NO169684C - Holder for optisk element samt innretning som omfatter holderen. - Google Patents

Holder for optisk element samt innretning som omfatter holderen.

Info

Publication number
NO169684C
NO169684C NO844596A NO844596A NO169684C NO 169684 C NO169684 C NO 169684C NO 844596 A NO844596 A NO 844596A NO 844596 A NO844596 A NO 844596A NO 169684 C NO169684 C NO 169684C
Authority
NO
Norway
Prior art keywords
holder
optical element
device including
element holder
optical
Prior art date
Application number
NO844596A
Other languages
English (en)
Norwegian (no)
Other versions
NO844596L (no
NO169684B (no
Inventor
Hideaki Nishizawa
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP58218964A external-priority patent/JPS60110180A/ja
Priority claimed from JP58223020A external-priority patent/JPS60113978A/ja
Priority claimed from JP58232341A external-priority patent/JPS60124885A/ja
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of NO844596L publication Critical patent/NO844596L/no
Priority to NO903991A priority Critical patent/NO169685C/no
Publication of NO169684B publication Critical patent/NO169684B/no
Publication of NO169684C publication Critical patent/NO169684C/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/223—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10W72/07333—
    • H10W72/07336—
    • H10W72/252—
    • H10W72/352—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/884—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Gyroscopes (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Die Bonding (AREA)
NO844596A 1983-11-21 1984-11-19 Holder for optisk element samt innretning som omfatter holderen. NO169684C (no)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NO903991A NO169685C (no) 1983-11-21 1990-09-13 Fremgangsmaate for fremstilling av en optisk innretning

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP58218964A JPS60110180A (ja) 1983-11-21 1983-11-21 光素子用パツケ−ジ
JP58223020A JPS60113978A (ja) 1983-11-25 1983-11-25 光素子
JP58232341A JPS60124885A (ja) 1983-12-08 1983-12-08 受光ダイオードの製造方法

Publications (3)

Publication Number Publication Date
NO844596L NO844596L (no) 1985-05-22
NO169684B NO169684B (no) 1992-04-13
NO169684C true NO169684C (no) 1992-07-22

Family

ID=27330223

Family Applications (1)

Application Number Title Priority Date Filing Date
NO844596A NO169684C (no) 1983-11-21 1984-11-19 Holder for optisk element samt innretning som omfatter holderen.

Country Status (8)

