PH26191A - Moulding composition comprising a thermoset component and thermoplast component - Google Patents
Moulding composition comprising a thermoset component and thermoplast component Download PDFInfo
- Publication number
- PH26191A PH26191A PH39317A PH39317A PH26191A PH 26191 A PH26191 A PH 26191A PH 39317 A PH39317 A PH 39317A PH 39317 A PH39317 A PH 39317A PH 26191 A PH26191 A PH 26191A
- Authority
- PH
- Philippines
- Prior art keywords
- component
- precursor
- composition
- thermoset
- polyarylsulphone
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 80
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 33
- 238000000465 moulding Methods 0.000 title claims abstract description 21
- 239000002243 precursor Substances 0.000 claims abstract description 44
- 239000004634 thermosetting polymer Substances 0.000 claims abstract description 14
- 230000009969 flowable effect Effects 0.000 claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 7
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims abstract description 5
- 150000003568 thioethers Chemical class 0.000 claims abstract description 5
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 4
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract 2
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 238000000748 compression moulding Methods 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 2
- 238000005098 hot rolling Methods 0.000 claims description 2
- 238000001721 transfer moulding Methods 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims 10
- 239000004416 thermosoftening plastic Substances 0.000 claims 10
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims 1
- 239000010419 fine particle Substances 0.000 claims 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- 239000000843 powder Substances 0.000 description 10
- 239000000835 fiber Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000269 nucleophilic effect Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- -1 phenols cyanate Chemical class 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000009863 impact test Methods 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- GQWWGRUJOCIUKI-UHFFFAOYSA-N 2-[3-(2-methyl-1-oxopyrrolo[1,2-a]pyrazin-3-yl)propyl]guanidine Chemical group O=C1N(C)C(CCCN=C(N)N)=CN2C=CC=C21 GQWWGRUJOCIUKI-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- LIWAQLJGPBVORC-UHFFFAOYSA-N ethylmethylamine Chemical compound CCNC LIWAQLJGPBVORC-UHFFFAOYSA-N 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- OZUNPRDEUXITBO-UHFFFAOYSA-N 1-(4-chlorophenyl)sulfonyl-4-[4-(4-chlorophenyl)sulfonylphenyl]benzene Chemical group C1=CC(Cl)=CC=C1S(=O)(=O)C1=CC=C(C=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(Cl)=CC=2)C=C1 OZUNPRDEUXITBO-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical class NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 206010067484 Adverse reaction Diseases 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 241000264877 Hippospongia communis Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000006838 adverse reaction Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000288 alkali metal carbonate Inorganic materials 0.000 description 1
- 150000008041 alkali metal carbonates Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- KTYQPSIVRZZBRC-UHFFFAOYSA-N benzene-1,3-diol benzene-1,4-diol 4-(4-hydroxyphenyl)phenol naphthalene-1,2-diol Chemical compound OC1=C(C2=CC=CC=C2C=C1)O.C1(O)=CC(O)=CC=C1.OC1=CC=C(C=C1)C1=CC=C(C=C1)O.C1(O)=CC=C(O)C=C1 KTYQPSIVRZZBRC-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000012612 commercial material Substances 0.000 description 1
