TW200843146A - Lighting device of LEDs on a transparent substrate - Google Patents
Lighting device of LEDs on a transparent substrate Download PDFInfo
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- TW200843146A TW200843146A TW096148259A TW96148259A TW200843146A TW 200843146 A TW200843146 A TW 200843146A TW 096148259 A TW096148259 A TW 096148259A TW 96148259 A TW96148259 A TW 96148259A TW 200843146 A TW200843146 A TW 200843146A
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- conductive layer
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- emitting diode
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- 239000000758 substrate Substances 0.000 title abstract description 12
- 239000010410 layer Substances 0.000 claims description 36
- 238000005286 illumination Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229910007667 ZnOx Inorganic materials 0.000 claims description 8
- 229910006854 SnOx Inorganic materials 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 101150054451 Rtel1 gene Proteins 0.000 claims description 2
- 230000001154 acute effect Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 4
- 229910003087 TiOx Inorganic materials 0.000 claims 1
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 8
- 229910001887 tin oxide Inorganic materials 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
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- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Push-Button Switches (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
200843146 九、發明說明: 【發明所屬之技術領域】 本發明係關於一安置於一透明基板上之一包括發光二極 體之發光裝置。特定言之,本發明關於一發光二極體之接 觸界面至一鍵有透明電極之玻璃基板。 【先前技術】
一如先前所述之發光裝置已知於US 6270236(美國案案 號6270236)。該文件揭示一包含具有透明電子導電結構(例 如,一氧化錫複合膜層)之透明載體基板在嵌板一表層上 之發光裝置。在載體基板上一發光二極體一具有接線端位 於發光發射面兩側一以如此之方法安置以便接線端經由一 導電粘合劑(如一焊接凸塊)與傳導結構接觸。且特定言 之,該傳導結構可具有一附加電子導電接觸墊,其是以一 在與發光二極體接線端接觸之區域内鍍有金屬之形式存在 之。該方法之優勢是經揭示為在接觸穩定性中之一增加。 然而,經驗顯示由在發光二極體接線端直接臨近^之金 屬接觸墊提供之增加料性是被限制的。由於氧化锡複合 膜層T低傳導性(R□〜15 0hm)該發光裝置有故障之傾向。 尤其是在高安培電流測試和過壓使用期之下,該妒置舍具 有接觸塾/氧化錫複合膜層之發光二極體之電子接觸:: 極局部之熱耗散消失時而失敗。 【發明内容】 提供一 及一配有 發光裝置是本發明之一目標,包括一 導電層之基板,其堅固至大功率耗損 發光二極體 ,尤其是在 127224.doc 200843146 高安培電流條件之下。該目標隨著根據本發明之如請求項 1之定義之發光裝置而實現。一發光裝置包括一載板、」 構造電子導電層、提供於載板之第一表層上並有一表面電 阻Rtel,一發光二極體有一接線端,一接觸墊,安置于塗 層之上,有一表面電阻Rep,係數汉…爪巧比!大,該接觸墊 有一第一令件,發光二極體接線端是經由第一零件被|馬人 於電子導電層上,表示該接觸墊進一步含有一延伸遠離發 光一極體之弟一零件以減少導電層内在之電流密产。 本發明提供一發光裝置其在透明導電層内實現了功率耗 損之一明顯減少。因為其是最高功率主要之耗損點。該功 率損耗是由一直接於該金屬接觸墊外之該導電層中之增加 電流密度所引起。通過延伸主要在發光二極體接線端之旁 之接觸墊,電流密度在塗層内之增加是顯著緩和的。