JP5270569B2 - 透明基板上のledの照明装置 - Google Patents
透明基板上のledの照明装置 Download PDFInfo
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- JP5270569B2 JP5270569B2 JP2009540948A JP2009540948A JP5270569B2 JP 5270569 B2 JP5270569 B2 JP 5270569B2 JP 2009540948 A JP2009540948 A JP 2009540948A JP 2009540948 A JP2009540948 A JP 2009540948A JP 5270569 B2 JP5270569 B2 JP 5270569B2
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- Prior art keywords
- lighting device
- contact pad
- conductive layer
- led
- zno
- Prior art date
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- 239000000758 substrate Substances 0.000 title description 8
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Push-Button Switches (AREA)
Description
担体板と、
前記担体板の第1の表面に提供された、シート抵抗Rtclを有する構造化導電層と、
端子を有するLEDと、
前記導電層の上に提供された、シート抵抗Rcpを有する接触パッドと、
を有し、
比Rtcl/Rcpは、1よりも大きく、
前記接触パッドは、第1の部分を有し、
前記LEDの端子は、前記第1の部分を介して前記導電層に結合され、
前記接触パッドは、さらに、前記LEDから遠ざかるように延伸する第2の部分を有し、前記導電層における電流密度が抑制されることを特徴とする。
Lcp≦Wcp×Rtcl/Rcp
の関係を満たす。
Lcp/Wcp<Rtcl/Rcp
である照明装置100においてのみ、ロバスト性が向上し、有益であることが見出されている。これは、その他の場合は、接触パッド140の抵抗は、Lcp×Wcpの領域の導電層120の抵抗よりも大きくなることにより理解される。本発明に従って、接触パッド140を延伸することにより、55%を超える電力消費の抑制が得られる。従って、本発明では、照明装置100のロバスト性向上に実質的に貢献できる。
Lcp≦Wcp×Rtcl/Rcp
が維持されることが有意である。
Claims (5)
- 透明担体板と、
前記透明担体板の第1の表面に提供された、シート抵抗Rtclを有する構造化された透明導電層と、
端子を有するLEDと、
前記透明導電層の上に提供された、シート抵抗Rcpを有する接触パッドと、
を有する照明装置であって、
比Rtcl/Rcpは、1よりも大きく、
前記接触パッドは、第1の部分を有し、
前記LEDの端子は、前記第1の部分を介して前記透明導電層に結合され、
前記接触パッドは、さらに、前記LEDから遠ざかるように延伸する第2の部分を有し、前記透明導電層における電流密度が抑制され、
前記第2の部分は、長さがL cp の第1の端部と、幅がW cp の第2の端部とを有し、
L cp およびW cp は、以下の関係
L cp <W cp ×R tcl /R cp
を満たし、
前記透明導電層は、分離溝により構造化されており、
前記第2の部分は、前記溝に対して垂直に延伸することを特徴とする照明装置。 - 前記第2の部分の幅Wcpは、前記接触パッドの、前記第2の部分が接続される第1の部分の寸法よりも小さいことを特徴とする請求項1に記載の照明装置。
- 前記接触パッドは、金属を有することを特徴とする請求項1または2に記載の照明装置。
- 前記第2の部分は、鋭角部がない形態であることを特徴とする請求項1乃至3のいずれか一つに記載の照明装置。
- 前記導電層は、金属酸化物を有し、該金属酸化物は、InOx:Sn、SnOx:F、SnOx:Sb、ZnOx:Ga、ZnOx:B、ZnOx:F、ZnOx:Al、およびAg/TiOxからなる群から選定されることを特徴とする請求項1乃至4のいずれか一つに記載の照明装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06126320 | 2006-12-18 | ||
EP06126320.8 | 2006-12-18 | ||
PCT/IB2007/055029 WO2008075248A2 (en) | 2006-12-18 | 2007-12-11 | Lighting device of leds on a transparent substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010514152A JP2010514152A (ja) | 2010-04-30 |
JP5270569B2 true JP5270569B2 (ja) | 2013-08-21 |
Family
ID=39420372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009540948A Active JP5270569B2 (ja) | 2006-12-18 | 2007-12-11 | 透明基板上のledの照明装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8115228B2 (ja) |
EP (1) | EP2095434B1 (ja) |
JP (1) | JP5270569B2 (ja) |
CN (1) | CN101563794B (ja) |
