NO974445D0 - Substrat for akustisk overflatebölgeanordning og fremgangsmåte for fremstilling av substratet - Google Patents

Substrat for akustisk overflatebölgeanordning og fremgangsmåte for fremstilling av substratet

Info

Publication number
NO974445D0
NO974445D0 NO974445A NO974445A NO974445D0 NO 974445 D0 NO974445 D0 NO 974445D0 NO 974445 A NO974445 A NO 974445A NO 974445 A NO974445 A NO 974445A NO 974445 D0 NO974445 D0 NO 974445D0
Authority
NO
Norway
Prior art keywords
substrate
making
wave device
surface wave
acoustic surface
Prior art date
Application number
NO974445A
Other languages
English (en)
Other versions
NO974445L (no
Inventor
Tomohiko Shibata
Yukinori Nakamura
Original Assignee
Ngk Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators Ltd filed Critical Ngk Insulators Ltd
Publication of NO974445D0 publication Critical patent/NO974445D0/no
Publication of NO974445L publication Critical patent/NO974445L/no

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
NO974445A 1996-09-27 1997-09-26 Substrat for akustisk overflatebölgeanordning og fremgangsmåte for fremstilling av substratet NO974445L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25609596A JP3321369B2 (ja) 1996-09-27 1996-09-27 表面弾性波装置およびその基板およびその製造方法

Publications (2)

Publication Number Publication Date
NO974445D0 true NO974445D0 (no) 1997-09-26
NO974445L NO974445L (no) 1998-03-30

Family

ID=17287830

Family Applications (1)

Application Number Title Priority Date Filing Date
NO974445A NO974445L (no) 1996-09-27 1997-09-26 Substrat for akustisk overflatebölgeanordning og fremgangsmåte for fremstilling av substratet

Country Status (5)

Country Link
US (2) US5936329A (no)
EP (1) EP0833446A3 (no)
JP (1) JP3321369B2 (no)
KR (1) KR100285577B1 (no)
NO (1) NO974445L (no)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100236975B1 (ko) * 1996-12-30 2000-01-15 윤덕용 질화알루미늄/수소화된 질화알루미늄/질화알루미늄 3층 박막을 이용한 탄성표면파 필터의 제조방법
JP2000201050A (ja) * 1998-11-02 2000-07-18 Ngk Insulators Ltd 表面弾性波装置用基板およびその製造方法
JP3717034B2 (ja) * 1998-11-10 2005-11-16 株式会社村田製作所 弾性表面波素子
KR20010029852A (ko) * 1999-06-30 2001-04-16 도다 다다히데 Ⅲ족 질화물계 화합물 반도체 소자 및 그 제조방법
KR100388011B1 (ko) * 2000-01-17 2003-06-18 삼성전기주식회사 ＧａＮ박막 ＳＡＷ필터 및 이를 제조하는 방법
US6900892B2 (en) * 2000-12-19 2005-05-31 Kla-Tencor Technologies Corporation Parametric profiling using optical spectroscopic systems
JP2002362999A (ja) * 2001-06-05 2002-12-18 Ngk Insulators Ltd Ｉｉｉ族窒化物膜の製造方法、ｉｉｉ族窒化物膜製造用サファイア単結晶基板、及びエピタキシャル成長用基板
TW561526B (en) * 2001-12-21 2003-11-11 Aixtron Ag Method for depositing III-V semiconductor layers on a non-III-V substrate
US7144101B2 (en) * 2003-01-31 2006-12-05 Canon Kabushiki Kaisha Piezoelectric element
JP4717344B2 (ja) * 2003-12-10 2011-07-06 キヤノン株式会社 誘電体薄膜素子、圧電アクチュエータおよび液体吐出ヘッド
JP4247629B2 (ja) * 2005-03-04 2009-04-02 セイコーエプソン株式会社 ニオブ酸カリウム堆積体およびその製造方法、表面弾性波素子、周波数フィルタ、発振器、電子回路、並びに、電子機器
JP4442471B2 (ja) * 2005-03-04 2010-03-31 セイコーエプソン株式会社 ニオブ酸カリウム堆積体およびその製造方法、圧電薄膜振動子、周波数フィルタ、発振器、電子回路、並びに、電子機器
JP4247630B2 (ja) * 2005-03-30 2009-04-02 セイコーエプソン株式会社 ニオブ酸カリウム堆積体およびその製造方法、圧電薄膜振動子、周波数フィルタ、発振器、電子回路、並びに、電子機器
JP4442489B2 (ja) * 2005-03-30 2010-03-31 セイコーエプソン株式会社 ニオブ酸カリウム堆積体およびその製造方法、表面弾性波素子、周波数フィルタ、発振器、電子回路、並びに、電子機器
CN101630947B (zh) * 2008-07-15 2012-04-18 大同股份有限公司 高频表面声波元件
US7977224B2 (en) * 2008-12-03 2011-07-12 The United States Of America As Represented By The Secretary Of The Army Method using multiple layer annealing cap for fabricating group III-nitride semiconductor device structures and devices formed thereby
JP5227870B2 (ja) * 2009-03-30 2013-07-03 日本碍子株式会社 エピタキシャル基板、半導体素子構造、およびエピタキシャル基板の作製方法
JP5230522B2 (ja) * 2009-05-14 2013-07-10 株式会社トクヤマ 積層体の製造方法、および該積層体を有する半導体デバイス
US8624690B2 (en) * 2009-12-28 2014-01-07 Seiko Epson Corporation Surface acoustic wave device, oscillator, module apparatus
US8674790B2 (en) * 2009-12-28 2014-03-18 Seiko Epson Corporation Surface acoustic wave device, oscillator, module apparatus
US9099381B2 (en) * 2012-11-15 2015-08-04 International Business Machines Corporation Selective gallium nitride regrowth on (100) silicon
WO2019056553A1 (zh) * 2017-09-22 2019-03-28 安徽安努奇科技有限公司 压电谐振器的制备方法和压电谐振器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687913A (en) * 1979-12-19 1981-07-17 Matsushita Electric Ind Co Ltd Surface elastic wave element
GB2181917B (en) * 1982-03-11 1987-11-18 Nobuo Mikoshiba Surface acoustic wave device
KR970004619B1 (ko) * 1987-10-19 1997-03-29 상요덴기 가부시끼가이샤 탄성 표면파 소자
JP2934337B2 (ja) * 1991-04-23 1999-08-16 旭化成工業株式会社 窒化ガリウム系半導体発光素子材料
US5498920A (en) * 1993-05-18 1996-03-12 Sanyo Electric Co., Ltd. Acoustic wave device and process for producing same
DE69526748T2 (de) * 1994-02-25 2002-09-05 Sumitomo Electric Industries Substrat für aluminium-nitrid dünne Film und Verfahren zu seiner Herstellung
JP2698796B2 (ja) * 1994-04-20 1998-01-19 豊田合成株式会社 ３族窒化物半導体発光素子

Also Published As

Publication number Publication date
JPH10107581A (ja) 1998-04-24
EP0833446A2 (en) 1998-04-01
NO974445L (no) 1998-03-30
EP0833446A3 (en) 2000-01-26
US5936329A (en) 1999-08-10
US6183555B1 (en) 2001-02-06
JP3321369B2 (ja) 2002-09-03
KR19980025043A (ko) 1998-07-06
KR100285577B1 (ko) 2001-04-02

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