NO326807B1 - Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av stopt plast - Google Patents
Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av stopt plast Download PDFInfo
- Publication number
- NO326807B1 NO326807B1 NO20014533A NO20014533A NO326807B1 NO 326807 B1 NO326807 B1 NO 326807B1 NO 20014533 A NO20014533 A NO 20014533A NO 20014533 A NO20014533 A NO 20014533A NO 326807 B1 NO326807 B1 NO 326807B1
- Authority
- NO
- Norway
- Prior art keywords
- conductors
- alloys
- copper
- walls
- adhesive
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title claims description 46
- 230000004888 barrier function Effects 0.000 title description 3
- 239000004033 plastic Substances 0.000 title description 2
- 229920003023 plastic Polymers 0.000 title description 2
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 14
- 238000005266 casting Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229920002492 poly(sulfone) Polymers 0.000 claims description 5
- 239000012815 thermoplastic material Substances 0.000 claims description 5
- 229910000531 Co alloy Inorganic materials 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 4
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 4
- 239000002991 molded plastic Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 2
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- 229910001093 Zr alloy Inorganic materials 0.000 claims description 2
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 claims description 2
- ZUPBPXNOBDEWQT-UHFFFAOYSA-N [Si].[Ni].[Cu] Chemical compound [Si].[Ni].[Cu] ZUPBPXNOBDEWQT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000788 chromium alloy Substances 0.000 claims description 2
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- XTYUEDCPRIMJNG-UHFFFAOYSA-N copper zirconium Chemical compound [Cu].[Zr] XTYUEDCPRIMJNG-UHFFFAOYSA-N 0.000 claims description 2
- 239000002274 desiccant Substances 0.000 claims description 2
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229910001096 P alloy Inorganic materials 0.000 claims 1
- MUYPKJRPXSXUKL-UHFFFAOYSA-N [P].[Mg].[Cu] Chemical compound [P].[Mg].[Cu] MUYPKJRPXSXUKL-UHFFFAOYSA-N 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 239000002775 capsule Substances 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 7
- 229920001169 thermoplastic Polymers 0.000 description 7
- 239000004416 thermosoftening plastic Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- -1 19500 Chemical compound 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical compound [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical class O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Specific Sealing Or Ventilating Devices For Doors And Windows (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/273,608 US6214152B1 (en) | 1999-03-22 | 1999-03-22 | Lead frame moisture barrier for molded plastic electronic packages |
| PCT/US2000/007710 WO2000057466A1 (en) | 1999-03-22 | 2000-03-22 | Lead frame moisture barrier for molded plastic electronic packages |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO20014533L NO20014533L (no) | 2001-09-18 |
| NO20014533D0 NO20014533D0 (no) | 2001-09-18 |
| NO326807B1 true NO326807B1 (no) | 2009-02-16 |
Family
ID=23044680
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20014533A NO326807B1 (no) | 1999-03-22 | 2001-09-18 | Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av stopt plast |
