PH12015500230A1 - Dicing sheet and method for manufacturing device chips - Google Patents

Dicing sheet and method for manufacturing device chips

Info

Publication number
PH12015500230A1
PH12015500230A1 PH12015500230A PH12015500230A PH12015500230A1 PH 12015500230 A1 PH12015500230 A1 PH 12015500230A1 PH 12015500230 A PH12015500230 A PH 12015500230A PH 12015500230 A PH12015500230 A PH 12015500230A PH 12015500230 A1 PH12015500230 A1 PH 12015500230A1
Authority
PH
Philippines
Prior art keywords
adhesive layer
dicing sheet
energy ray
adhesive
test
Prior art date
Application number
PH12015500230A
Other languages
English (en)
Other versions
PH12015500230B1 (en
Inventor
Nakanishi Hayato
Nishida Takuo
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12015500230B1 publication Critical patent/PH12015500230B1/en
Publication of PH12015500230A1 publication Critical patent/PH12015500230A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
PH12015500230A 2012-08-03 2015-02-02 Dicing sheet and method for manufacturing device chips PH12015500230A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012172653 2012-08-03
PCT/JP2013/062772 WO2014020962A1 (ja) 2012-08-03 2013-05-02 ダイシングシートおよびデバイスチップの製造方法

Publications (2)

Publication Number Publication Date
PH12015500230B1 PH12015500230B1 (en) 2015-04-06
PH12015500230A1 true PH12015500230A1 (en) 2015-04-06

Family

ID=50027656

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015500230A PH12015500230A1 (en) 2012-08-03 2015-02-02 Dicing sheet and method for manufacturing device chips

Country Status (6)

Country Link
JP (1) JP5414953B1 (zh)
CN (1) CN104508801B (zh)
MY (1) MY172228A (zh)
PH (1) PH12015500230A1 (zh)
TW (1) TWI564363B (zh)
WO (1) WO2014020962A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015141555A1 (ja) * 2014-03-17 2015-09-24 リンテック株式会社 ダイシングシートおよび当該ダイシングシートを用いるチップの製造方法
JP6522617B2 (ja) * 2014-07-31 2019-05-29 リンテック株式会社 ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法
EP3433876B1 (de) * 2016-03-24 2023-09-13 Siltectra GmbH Ein splitting-verfahren
JP2018019022A (ja) * 2016-07-29 2018-02-01 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JPWO2020195744A1 (zh) * 2019-03-27 2020-10-01
JP2020164786A (ja) * 2019-03-29 2020-10-08 住友ベークライト株式会社 粘着テープ
CN110465888B (zh) * 2019-09-17 2021-01-15 泉州运城制版有限公司 一种版辊研磨机砂轮的安装方法
JP7276555B1 (ja) 2021-11-08 2023-05-18 大日本印刷株式会社 半導体加工用粘着テープ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369584B2 (ja) * 2000-01-21 2009-11-25 日東電工株式会社 半導体ウエハ保持保護用粘着シート
JP4781633B2 (ja) * 2004-03-29 2011-09-28 リンテック株式会社 粘着シート
KR101426572B1 (ko) * 2006-03-15 2014-08-05 신에츠 폴리머 가부시키가이샤 보유 지그, 반도체 웨이퍼의 연삭 방법
JP4991348B2 (ja) * 2006-04-06 2012-08-01 リンテック株式会社 粘着シート
JP4991350B2 (ja) * 2007-02-28 2012-08-01 リンテック株式会社 粘着シート
JP2012069586A (ja) * 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法

Also Published As

Publication number Publication date
TW201408750A (zh) 2014-03-01
JP5414953B1 (ja) 2014-02-12
CN104508801A (zh) 2015-04-08
JPWO2014020962A1 (ja) 2016-07-21
WO2014020962A1 (ja) 2014-02-06
CN104508801B (zh) 2017-11-10
MY172228A (en) 2019-11-18
TWI564363B (zh) 2017-01-01
PH12015500230B1 (en) 2015-04-06

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