TW (1) | TW200843146A (ja) |
WO (1) | WO2008075248A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8541805B2 (en) | 2010-05-13 | 2013-09-24 | Panasonic Corporation | Mounting substrate and manufacturing method thereof, light-emitting module and illumination device |
JP5992652B1 (ja) | 2013-09-02 | 2016-09-14 | フィリップス ライティング ホールディング ビー ヴィ | 透明なコンピュータ構造 |
TWI536613B (zh) | 2013-12-16 | 2016-06-01 | 隆達電子股份有限公司 | 固態發光模組 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1267468A (en) * | 1983-11-21 | 1990-04-03 | Hideaki Nishizawa | Optical device package |
JP2554358B2 (ja) * | 1988-05-25 | 1996-11-13 | 沖電気工業株式会社 | 配線基板及び配線基板の製造方法 |
JP3068176B2 (ja) * | 1990-11-29 | 2000-07-24 | スタンレー電気株式会社 | Led表示装置の製造方法 |
JPH0541542A (ja) * | 1991-08-07 | 1993-02-19 | Stanley Electric Co Ltd | 半導体デバイス基板の製造方法 |
US5798811A (en) * | 1993-12-21 | 1998-08-25 | U.S. Philips Corporation | Picture display device with partially clear contact areas |
DE19854899C1 (de) * | 1998-11-27 | 1999-12-30 | Siemens Ag | Beleuchtungseinheit |
ATE551731T1 (de) * | 2001-04-23 | 2012-04-15 | Panasonic Corp | Lichtemittierende einrichtung mit einem leuchtdioden-chip |
JP4134573B2 (ja) * | 2002-02-15 | 2008-08-20 | 松下電工株式会社 | 半導体発光素子 |
JP2004199754A (ja) * | 2002-12-17 | 2004-07-15 | Sharp Corp | デジタル再生装置 |
US6958494B2 (en) * | 2003-08-14 | 2005-10-25 | Dicon Fiberoptics, Inc. | Light emitting diodes with current spreading layer |
US20050133806A1 (en) * | 2003-12-17 | 2005-06-23 | Hui Peng | P and N contact pad layout designs of GaN based LEDs for flip chip packaging |
TWI244228B (en) * | 2005-02-03 | 2005-11-21 | United Epitaxy Co Ltd | Light emitting device and manufacture method thereof |
JP2006245379A (ja) * | 2005-03-04 | 2006-09-14 | Stanley Electric Co Ltd | 半導体発光素子 |
-
2007
- 2007-12-11 WO PCT/IB2007/055029 patent/WO2008075248A2/en active Application Filing
- 2007-12-11 JP JP2009540948A patent/JP5270569B2/ja active Active
- 2007-12-11 EP EP07849429.1A patent/EP2095434B1/en not_active Not-in-force
- 2007-12-11 US US12/518,644 patent/US8115228B2/en not_active Expired - Fee Related
- 2007-12-11 CN CN2007800469953A patent/CN101563794B/zh active Active
- 2007-12-17 TW TW096148259A patent/TW200843146A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US8115228B2 (en) | 2012-02-14 |
WO2008075248A2 (en) | 2008-06-26 |
JP2010514152A (ja) | 2010-04-30 |
CN101563794B (zh) | 2012-05-30 |
EP2095434B1 (en) | 2019-06-12 |
EP2095434A2 (en) | 2009-09-02 |
US20100059784A1 (en) | 2010-03-11 |
TW200843146A (en) | 2008-11-01 |
CN101563794A (zh) | 2009-10-21 |
WO2008075248A3 (en) | 2008-08-21 |
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