PH12015500899A1 - Coverplay film, flexible printed circuit board using same, and production method therefor - Google Patents

Coverplay film, flexible printed circuit board using same, and production method therefor

Info

Publication number
PH12015500899A1
PH12015500899A1 PH12015500899A PH12015500899A PH12015500899A1 PH 12015500899 A1 PH12015500899 A1 PH 12015500899A1 PH 12015500899 A PH12015500899 A PH 12015500899A PH 12015500899 A PH12015500899 A PH 12015500899A PH 12015500899 A1 PH12015500899 A1 PH 12015500899A1
Authority
PH
Philippines
Prior art keywords
film
ethylene
coverplay
circuit board
printed circuit
Prior art date
Application number
PH12015500899A
Other languages
English (en)
Other versions
PH12015500899B1 (en
Inventor
kuwano Hiroshi
Teraki Shin
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of PH12015500899A1 publication Critical patent/PH12015500899A1/en
Publication of PH12015500899B1 publication Critical patent/PH12015500899B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PH12015500899A 2012-10-24 2015-04-22 Coverplay film, flexible printed circuit board using same, and production method therefor PH12015500899B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012234894A JP6022893B2 (ja) 2012-10-24 2012-10-24 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
PCT/JP2013/071514 WO2014064986A1 (ja) 2012-10-24 2013-08-08 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法

Publications (2)

Publication Number Publication Date
PH12015500899A1 true PH12015500899A1 (en) 2015-07-06
PH12015500899B1 PH12015500899B1 (en) 2015-07-06

Family

ID=50544367

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015500899A PH12015500899B1 (en) 2012-10-24 2015-04-22 Coverplay film, flexible printed circuit board using same, and production method therefor

Country Status (6)

Country Link
JP (1) JP6022893B2 (ja)
KR (1) KR102090580B1 (ja)
CN (1) CN104718801B (ja)
PH (1) PH12015500899B1 (ja)
TW (1) TWI593742B (ja)
WO (1) WO2014064986A1 (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015133513A1 (ja) * 2014-03-07 2017-04-06 日本ゼオン株式会社 多層硬化性樹脂フィルム、プリプレグ、積層体、硬化物、複合体及び多層回路基板
KR101797723B1 (ko) 2014-12-08 2017-11-14 셍기 테크놀로지 코. 엘티디. 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
JP6483159B2 (ja) * 2015-01-19 2019-03-13 株式会社巴川製紙所 熱硬化性接着剤組成物、熱硬化性接着フィルム、および複合フィルム
JP5979516B2 (ja) * 2015-02-18 2016-08-24 パナソニックＩｐマネジメント株式会社 プリント配線板及びその製造方法
JP2016221469A (ja) * 2015-06-01 2016-12-28 関西ペイント株式会社 複層塗膜形成方法
CN106947079B (zh) 2015-09-30 2021-08-03 荒川化学工业株式会社 改性聚酰亚胺、胶粘剂组合物、带树脂的铜箔、覆铜层叠板、印刷布线板和多层基板
EP3407814B1 (en) * 2016-01-29 2023-11-22 Forcen Inc. Sensor film for endoscopic instruments
JP6939017B2 (ja) 2016-03-30 2021-09-22 荒川化学工業株式会社 ポリイミド、ポリイミド系接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板、並びに多層配線板及びその製造方法
TWI749032B (zh) * 2016-07-20 2021-12-11 日商昭和電工材料股份有限公司 熱硬化性樹脂組成物、層間絕緣用樹脂薄膜、複合薄膜、印刷線路板及其製造方法
JP7007592B2 (ja) * 2016-11-18 2022-02-10 株式会社スリーボンド カメラモジュール用カチオン硬化性接着剤組成物、硬化物および接合体
KR102399159B1 (ko) * 2016-11-24 2022-05-17 나믹스 가부시끼가이샤 수지 조성물, 이를 사용한 열경화성 필름, 수지 경화물, 적층판, 프린트 배선판 및 반도체 장치
US20180179424A1 (en) * 2016-12-23 2018-06-28 Industrial Technology Research Institute Adhesive composition and composite substrate employing the same
CN111886263A (zh) 2018-03-28 2020-11-03 松下知识产权经营株式会社 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
WO2019188189A1 (ja) * 2018-03-28 2019-10-03 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
US11950376B2 (en) * 2018-03-30 2024-04-02 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate
CN109868102B (zh) * 2019-01-02 2021-07-16 浙江华正新材料股份有限公司 Lcp基柔性覆铜板用改性环氧树脂胶黏剂及制备方法与应用
US20220243013A1 (en) * 2019-03-29 2022-08-04 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
JP7511163B2 (ja) 2019-07-17 2024-07-05 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP7505668B2 (ja) * 2019-09-27 2024-06-25 ナミックス株式会社 変性水添ポリオレフィン、樹脂組成物、絶縁性フィルム、半導体装置、および変性水添ポリオレフィンの製造方法
CN114555740B (zh) * 2019-11-28 2024-01-05 东洋纺Mc株式会社 粘接膜、层叠体以及印刷线路板
JP7447459B2 (ja) * 2019-12-16 2024-03-12 株式会社レゾナック 積層フィルム、配線基板を製造する方法、及び半導体装置を製造する方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005248048A (ja) 2004-03-05 2005-09-15 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
JP2006169446A (ja) 2004-12-17 2006-06-29 Shin Etsu Chem Co Ltd 接着剤組成物およびカバーレイフィルム
CN101460539A (zh) * 2006-06-06 2009-06-17 日立化成工业株式会社 具有酸性取代基和不饱和马来酰亚胺基的固化剂的制造方法以及热固化性树脂组合物、预浸料及层叠板
EP2025696A1 (en) * 2006-06-06 2009-02-18 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
JP2008248141A (ja) 2007-03-30 2008-10-16 Nippon Steel Chem Co Ltd 難燃硬化性樹脂組成物
JP5649773B2 (ja) * 2007-05-31 2015-01-07 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
JP5233710B2 (ja) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
JP5439841B2 (ja) * 2009-02-16 2014-03-12 日立化成株式会社 接着剤組成物、接着シート及び半導体装置
JP5463110B2 (ja) * 2009-09-24 2014-04-09 ナミックス株式会社 カバーレイフィルム
KR20110068713A (ko) 2009-12-15 2011-06-22 원용대 Led조명기구
JP5541122B2 (ja) * 2010-11-30 2014-07-09 山一電機株式会社 フレキシブル配線板
JP2013151638A (ja) * 2011-12-27 2013-08-08 Yamaichi Electronics Co Ltd カバーレイフィルム、フレキシブル配線板およびその製造方法