- 239000002361 compost Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000006575 electron-withdrawing group Chemical group 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- OHQOKJPHNPUMLN-UHFFFAOYSA-N n,n'-diphenylmethanediamine Chemical compound C=1C=CC=CC=1NCNC1=CC=CC=C1 OHQOKJPHNPUMLN-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 238000002103 osmometry Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001330 spinodal decomposition reaction Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 125000006836 terphenylene group Chemical group 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02F—CYLINDERS, PISTONS OR CASINGS, FOR COMBUSTION ENGINES; ARRANGEMENTS OF SEALINGS IN COMBUSTION ENGINES
- F02F7/00—Casings, e.g. crankcases
- F02F7/006—Camshaft or pushrod housings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2225/00—Synthetic polymers, e.g. plastics; Rubber
- F05C2225/08—Thermoplastics
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/253,595 US4972031A (en) | 1988-10-05 | 1988-10-05 | Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PH26191A true PH26191A (en) | 1992-03-18 |
Family
ID=22960921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH39317A PH26191A (en) | 1988-10-05 | 1989-10-02 | Moulding composition comprising a thermoset component and thermoplast component |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4972031A (de) |
| EP (1) | EP0365168B1 (de) |
| JP (2) | JP3231753B2 (de) |
| KR (1) | KR0173973B1 (de) |
| AT (1) | ATE180267T1 (de) |
| DE (1) | DE68928998T2 (de) |
| ES (1) | ES2134756T3 (de) |
| GB (1) | GB8921770D0 (de) |
| MY (1) | MY105596A (de) |
| PH (1) | PH26191A (de) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5231150A (en) * | 1987-10-05 | 1993-07-27 | Imperial Chemical Industries Plc | Polymer composition |
| US5364914A (en) * | 1988-10-05 | 1994-11-15 | Imperial Chemical Industries Plc | Moulding composition comprising a thermoset component and thermoplast component |
| GB9016343D0 (en) * | 1989-08-09 | 1990-09-12 | Ici Plc | Polymer composition |
| GB9020258D0 (en) * | 1989-09-29 | 1990-10-31 | Ici Plc | Polymeric compositions & components therefore |
| EP0469384B1 (de) * | 1990-08-01 | 1995-03-15 | Siemens Aktiengesellschaft | Strahlenhärtbare Reaktionsharzsysteme |
| EP0583224B1 (de) * | 1992-08-11 | 1999-01-20 | Hexcel Corporation | Mit Sulfonpolymeren zäher gemachte hitzehärtbare Harze |
| DE69427665T2 (de) * | 1993-02-24 | 2001-10-31 | Ibiden Co. Ltd., Ogaki | Harzzusammensetzungen und Verfahren für Ihre Herstellung |
| US5519177A (en) * | 1993-05-19 | 1996-05-21 | Ibiden Co., Ltd. | Adhesives, adhesive layers for electroless plating and printed circuit boards |
| NL9402233A (nl) * | 1994-12-29 | 1996-08-01 | 3P Licensing Bv | Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal. |
| US7018496B1 (en) | 1999-04-26 | 2006-03-28 | 3M Innovative Properties Company | Curable mechanical fasteners |
| JP2003514057A (ja) * | 1999-11-04 | 2003-04-15 | サイテク・テクノロジー・コーポレーシヨン | 可変温度硬化性組成物 |
| GB0020620D0 (en) * | 2000-08-22 | 2000-10-11 | Cytec Tech Corp | Compostions adapted for chain linking |
| KR100849289B1 (ko) | 2000-08-22 | 2008-07-29 | 사이텍 테크놀러지 코포레이션 | 경화성 조성물내 가용화제로서 사용하기 위한 가요성 중합체 부재 |
| JP4277440B2 (ja) * | 2000-10-19 | 2009-06-10 | 日本ゼオン株式会社 | 硬化性組成物、絶縁材料および回路基板 |
| GB0028342D0 (en) * | 2000-11-21 | 2001-01-03 | Cytec Tech Corp | Method and composition for cutting dry fabric |
| GB0028341D0 (en) * | 2000-11-21 | 2001-01-03 | Cytec Tech Corp | Thermally stable resin binder composition and method for binding fibres |
| JP2003046072A (ja) | 2001-07-27 | 2003-02-14 | Fuji Photo Optical Co Ltd | 固体撮像素子の取付構造 |
| US20060240239A1 (en) * | 2003-05-22 | 2006-10-26 | Mcgrail Patrick T | Compositions adapted for chain linking |
