PL133619B1 - Method of manufacturing electrodes for ceramic capacitors - Google Patents
Method of manufacturing electrodes for ceramic capacitors Download PDFInfo
- Publication number
- PL133619B1 PL133619B1 PL23259581A PL23259581A PL133619B1 PL 133619 B1 PL133619 B1 PL 133619B1 PL 23259581 A PL23259581 A PL 23259581A PL 23259581 A PL23259581 A PL 23259581A PL 133619 B1 PL133619 B1 PL 133619B1
- Authority
- PL
- Poland
- Prior art keywords
- layer
- solder
- layers
- sides
- vacuum
- Prior art date
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000010410 layer Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 229910003336 CuNi Inorganic materials 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 3
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 9
- 238000005507 spraying Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- GSJBKPNSLRKRNR-UHFFFAOYSA-N $l^{2}-stannanylidenetin Chemical compound [Sn].[Sn] GSJBKPNSLRKRNR-UHFFFAOYSA-N 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD22328680A DD155710A3 (de) | 1980-08-13 | 1980-08-13 | Verfahren zur herstellung der elektroden von keramikkondensatoren |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL232595A1 PL232595A1 (ro) | 1982-04-26 |
| PL133619B1 true PL133619B1 (en) | 1985-06-29 |
Family
ID=5525842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL23259581A PL133619B1 (en) | 1980-08-13 | 1981-08-12 | Method of manufacturing electrodes for ceramic capacitors |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5762520A (ro) |
| BG (1) | BG41631A1 (ro) |
| CS (1) | CS239320B1 (ro) |
| DD (1) | DD155710A3 (ro) |
| DE (1) | DE3124741A1 (ro) |
| FR (1) | FR2488723A1 (ro) |
| HU (1) | HU182359B (ro) |
| PL (1) | PL133619B1 (ro) |
| RO (1) | RO80046A (ro) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4604676A (en) * | 1984-10-02 | 1986-08-05 | Murata Manufacturing Co., Ltd. | Ceramic capacitor |
| DE3638342A1 (de) * | 1986-11-10 | 1988-05-19 | Siemens Ag | Elektrisches bauelement aus keramik mit mehrlagenmetallisierung und verfahren zu seiner herstellung |
| DE3900787A1 (de) * | 1989-01-12 | 1990-07-19 | Siemens Ag | Verfahren zur herstellung eines keramischen elektrischen bauelementes |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE907322C (de) * | 1944-12-07 | 1954-03-25 | Hydrawerk Ag | Verfahren zur Metallbedampfung eines Dielektrikums, insbesondere zur Herstellung von Belagschichten fuer elektrische Kondensatoren |
| US2702760A (en) * | 1951-04-25 | 1955-02-22 | Western Electric Co | Method of applying metallic stripes to a web of paper |
| DE2359432C3 (de) * | 1973-11-29 | 1984-08-09 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung von mit Aluminium beschichteten Folien für Kondensatoren und Vorrichtung zur Durchführung des Verfahrens |
| DD132090B1 (de) * | 1977-07-25 | 1983-06-08 | Bratouss Andreas Gerhard | Verfahren zur herstellung von elektroden bei keramischen kondensatoren |
| DE2734666C3 (de) * | 1977-08-01 | 1981-01-15 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Maskenhalter für Sputter-Lochmaskensysteme |
| DE2903428C2 (de) * | 1979-01-30 | 1985-10-24 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung von Schaltungen in Dünnschichttechnik mit Dickschichtkomponenten |
-
1980
- 1980-08-13 DD DD22328680A patent/DD155710A3/de not_active IP Right Cessation
-
1981
- 1981-06-24 DE DE19813124741 patent/DE3124741A1/de not_active Ceased
- 1981-07-02 CS CS514481A patent/CS239320B1/cs unknown
- 1981-07-07 BG BG5277981A patent/BG41631A1/xx unknown
- 1981-07-15 FR FR8113775A patent/FR2488723A1/fr active Granted
- 1981-07-23 HU HU215081A patent/HU182359B/hu unknown
- 1981-08-12 RO RO81105085A patent/RO80046A/ro unknown
- 1981-08-12 PL PL23259581A patent/PL133619B1/pl unknown
- 1981-08-13 JP JP12608081A patent/JPS5762520A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3124741A1 (de) | 1982-03-18 |
| BG41631A1 (en) | 1987-07-15 |
| RO80046A (ro) | 1982-10-26 |
| DD155710A3 (de) | 1982-06-30 |
| HU182359B (en) | 1983-12-28 |
| FR2488723B1 (ro) | 1985-03-29 |
| PL232595A1 (ro) | 1982-04-26 |
| JPS5762520A (en) | 1982-04-15 |
| CS239320B1 (en) | 1986-01-16 |
| FR2488723A1 (fr) | 1982-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0855724B1 (en) | Electronic parts and manufacturing method thereof | |
| US3612963A (en) | Multilayer ceramic capacitor and process | |
| US6380577B1 (en) | Tantalum chip capacitor | |
| CA1180779A (en) | Ceramic capacitor and method of making same | |
| JPH11176642A (ja) | 電子部品とその製造方法 | |
| PL133619B1 (en) | Method of manufacturing electrodes for ceramic capacitors | |
| US11769635B2 (en) | Multilayer ceramic capacitor and method of manufacturing same | |
| US12278049B2 (en) | Multilayer ceramic capacitor, a method of manufacturing the same and a substrate arrangement | |
| US6063140A (en) | Process for manufacturing a metallized film capacitor | |
| TWI436389B (zh) | Electronic Parts | |
| JP4544896B2 (ja) | 電子部品 | |
| JP2599478B2 (ja) | チップ型電子部品 | |
| JPH06196351A (ja) | 積層セラミックコンデンサの製造方法 | |
| US4777558A (en) | Electronic device | |
| JP3180515B2 (ja) | 面実装部品への半田バンプ形成方法 | |
| JP4109348B2 (ja) | 電子部品とその製造方法 | |
| KR0130869B1 (ko) | 칲 저항기의 외부 전극 제조 방법 | |
| JP2003243245A (ja) | セラミック電子部品およびその製造方法 | |
| JPH06349674A (ja) | 金属膜支持体及びセラミックグリーンシート供給体並びに電子部品用セラミック積層体 | |
| JPH08236387A (ja) | 面実装電子部品とその製造方法 | |
| JP2976048B2 (ja) | チップ型セラミック電子部品の製造方法 | |
| KR0130868B1 (ko) | 다층 칩 캐패시터(Multilayer Chip Capacitor)의 외부 전극 제조방법 | |
| JPH05283207A (ja) | チップ型サーミスタ及びその製造方法 | |
| JPH0787161B2 (ja) | 電子部品の端面電極形成方法 | |
| WO2023238512A1 (ja) | 積層セラミックコンデンサ |