| NO20082268A NO20082268L (no) | 1999-03-22 | 2008-05-20 | Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av støpt plast |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20082268A NO20082268L (no) | 1999-03-22 | 2008-05-20 | Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av støpt plast |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US6214152B1 (ja) |
| EP (1) | EP1171911A1 (ja) |
| JP (1) | JP4351809B2 (ja) |
| KR (1) | KR100605328B1 (ja) |
| CN (1) | CN1146975C (ja) |
| AP (1) | AP1317A (ja) |
| AU (1) | AU3912500A (ja) |
| CA (1) | CA2372172C (ja) |
| FI (1) | FI20011860A (ja) |
| HK (1) | HK1044224B (ja) |
| IL (2) | IL145050A0 (ja) |
| MX (1) | MXPA01009488A (ja) |
| NO (2) | NO326807B1 (ja) |
| TW (1) | TW446742B (ja) |
| WO (1) | WO2000057466A1 (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003139593A (ja) * | 2001-11-07 | 2003-05-14 | Hitachi Ltd | 車載電子機器および熱式流量計 |
| SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
| US6900525B2 (en) * | 2003-05-21 | 2005-05-31 | Kyocera America, Inc. | Semiconductor package having filler metal of gold/silver/copper alloy |
| US20050048349A1 (en) * | 2003-08-28 | 2005-03-03 | Fannon Megan A. | Method of manufacturing a fuel cell array and a related array |
| US6913493B2 (en) * | 2003-11-05 | 2005-07-05 | Molex Incorporated | Sealed electrical connector assembly and method of fabricating same |
| US7821129B2 (en) * | 2004-12-08 | 2010-10-26 | Agilent Technologies, Inc. | Low cost hermetic ceramic microcircuit package |
| JP5046366B2 (ja) * | 2005-10-20 | 2012-10-10 | 信越化学工業株式会社 | 接着剤組成物及び該接着剤からなる接着層を備えたシート |
| US8560104B2 (en) * | 2009-10-14 | 2013-10-15 | Stmicroelectronics, Inc. | Modular low stress package technology |
| KR101950899B1 (ko) * | 2014-04-04 | 2019-05-10 | 알프스 알파인 가부시키가이샤 | 전자부품의 제조 방법 |
| JP6210922B2 (ja) * | 2014-04-04 | 2017-10-11 | アルプス電気株式会社 | 電子部品 |
| US10115605B2 (en) | 2016-07-06 | 2018-10-30 | Rjr Technologies, Inc. | Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3911475A (en) * | 1972-04-19 | 1975-10-07 | Westinghouse Electric Corp | Encapsulated solid state electronic devices having a sealed lead-encapsulant interface |
| JPS63184357A (ja) * | 1987-01-26 | 1988-07-29 | Japan Aviation Electronics Ind Ltd | インサート成形部品の端子保持方法 |
| US5205036A (en) * | 1988-10-17 | 1993-04-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with selective coating on lead frame |
| JPH02133932A (ja) * | 1988-11-14 | 1990-05-23 | Polyplastics Co | プレモールドパッケージとその製造方法 |
| JPH088320B2 (ja) * | 1988-12-23 | 1996-01-29 | ポリプラスチックス株式会社 | プレモールドパッケージとその製造方法 |
| DE69131784T2 (de) * | 1990-07-21 | 2000-05-18 | Mitsui Chemicals Inc | Halbleiteranordnung mit einer Packung |
| US5122858A (en) * | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
| US5244707A (en) * | 1992-01-10 | 1993-09-14 | Shores A Andrew | Enclosure for electronic devices |
| US5458716A (en) * | 1994-05-25 | 1995-10-17 | Texas Instruments Incorporated | Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid |
| US5817544A (en) * | 1996-01-16 | 1998-10-06 | Olin Corporation | Enhanced wire-bondable leadframe |
| JPH1041423A (ja) * | 1996-07-22 | 1998-02-13 | Sony Corp | 半導体パッケージの製造方法 |
| EP0930974B1 (en) * | 1996-10-10 | 2001-06-06 | RJR Polymers, Inc. | Inverted stamping process |
| US5785791A (en) * | 1997-05-05 | 1998-07-28 | Motorola, Inc. | Method of manufacturing semiconductor component |
| DE19731424C1 (de) * | 1997-07-22 | 1998-08-13 | Daimler Benz Ag | Verfahren zum Einbetten von metallischen Leitern mikroelektronischer Bauelemente in eine Kunststoffmasse |
-
1999
- 1999-03-22 US US09/273,608 patent/US6214152B1/en not_active Expired - Lifetime