| US7026432B2 (en) | 2003-08-12 | 2006-04-11 | General Electric Company | Electrically conductive compositions and method of manufacture thereof |
| US7354988B2 (en) | 2003-08-12 | 2008-04-08 | General Electric Company | Electrically conductive compositions and method of manufacture thereof |
| US7309727B2 (en) | 2003-09-29 | 2007-12-18 | General Electric Company | Conductive thermoplastic compositions, methods of manufacture and articles derived from such compositions |
| EP1621323A1 (de) * | 2004-07-27 | 2006-02-01 | Hexcel Composites GmbH | Kontinuierliches Pultrusionsverfahren zur Herstellung von Tragprofilen mit hoher Leistungsfähigkeit |
| US7462656B2 (en) | 2005-02-15 | 2008-12-09 | Sabic Innovative Plastics Ip B.V. | Electrically conductive compositions and method of manufacture thereof |
| US20060189752A1 (en) * | 2005-02-18 | 2006-08-24 | Krueger David C | Composition and method for forming an article having improved properties |
| WO2006121961A1 (en) | 2005-05-09 | 2006-11-16 | Cytec Technology Corp. | Resin-soluble thermoplastic veil for composite materials |
| US7745549B2 (en) * | 2005-12-22 | 2010-06-29 | The Boeing Company | Distortional matrix of epoxy resin and diamine |
| GB0717507D0 (en) | 2007-09-07 | 2007-10-17 | Cytec Tech Corp | Composite materials and their use |
| CA2784756C (en) | 2009-12-17 | 2016-11-22 | Cytec Technology Corp. | Multifunctional additives in engineering thermoplastics |
| US9012533B2 (en) | 2010-12-14 | 2015-04-21 | The Boeing Company | Fiber-reinforced resin composites and methods of making the same |
| JP5601191B2 (ja) * | 2010-12-21 | 2014-10-08 | 住友ベークライト株式会社 | 摩擦材用フェノール樹脂組成物、変性フェノール樹脂の製造方法及び摩擦材 |
| GB201101302D0 (en) | 2011-01-25 | 2011-03-09 | Cytec Tech Corp | Benzoxazine resins |
| GB201113196D0 (en) | 2011-08-01 | 2011-09-14 | Cytec Tech Corp | Thermoset resin compositions with increased toughness |
| EP2794750B1 (de) * | 2011-12-22 | 2020-12-09 | Cytec Industries Inc. | Maleimidharze |
| GB201122296D0 (en) | 2011-12-23 | 2012-02-01 | Cytec Tech Corp | Composite materials |
| AU2013345179B2 (en) | 2012-11-15 | 2016-08-25 | Cytec Industries Inc. | Thermoset resin composite materials comprising inter-laminar toughening particles |
| GB201509292D0 (en) | 2015-05-29 | 2015-07-15 | Cytec Ind Inc | Process for preparing moulded articles from fibre-reinforced composite materials - II |
| GB201509294D0 (en) | 2015-05-29 | 2015-07-15 | Cytec Ind Inc | Process for preparing moulded articles from fibre-reinforced composite materials - I |
| JP6654480B2 (ja) * | 2016-03-18 | 2020-02-26 | 株式会社イシダ | 組合せ計量装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1169613A (en) * | 1967-02-21 | 1969-11-05 | Ciba Ltd | Epoxide Resin Compositions |
| GB1306231A (de) * | 1969-10-24 | 1973-02-07 | ||
| JPS4842454B1 (de) * | 1970-12-28 | 1973-12-12 | ||
| JPS59152A (ja) * | 1982-06-25 | 1984-01-05 | Hitachi Chem Co Ltd | 画像形成性樹脂組成物 |
| JPS5911360A (ja) * | 1982-07-09 | 1984-01-20 | Toray Ind Inc | 耐衝撃性熱可塑性樹脂組成物 |
| US4661559A (en) * | 1983-05-20 | 1987-04-28 | Union Carbide Corporation | Impact resistant matrix resins for advanced composites |
| DE3465097D1 (en) * | 1983-06-30 | 1987-09-03 | Union Carbide Corp | Epoxy compositions containing oligomeric diamine hardeners and high strength composites therefrom |
| US4608404A (en) * | 1983-06-30 | 1986-08-26 | Union Carbide Corporation | Epoxy compositions containing oligomeric diamine hardeners and high strength composites therefrom |
| JPS60243113A (ja) * | 1984-05-17 | 1985-12-03 | Sumitomo Chem Co Ltd | 強靭性に優れたエポキシ樹脂組成物 |
| US4656208A (en) * | 1985-02-19 | 1987-04-07 | Hercules Incorporated | Thermosetting epoxy resin compositions and thermosets therefrom |
