steckers
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US9531853B2 (en) * 2013-03-14 2016-12-27 Htc Corporation Electronic module and electronic device
WO2015006406A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated tubular lattice structure
CA2917967A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated polymer compressor
US11267576B2 (en) 2013-07-09 2022-03-08 Raytheon Technologies Corporation Plated polymer nosecone
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JP5736418B2 (ja) * 2013-07-16 2015-06-17 星和電機株式会社 軟式電気導通体
EP2874233B1 (en) * 2013-11-14 2017-01-25 Joinset Co., Ltd Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same
CN105390850B (zh) * 2014-08-22 2017-12-29 卓英社有限公司 能够实现借助于回流焊的表面贴装的囊型电接触端子
KR101600510B1 (ko) * 2014-08-22 2016-03-07 조인셋 주식회사 리플로우 솔더링에 의한 표면실장이 가능한 포켓형 전기접촉단자
KR101503307B1 (ko) * 2014-09-25 2015-03-19 주식회사 이송이엠씨 노이즈 커플링에 의한 안테나 효과를 차단한 열전도성 탄성체
TWI559641B (zh) * 2015-01-20 2016-11-21 群創光電股份有限公司 顯示裝置
KR101711016B1 (ko) * 2015-03-23 2017-02-28 조인셋 주식회사 내 환경성이 향상된 탄성 전기접촉단자 및 그 제조 방법
US20160336093A1 (en) * 2015-05-15 2016-11-17 Joinset Co., Ltd. Elastic electric contact terminal adapted to small size
KR102350393B1 (ko) * 2015-07-31 2022-01-14 엘지디스플레이 주식회사 전자파 차폐 구조물과 그를 갖는 표시 장치
KR101793717B1 (ko) 2015-08-07 2017-11-03 조인셋 주식회사 전기접속단자
WO2017026625A1 (ko) 2015-08-07 2017-02-16 조인셋 주식회사 전기접속단자
CN206619706U (zh) * 2017-04-14 2017-11-07 深圳市卓汉材料技术有限公司 一种接地弹性件
CN109004396B (zh) * 2017-06-07 2024-06-14 泰科电子(上海)有限公司 弹性导电端子及其制造方法
KR102026465B1 (ko) * 2017-11-10 2019-09-27 조인셋 주식회사 전기접속단자
US10270193B1 (en) * 2017-12-18 2019-04-23 Continental Automotive Systems, Inc. Concentric springs for sensor connection
US11439832B2 (en) * 2019-01-09 2022-09-13 Stimwave Technologies Incorporated Implantable electronic devices
KR102236798B1 (ko) * 2019-05-21 2021-04-06 조인셋 주식회사 탄성 전기접속단자 어셈블리
KR102416027B1 (ko) * 2019-11-15 2022-07-05 조인셋 주식회사 탄성 전기접촉단자
JP7541289B2 (ja) * 2020-10-29 2024-08-28 積水ポリマテック株式会社 導電部材
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Also Published As

Publication number Publication date
MY147054A (en) 2012-10-15
TW200941841A (en) 2009-10-01
US20090227127A1 (en) 2009-09-10
US7931475B2 (en) 2011-04-26
ATE555644T1 (de) 2012-05-15
CA2653315C (en) 2011-12-20
JP2009218207A (ja) 2009-09-24
EP2099269B1 (en) 2012-04-25
EP2099269A1 (en) 2009-09-09
JP4733752B2 (ja) 2011-07-27
TWI387159B (zh) 2013-02-21
CA2653315A1 (en) 2009-09-07

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