Country Link
US (2) US4663652A (da)
EP (2) EP0313174B1 (da)
AU (1) AU592256B2 (da)
CA (1) CA1267468A (da)
DE (2) DE3486214T2 (da)
DK (2) DK163761C (da)
FI (1) FI82999C (da)
NO (1) NO169684C (da)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE82076T1 (de) * 1985-10-16 1992-11-15 British Telecomm Optische komponente mit wellenleiter.
US4845052A (en) * 1986-02-07 1989-07-04 Harris Corporation Method of packaging a non-contact I/O signal transmission integrated circuit
US4796975A (en) * 1987-05-14 1989-01-10 Amphenol Corporation Method of aligning and attaching optical fibers to substrate optical waveguides and substrate optical waveguide having fibers attached thereto
JPH01296676A (ja) * 1988-05-24 1989-11-30 Nec Corp 半導体受光装置
US5179430A (en) * 1988-05-24 1993-01-12 Nec Corporation Planar type heterojunction avalanche photodiode
JPH0258008A (ja) * 1988-08-24 1990-02-27 Sumitomo Electric Ind Ltd 光モジュール
JPH0266504A (ja) * 1988-08-31 1990-03-06 Sumitomo Electric Ind Ltd 光送信モジュールの製造装置
GB2228618B (en) * 1989-02-27 1993-04-14 Philips Electronic Associated Radiation detector
JP3067151B2 (ja) * 1990-03-13 2000-07-17 日本電気株式会社 光電気変換素子サブキャリア
FR2685561B1 (fr) * 1991-12-20 1994-02-04 Thomson Hybrides Procede de cablage d'une barrette de lasers et barrette cablee par ce procede.
DE4210331A1 (de) * 1992-03-30 1993-10-07 Bodenseewerk Geraetetech Verbindung einer Fotodiode mit einem Lichtwellenleiter
JP3484543B2 (ja) * 1993-03-24 2004-01-06 富士通株式会社 光結合部材の製造方法及び光装置
US5499312A (en) * 1993-11-09 1996-03-12 Hewlett-Packard Company Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology
US5460318A (en) * 1994-06-01 1995-10-24 Gte Laboratories Incorporated Diebonding geometry for packaging optoelectronics
DE19600306C1 (de) * 1996-01-05 1997-04-10 Siemens Ag Halbleiter-Bauelement, insb. mit einer optoelektronischen Schaltung bzw. Anordnung
DE19621124A1 (de) * 1996-05-24 1997-11-27 Siemens Ag Optoelektronischer Wandler und dessen Herstellungsverfahren
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
US5949655A (en) * 1997-09-09 1999-09-07 Amkor Technology, Inc. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
US5867368A (en) * 1997-09-09 1999-02-02 Amkor Technology, Inc. Mounting for a semiconductor integrated circuit device
JP2000081524A (ja) * 1998-09-07 2000-03-21 Sony Corp 光送受信システム
US6216939B1 (en) * 1998-12-31 2001-04-17 Jds Uniphase Photonics C.V. Method for making a hermetically sealed package comprising at least one optical fiber feedthrough
US6448635B1 (en) 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip
US6536958B2 (en) 2000-12-20 2003-03-25 Triquint Technology Holding Co. Optical device package with hermetically bonded fibers
US6564454B1 (en) * 2000-12-28 2003-05-20 Amkor Technology, Inc. Method of making and stacking a semiconductor package
GB2372633A (en) * 2001-02-24 2002-08-28 Mitel Semiconductor Ab Flip-chip mounted optical device
JP2002250846A (ja) * 2001-02-26 2002-09-06 Seiko Epson Corp 光モジュール及びその製造方法並びに光伝達装置
KR100424611B1 (ko) * 2001-04-20 2004-03-27 울트라테라 코포레이션 저형상 감광성 반도체 패키지
FR2832252B1 (fr) 2001-11-14 2004-03-12 St Microelectronics Sa Boitier semi-conducteur a capteur, muni d'un insert de fixation
JP2004179258A (ja) * 2002-11-25 2004-06-24 Hamamatsu Photonics Kk 紫外線センサ
US7564125B2 (en) * 2002-12-06 2009-07-21 General Electric Company Electronic array and methods for fabricating same
DE10308890A1 (de) * 2003-02-28 2004-09-09 Opto Tech Corporation Gehäusestruktur für eine Lichtemissionsdiode und Verfahren zu dessen Herstellung
US6883978B2 (en) * 2003-06-26 2005-04-26 Matsushita Electric Industrial Co., Ltd. Low cost package design for fiber coupled optical component
US7284913B2 (en) 2003-07-14 2007-10-23 Matsushita Electric Industrial Co., Ltd. Integrated fiber attach pad for optical package
US7410088B2 (en) * 2003-09-05 2008-08-12 Matsushita Electric Industrial, Co., Ltd. Solder preform for low heat stress laser solder attachment
US7021838B2 (en) 2003-12-16 2006-04-04 Matsushita Electric Industrial Co., Ltd. Optimizing alignment of an optical fiber to an optical output port
US7140783B2 (en) * 2004-02-06 2006-11-28 Matsushita Electric Industrial Co., Ltd. Diamond 2D scan for aligning an optical fiber to an optical output port
US20050202826A1 (en) * 2004-03-12 2005-09-15 Coretek Opto Corp. Optical subassembly
DE102004039883B3 (de) * 2004-08-17 2006-06-14 Schott Ag Transparentes Element, insbesondere Verbundglaselement, und Verfahren zum Tausch eines Verbrauchers darin
US7263260B2 (en) * 2005-03-14 2007-08-28 Matsushita Electric Industrial Co., Ltd. Low cost, high precision multi-point optical component attachment
CN100590890C (zh) * 2005-07-28 2010-02-17 中华电信股份有限公司 一种可施以被动封装的高速光电元件晶粒
JP2007165811A (ja) 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置
JP2007201361A (ja) * 2006-01-30 2007-08-09 Shinko Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法
US20080012087A1 (en) * 2006-04-19 2008-01-17 Henri Dautet Bonded wafer avalanche photodiode and method for manufacturing same
JP5270569B2 (ja) * 2006-12-18 2013-08-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 透明基板上のｌｅｄの照明装置
US7514724B2 (en) * 2007-03-23 2009-04-07 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Solid state light source having a variable number of dies
CN102024717B (zh) 2010-08-21 2012-03-07 比亚迪股份有限公司 一种半导体芯片的共晶方法及共晶结构
DE102017126109A1 (de) * 2017-11-08 2019-05-09 Osram Opto Semiconductors Gmbh Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements
FR3094141A1 (fr) * 2019-03-18 2020-09-25 Commissariat à l'Energie Atomique et aux Energies Alternatives procede de fabrication d’un composant optoelectronique a transmission optique en face arriere
FR3142285A1 (fr) * 2022-11-18 2024-05-24 Stmicroelectronics (Grenoble 2) Sas Circuit integre comprenant un assemblage d’une puce electronique, d’un element optique et d’un substrat et procede de fabrication correspondant