| US4656207A (en) * | 1985-02-19 | 1987-04-07 | Hercules Incorporated | Epoxy thermosets having improved toughness |
| JPS6220555A (ja) * | 1985-07-18 | 1987-01-29 | Mitsubishi Electric Corp | エポキシ樹脂組成物 |
| EP0233966A1 (de) * | 1986-01-30 | 1987-09-02 | Hercules Incorporated | Durch Verwendung einer Mischung von Basen hergestellter Polyarylenpolyäther |
| EP0311349B1 (de) * | 1987-10-05 | 1996-09-11 | Imperial Chemical Industries Plc | Polymermasse |
-
1988
- 1988-10-05 US US07/253,595 patent/US4972031A/en not_active Expired - Lifetime
-
1989
- 1989-09-27 GB GB898921770A patent/GB8921770D0/en active Pending
- 1989-10-02 EP EP89310038A patent/EP0365168B1/de not_active Expired - Lifetime
- 1989-10-02 PH PH39317A patent/PH26191A/en unknown
- 1989-10-02 ES ES89310038T patent/ES2134756T3/es not_active Expired - Lifetime
- 1989-10-02 DE DE68928998T patent/DE68928998T2/de not_active Expired - Lifetime
- 1989-10-02 AT AT89310038T patent/ATE180267T1/de not_active IP Right Cessation
- 1989-10-03 MY MYPI89001351A patent/MY105596A/en unknown
- 1989-10-04 JP JP25797989A patent/JP3231753B2/ja not_active Expired - Fee Related
- 1989-10-05 KR KR1019890014285A patent/KR0173973B1/ko not_active Expired - Fee Related
-
1998
- 1998-05-18 JP JP10135721A patent/JP3092103B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| ES2134756T3 (es) | 1999-10-16 |
| ATE180267T1 (de) | 1999-06-15 |
| KR910008082A (ko) | 1991-05-30 |
| EP0365168A3 (de) | 1991-12-04 |
| DE68928998T2 (de) | 1999-10-28 |
| GB8921770D0 (en) | 1989-11-08 |
| US4972031A (en) | 1990-11-20 |
| JP3092103B2 (ja) | 2000-09-25 |
| JPH1180365A (ja) | 1999-03-26 |
| EP0365168A2 (de) | 1990-04-25 |
| EP0365168B1 (de) | 1999-05-19 |
| JPH0314872A (ja) | 1991-01-23 |
| DE68928998D1 (de) | 1999-06-24 |
| MY105596A (en) | 1994-11-30 |
| JP3231753B2 (ja) | 2001-11-26 |
| KR0173973B1 (ko) | 1999-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0365168B1 (de) | Formbare Zusammensetzung auf der Basis einer wärmehärtbaren Verbindung und einer thermoplastischen Verbindung | |
| Di Pasquale et al. | New high-performance thermoplastic toughened epoxy thermosets | |
| EP2084205B1 (de) | Verbundwerkstoffe mit verbesserter leistungsfähigkeit | |
| US5364914A (en) | Moulding composition comprising a thermoset component and thermoplast component | |
| JP2834152B2 (ja) | ポリマー組成物 | |
| WO2000027921A1 (en) | Ternary systems of benzoxazine, epoxy, and phenolic resins | |
| TWI716967B (zh) | 樹脂組合物、預浸料、層壓板、覆金屬箔層壓板以及印刷電路板 | |
| CN113736401A (zh) | 一种高耐热单组份胶黏剂及其制备方法 | |
| CN106084184A (zh) | 组合物、环氧树脂固化剂、环氧树脂组合物、热固性组合物、固化物、半导体装置以及层间绝缘材料 | |
| CN108290386B (zh) | 形成固化环氧材料的方法、由其形成的固化环氧材料及结合固化环氧材料的复合材料核 | |
| JP7013643B2 (ja) | 熱硬化性樹脂組成物 | |
| EP1226215B1 (de) | Bei variablen temperaturen härtbare zusammensetzung | |
| US5021519A (en) | Epoxy-polyimide blend for low temperature cure, high-performance resin system and composites | |
| KR0139001B1 (ko) | 방향족 디아민 경화제를 포함하는 에폭시 수지 조성물 | |
| EP0412827B1 (de) | Polymer-Zusammensetzung | |
| JP2649473B2 (ja) | エポキシ樹脂接着組成物 | |
| US4916203A (en) | Curable resin composition from epoxy compound and propargyl aromatic ether | |
| US20190241698A1 (en) | Hardener composition and associated forming method, uncured and cured epoxy resin compositions, and article | |
| JP3525745B2 (ja) | エポキシ樹脂組成物およびこのエポキシ樹脂組成物を用いた絶縁基板 | |
| EP0420467A2 (de) | Polymerzusammensetzungen und ihre Bestandteile | |
| Liu et al. | Mechanical and Dielectric Property Enhancement of Epoxy Resins With Eugenol Derived Allyl Benzoxazine | |
| KR100214390B1 (ko) | 계면접착력이 우수한 강인화 에폭시 수지 조성물 및 그 제조방법 | |
| CN111183168A (zh) | 硬化剂组合物 | |
| CN121780111A (zh) | 一种双交联氰酸酯-环氧共混胶粘剂及其制备方法 | |
| JPS60156716A (ja) | エポキシ樹脂組成物 |