PL1688518T3 - Sposób i urządzenie do elektrochemicznej obróbki elementów w liniach do pracy ciągłej - Google Patents

Sposób i urządzenie do elektrochemicznej obróbki elementów w liniach do pracy ciągłej

Info

Publication number
PL1688518T3
PL1688518T3 PL06002263T PL06002263T PL1688518T3 PL 1688518 T3 PL1688518 T3 PL 1688518T3 PL 06002263 T PL06002263 T PL 06002263T PL 06002263 T PL06002263 T PL 06002263T PL 1688518 T3 PL1688518 T3 PL 1688518T3
Authority
PL
Poland
Prior art keywords
pieces
electrochemical treatment
continuous electrochemical
continuous
treatment
Prior art date
Application number
PL06002263T
Other languages
English (en)
Inventor
Thomas Kosikowski
Original Assignee
Hoellmueller Maschbau H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36218578&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL1688518(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hoellmueller Maschbau H filed Critical Hoellmueller Maschbau H
Publication of PL1688518T3 publication Critical patent/PL1688518T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
PL06002263T 2005-02-04 2006-02-03 Sposób i urządzenie do elektrochemicznej obróbki elementów w liniach do pracy ciągłej PL1688518T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005005095A DE102005005095A1 (de) 2005-02-04 2005-02-04 Verfahren und Vorrichtung zur elektrochemischen Behandlung von Bauteilen in Durchlaufanlagen
EP06002263A EP1688518B1 (de) 2005-02-04 2006-02-03 Verfahren und Vorrichtung zur elektrochemischen Behandlung von Bauteilen in Durchlaufanlagen

Publications (1)

Publication Number Publication Date
PL1688518T3 true PL1688518T3 (pl) 2009-01-30

Family

ID=36218578

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06002263T PL1688518T3 (pl) 2005-02-04 2006-02-03 Sposób i urządzenie do elektrochemicznej obróbki elementów w liniach do pracy ciągłej

Country Status (6)

Country Link
EP (1) EP1688518B1 (pl)
JP (1) JP2006214006A (pl)
CN (1) CN1824842B (pl)
DE (2) DE102005005095A1 (pl)
PL (1) PL1688518T3 (pl)
TW (1) TW200630002A (pl)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006049488A1 (de) * 2006-10-17 2008-04-30 Höllmüller Maschinenbau GmbH Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten
JP5425440B2 (ja) * 2008-10-20 2014-02-26 株式会社Ｊｃｕ 銅めっきにおけるウィスカーの抑制方法
WO2010144509A2 (en) 2009-06-08 2010-12-16 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
DE102009029551B4 (de) * 2009-09-17 2013-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten
JP6129497B2 (ja) 2011-09-29 2017-05-17 アルメックスＰｅ株式会社 連続メッキ装置
JP5795514B2 (ja) 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 連続メッキ装置
US20140083842A1 (en) * 2012-09-25 2014-03-27 Almex Pe Inc. Serial plating system
JP6127726B2 (ja) * 2013-02-27 2017-05-17 住友金属鉱山株式会社 めっき装置
EA032264B1 (ru) 2013-03-15 2019-05-31 Модьюметл, Инк. Способ нанесения покрытия на изделие, изделие, полученное вышеуказанным способом, и труба
CA2905575C (en) 2013-03-15 2022-07-12 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EA201500949A1 (ru) 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
EA201790643A1 (ru) * 2014-09-18 2017-08-31 Модьюметал, Инк. Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий
AR102068A1 (es) 2014-09-18 2017-02-01 Modumetal Inc Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva
TWI565574B (zh) * 2014-10-20 2017-01-11 東榮科技股份有限公司 晶圓切割線材的製造方法及其電鍍處理設備
JP2016157096A (ja) 2015-02-20 2016-09-01 株式会社リコー 照明装置及び画像投射装置
CN105177660B (zh) * 2015-10-09 2017-11-21 华晶精密制造股份有限公司 一种金刚石切割线生产用水平上砂装置
CN105442013A (zh) * 2015-12-16 2016-03-30 黄权波 一种水平方式传送的金属阳极氧化装置
RU2731392C2 (ru) * 2015-12-18 2020-09-02 Яра Интернейшнл Аса Способы удаления хлорида из сточных вод производства удобрений
CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
CA3060619A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN108793054B (zh) * 2018-07-05 2023-11-07 南京工业职业技术学院 一种基于双向脉冲电源的微纳米电极制备装置及制备方法
EP4010517A1 (de) * 2019-08-05 2022-06-15 SMS Group GmbH Verfahren und anlage zum elektrolytischen beschichten eines stahlbandes mittels pulstechnik

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4417551C2 (de) 1994-05-19 1996-04-04 Atotech Deutschland Gmbh Elektrolytisches Verfahren zum präzisen Behandeln von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
DE4417550C1 (de) 1994-05-19 1995-04-20 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Behandeln von Feinleiterplatten und Feinleiterfolien
PL184299B1 (pl) * 1995-07-18 2002-09-30 Koninklijke Philips Electronics Nv Sposób elektrochemicznej obróbki za pomocą impulsów elektrycznych o zmiennej polaryzacji oraz urządzenie do elektrochemicznej obróbki za pomocą impulsów elektrycznych o zmiennej polaryzacji
EP0823719B1 (en) * 1996-07-26 2002-06-05 Nec Corporation Solid electrolytic capacitor having pre-plated lead terminals and manufacturing process thereof
JPH1143797A (ja) * 1997-07-25 1999-02-16 Hideo Honma ビアフィリング方法
JP4388611B2 (ja) * 1998-09-14 2009-12-24 イビデン株式会社 銅被膜からなる配線を有するプリント配線板およびその製造方法、並びに銅被膜からなる回路を有する回路板
US6265020B1 (en) * 1999-09-01 2001-07-24 Shipley Company, L.L.C. Fluid delivery systems for electronic device manufacture
DE10043814C1 (de) 2000-09-06 2002-04-11 Egon Huebel Verfahren und Vorrichtungen zum elektrochemischen Behandeln von Gut
JP2002121694A (ja) * 2000-10-16 2002-04-26 Nippon Mektron Ltd プリント基板のスルーホール・メッキ方法および装置
JP2002155395A (ja) * 2000-11-16 2002-05-31 Nitto Denko Corp 長尺基板のめっき方法およびめっき装置
JP2002169998A (ja) * 2000-11-30 2002-06-14 Kiyotaka Yoshihara 発注手続システム
JP3340724B2 (ja) * 2000-12-01 2002-11-05 丸仲工業株式会社 メッキ装置のメッキ液噴出ノズル装置
DE10209365C1 (de) * 2002-02-24 2003-02-20 Egon Huebel Verfahren und Vorrichtung zur elektrolytischen Metallisierung von Lochwänden und Strukturen
JP3964263B2 (ja) * 2002-05-17 2007-08-22 株式会社デンソー ブラインドビアホール充填方法及び貫通電極形成方法
DE10241619B4 (de) * 2002-09-04 2004-07-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut

Also Published As

Publication number Publication date
TW200630002A (en) 2006-08-16
CN1824842A (zh) 2006-08-30
CN1824842B (zh) 2011-04-27
DE502006001153D1 (de) 2008-09-04
EP1688518B1 (de) 2008-07-23
JP2006214006A (ja) 2006-08-17
DE102005005095A1 (de) 2006-08-10
EP1688518A2 (de) 2006-08-09
EP1688518A3 (de) 2006-12-13

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