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757127A (en) * 1970-08-10 1973-09-04 Cogar Corp Photodetector packing assembly
US3959522A (en) * 1975-04-30 1976-05-25 Rca Corporation Method for forming an ohmic contact
GB2026235B (en) * 1978-06-06 1982-07-21 Nippon Electric Co Light emitting diode mounting structure for optical fibre communications
JPS5513963A (en) * 1978-07-17 1980-01-31 Nec Corp Photo semiconductor device
US4268113A (en) * 1979-04-16 1981-05-19 International Business Machines Corporation Signal coupling element for substrate-mounted optical transducers
FR2466866A1 (fr) * 1979-10-05 1981-04-10 Thomson Csf Procede de couplage entre une fibre optique et une diode opto-electronique, et tete d'emission ou de reception realisee par ce procede
JPS5660037A (en) * 1979-10-22 1981-05-23 Mitsubishi Electric Corp Semiconductor device
FR2494044A1 (fr) * 1980-11-12 1982-05-14 Thomson Csf Phototransistor a heterojonction en technologie planar et procede de fabrication d'un tel phototransistor
US4355321A (en) * 1981-02-02 1982-10-19 Varian Associates, Inc. Optoelectronic assembly including light transmissive single crystal semiconductor window
JPS5891644A (ja) * 1981-11-26 1983-05-31 Toshiba Corp 半導体装置
JPS58128762A (ja) * 1982-01-27 1983-08-01 Fujitsu Ltd 半導体装置
JPS58158950A (ja) * 1982-03-16 1983-09-21 Nec Corp 半導体装置
JPS59220982A (ja) * 1983-05-31 1984-12-12 Sumitomo Electric Ind Ltd 光素子用パッケ−ジ

Also Published As

Publication number Publication date
US4727649A (en) 1988-03-01
EP0313174B1 (en) 1993-09-22
AU592256B2 (en) 1990-01-04
EP0145316A3 (en) 1986-07-30
DE3481571D1 (de) 1990-04-12
FI82999B (fi) 1991-01-31
EP0145316A2 (en) 1985-06-19
US4663652A (en) 1987-05-05
EP0145316B1 (en) 1990-03-07
NO844596L (no) 1985-05-22
FI844473L (fi) 1985-05-22
AU1319788A (en) 1988-06-09
DK163761C (da) 1992-08-24
EP0313174A3 (en) 1989-11-15
DK33291D0 (da) 1991-02-26
DK163761B (da) 1992-03-30
DE3486214T2 (de) 1994-01-13
CA1267468C (en) 1990-04-03
DK33291A (da) 1991-02-26
FI844473A0 (fi) 1984-11-14
DE3486214D1 (de) 1993-10-28
CA1267468A (en) 1990-04-03
EP0313174A2 (en) 1989-04-26
FI82999C (fi) 1991-05-10
NO169684B (no) 1992-04-13
DK547384A (da) 1985-05-22
DK547384D0 (da) 1984-11-16

Similar Documents

Publication Publication Date Title
NO169684C (no) Holder for optisk element samt innretning som omfatter holderen.
NO842099L (no) Fremgangsmaate for styring av sagblad, samt anordning for utfoerelse av fremgangsmaaten
FI891220L (fi) Uppvaermningsfilmer som mottar mikrovaogor samt packningar som innehaoller saodana filmer.
DE68923796D1 (de) Antidiebstahlvorrichtung für brillengestelle.
DE3486405D1 (de) Optisches Speicherelement.
NL185311C (nl) Lopende-golf elektro-optische inrichting.
FI842317L (fi) Spiralvaev med liten genomslaepplighet samt foerfarande.
FR2513028B1 (fr) Dispositif laser
FI844736A0 (fi) Alkylfenol- och amino-fenol -kompositioner samt dessa innehaollande tvaotaktsmotoroljor och -braenslen.
FI840436L (fi) Flaektfoersedd anordning.
DE3770283D1 (de) Optisches speichergeraet.
DE3482946D1 (de) Elektrochromische vorrichtung.
DE68922472D1 (de) Optisches Gerät.
IT8421030A0 (it) Dispositivo assortitore.
DE3678311D1 (de) Optisches plattengeraet.
DE3483249D1 (de) Vereinfachte pruefvorrichtung.
FI843253A0 (fi) Soembildningsorgan samt verktyg foer soemmens bildande.
DE3889523D1 (de) Optisches Gerät.
FI840747A0 (fi) Kinolonkarbonsyror, foerfarande foer deras framstaellning samt dessa innehaollande antibakteriella aemnen
FI842827A7 (fi) Sulkulaite.
DE3787388D1 (de) Optisches Aufzeichnungsgerät.
DE3678998D1 (de) Linsenschleifvorrichtung.
FI851112L (fi) Pyridinyl-2-pyrimidinamider anvaendbara som kardiotoniska aemnen samt deras framstaellning.
NO159752C (no) Lastm leanordning for heiseverk.
FI841526L (fi) Tillvaextfraemjande foderaemnen och tillsatsaemnen foer foder samt foerfarande foer framstaellning daerav.