Also Published As

Publication number Publication date
KR20150077429A (ko) 2015-07-07
TWI593742B (zh) 2017-08-01
KR102090580B1 (ko) 2020-03-18
JP2014086591A (ja) 2014-05-12
WO2014064986A1 (ja) 2014-05-01
CN104718801B (zh) 2017-10-13
CN104718801A (zh) 2015-06-17
JP6022893B2 (ja) 2016-11-09
TW201422705A (zh) 2014-06-16
PH12015500899B1 (en) 2015-07-06

Similar Documents

Publication Publication Date Title
PH12015500899A1 (en) Coverplay film, flexible printed circuit board using same, and production method therefor
TW201613991A (en) Dry film, cured product and printed wiring board
MY186859A (en) Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
EP3026145A4 (en) Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
PH12019000429A1 (en) Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
MY170684A (en) Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
MX368077B (es) Estructuras de capas multiples y metodos de fabricacion relacionado para componentes electronicos.
PH12016500404A1 (en) Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board
MY177771A (en) Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
WO2014112954A8 (en) Substrate for semiconductor packaging and method of forming same
EP3239246A4 (en) Halogen-free phosphorus-free silicon resin composition, and prepreg, laminated board, copper-clad plate using same, and printed circuit board
EP3056343A4 (en) Fluorine resin base material, printed wiring board, and circuit module
GB201213445D0 (en) Security wrap
MY175198A (en) Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil
EP4319511A3 (en) System, apparatus and method for utilizing surface mount technology on plastic substrates
EP3026144A4 (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
MY173569A (en) Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
BRPI0822649B8 (pt) Aparelho, método para estabelecer um padrão condutor sobre um substrato isolante plano, o substrato isolante plano e chipset do mesmo
MY176763A (en) Carrier-attached copper foil, laminate, method for manufacturing printed- wiring board and method for manufacturing electronic device
MY186451A (en) Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
TW201613442A (en) Printed wiring board
EP3290453A4 (en) Epoxy resin composition, thermoconductive material precursor, b-stage sheet, prepreg, heat-dissipating material, laminated plate, metal substrate, and printed circuit board
PH12014502195B1 (en) Surface-treated copper foil
TW200745304A (en) Adhesive film
PH12016500400A1 (en) Sheet for semiconductor processing