-
2000
- 2000-03-22 MX MXPA01009488A patent/MXPA01009488A/es active IP Right Grant
- 2000-03-22 KR KR1020017011849A patent/KR100605328B1/ko active IP Right Grant
- 2000-03-22 EP EP00918292A patent/EP1171911A1/en not_active Ceased
- 2000-03-22 CA CA002372172A patent/CA2372172C/en not_active Expired - Lifetime
- 2000-03-22 AP APAP/P/2001/002271A patent/AP1317A/en active
- 2000-03-22 IL IL14505000A patent/IL145050A0/xx active IP Right Grant
- 2000-03-22 CN CNB008051054A patent/CN1146975C/zh not_active Expired - Lifetime
- 2000-03-22 AU AU39125/00A patent/AU3912500A/en not_active Abandoned
- 2000-03-22 WO PCT/US2000/007710 patent/WO2000057466A1/en active IP Right Grant
- 2000-03-22 JP JP2000607260A patent/JP4351809B2/ja not_active Expired - Lifetime
- 2000-03-23 TW TW089105158A patent/TW446742B/zh not_active IP Right Cessation
-
2001
- 2001-08-22 IL IL145050A patent/IL145050A/en not_active IP Right Cessation
- 2001-09-18 NO NO20014533A patent/NO326807B1/no not_active IP Right Cessation
- 2001-09-21 FI FI20011860A patent/FI20011860A/fi not_active Application Discontinuation
-
2002
- 2002-08-07 HK HK02105774.9A patent/HK1044224B/zh unknown
-
2008
- 2008-05-20 NO NO20082268A patent/NO20082268L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1344425A (zh) | 2002-04-10 |
| IL145050A (en) | 2006-12-10 |
| CA2372172C (en) | 2009-10-27 |
| AP2001002271A0 (en) | 2001-09-30 |
| TW446742B (en) | 2001-07-21 |
| MXPA01009488A (es) | 2003-08-19 |
| NO20082268L (no) | 2001-09-18 |
| AP1317A (en) | 2004-10-19 |
| US6214152B1 (en) | 2001-04-10 |
| EP1171911A1 (en) | 2002-01-16 |
| NO20014533L (no) | 2001-09-18 |
| IL145050A0 (en) | 2002-06-30 |
| CA2372172A1 (en) | 2000-09-28 |
| JP2002540600A (ja) | 2002-11-26 |
| AU3912500A (en) | 2000-10-09 |
| WO2000057466A1 (en) | 2000-09-28 |
| FI20011860A (fi) | 2001-09-21 |
| CN1146975C (zh) | 2004-04-21 |
| HK1044224A1 (en) | 2002-10-11 |
| HK1044224B (zh) | 2004-12-31 |
| KR20020010895A (ko) | 2002-02-06 |
| JP4351809B2 (ja) | 2009-10-28 |
| KR100605328B1 (ko) | 2006-07-28 |
| NO20014533D0 (no) | 2001-09-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1415335B1 (en) | Use of diverse materials in air-cavity packaging of electronic devices | |
| Ardebili et al. | Encapsulation technologies for electronic applications | |
| US5122858A (en) | Lead frame having polymer coated surface portions | |
| AU2002310466A1 (en) | Use of diverse materials in air-cavity packaging of electronic devices | |
| US5401536A (en) | Method of providing moisture-free enclosure for electronic device | |
| EP0575889A2 (en) | Semiconductor device, resin for sealing same and method of fabricating same | |
| WO2002058108A2 (en) | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith | |
| WO2001075938A2 (en) | Leadless semiconductor product packaging apparatus having a window lid and method for packaging | |
| NO326807B1 (no) | Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av stopt plast | |
| CN101471307B (zh) | 半导体封装体及其制造方法 | |
| US10818805B2 (en) | Semiconductor sensor device and method for fabricating the same | |
| US6975512B1 (en) | Thermally enhanced heat sink BGA package | |
| JP4381630B2 (ja) | 自動車制御用樹脂封止型モジュール装置 | |
| US7282104B2 (en) | Method of fixing a sealing object to a base object | |
| KR0161355B1 (ko) | 반도체장치의 제조방법 | |
| CA1304172C (en) | Metal electronic package | |
| JPH04233255A (ja) | 強誘電体装置パッケージ技術 | |
| JPH02257662A (ja) | 樹脂封止型半導体装置およびその製造方法 | |
| JPH03225945A (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK1K | Patent expired |