因 此,根據本發明之發光裝置對於功率耗損是足夠堅固的, 尤其是在高安培電流情況之下。另外,當電壓下降至透明 導電層上之減少,該發光裝置之效能也隨之增加。 在本發明之一種事實案例令,接觸墊之第二零件有一具 有長度Lcp之第一邊緣,一含有寬度Wep,Lcp及之第二 邊緣’其滿足LcpSWcp*Rtci/Rcpi關係。 根據本發明之一種實施案例,接觸墊之第二零件是無銳 角之。此有利地保護增加電流之高度,且其一般都被發現 於銳角附近。 在本發明之一種實施案例中該電子導電層是被一分離凹 槽構造之’且接觸塾之第:零件是垂直於凹槽延伸遠離發 127224.doc 200843146 光二極體。 在本發日月> < 一種貝施案例中第二零件之寬度Wcp比其連 接之接觸塾的第—零件之尺寸小。此有利地最優化發光裝 置100之透明度。 在一種案例中該接觸墊包括一金屬製品。 在種案例中該電子導電層包含一金屬氧化物,其來自 由 〇x Sn ’ Sn〇x:F,SnOx:Sb,ZnOx:Ga,ZnOx:B, ZnOx.F ’ Zn〇x:Al及 Ag/Ti〇x組成之群組。 本l明之此等及其它方面將參考下文描述之具體實施例 變得明顯及被闡明。 【實施方式】 圖1顯示一根據先前技術之發光裝置1〇〇。其包括一透明 基板110 °亥透明基板通常由玻璃或一類似聚氣乙烯塑料 製成忒玻璃肷板在其表層之一者上被裝置於一透明 電子導電層或一塗層120。一般來說該塗層12〇是由一氧化 錫複合膜層構成。該塗層12〇藉由分離凹槽125,通常經由 雷射剝蝕加以構造,。發光二極體13〇被安置於橫跨該凹 槽125。發光二極體接線端丨3 1藉由一導電黏著劑丨5〇,如 膠合劑或焊接劑被耦合於導電層120上。為提高發光二極 體之連接穩定性,一附加金屬圖層可被塗敷於氧化錫複合 膜層120之上部以為焊接凸塊15〇形成一接觸墊14〇。連接 塗層120之分離零件於一電源(未顯示)將點亮該發光二極 體。如圖1所指,該發光二極體130是在一向下方向發光。 也就是說,是經由透明基板11 〇。 127224.doc 200843146 該發光裝置如此之製造是非常適合於裝飾之應用。另 外’其等可被適用作為玻璃門,在櫥窗内,作為壁板,或 甚至作為牆本身。導電層120及發光二極體130可被構造及 安置以製造(多顏色)數字化形狀點亮在一另外(幾乎)完全 透明嵌板上。或者,可顯示文字訊息。例如,當發光裝置 被用作為商店之窗戶時,商店的名字可被點亮。 為了維護針對生產線後段之更昂貴落差,玻璃嵌板12〇 上之電子構造是經常在壓力情況下被測試。經驗顯示許多 發光裝置由於在此測試情況下之高安培電流和/或裝置之 已過使用期而失敗。裝置100之失敗是由熱燃點引起,導 致在發光二極體130與導電層120間之電連接之損失。由於 具有限表面電阻Rtcl之塗層120内電流密集而導致之能量耗 損造成該熱點上升。該情況由於表面電阻Rw之溫度依賴 性甚至會進一步惡化。 本發明為此技術問題提供一解決方法。根據本發明該接 觸墊140被設計含有兩個零件(圖2所示)。一第一零件i4i對 應于已知於先前技術之接觸墊,及一延伸遠離發光二極體 130之第二零件142。此方法在比較高之導電金屬接觸墊 140與比較低之導電透明層12〇之間引起一更大之界線。因 此,相較於先前技術,在本發明之一種具體實施例生效中 直接地外圍於金屬接觸墊140之透明導電層内之電流密度 210,220顯著減少。圖3用圖式形式對此進行了描述,其 中先别技術在左手面而發明在右手面。較佳地,接觸墊 140之第二零件142是無(明顯)角度的,及在導電層上有 127224.doc 200843146 W 1 該圓形界線防止增加電流密度210,220之高 度通常被發現於臨近(明顯)角度點處。 通:透明塗層是由氧化錫複合膜層構成。但是,許多 金屬氧化物材料被熟知適用於如前閣述類之發光裝置。它 們通常因其發光透明把β曾 透月〖生及導電性之特殊綜合特徵被選用。 此專金屬氧化物之會办丨女, 籾之實例有· In〇x:Sn,SnOx:F,SnOx:Sb,
ZnOx:Ga,ΖηΟ η,7 a ^ n〇x.B ’ Zn〇x:F,Ζη〇χ:Αι及 Ag/Ti〇x。將氧化 錫複合膜層作為-普遍之實例,- 350 nm厚之透明電子導 電層120,-般來說有—表面電阻^广i5 □。為提高發光 裝置之穩定性,該接觸墊14〇應有—比導電層12〇低的多之 電阻。金屬塗層是相當適合此目的,例如一2〇〇⑽厚之鍍 銀層可有一低至Rcp〜〇.2 Q/口之表面電阻。 如圖2所顯示,接觸墊14〇之第二零件142含有一有一長 度Lep之較長鑲邊145及一有一寬度之較短鑲邊146。應 注意該第二零件可能是由幾個延線構成。已發現接觸墊之 延線僅有益於發光裝置100針對—長度對寬度比 堅固性上增加。此可被理解為,當接觸 墊140之另外電阻可能比區域LcpXWcpi導電層12〇之電阻 大。通過延伸接觸墊140符合本發明功能耗損之減少超過 55%已實現。因此,本發明在發光裝置之堅固性方面有著 實質性的貢獻。 為保護裝載於玻璃基板110上之發光二極體13〇遠離外 界,可較佳的使用一第二玻璃嵌板(未顯示)來複合它們。 為了構造之穩定性’一諸如氧化錫複合膜層 127224.doc -10- 200843146 (polyvynilbutyral ; PVB)透明薄片,通常填充複合玻璃板 110間之空隙。由於金屬接觸墊14〇是不透明的,盡可能組 合接觸墊於同樣不透明之發光二極體13〇之下是較佳地。 因此’亦較佳地是應用頂光二極管13〇而不是被揭示於先 前技術之底光二極管1 3〇。該方法之優勢在於該發光裝置 100之光透明度可達到最大值。 為進一步優化其透明度,其有益於構造接觸墊14〇之延 線142以最大化該接觸墊-導電層界線。此較佳的是藉由垂 直於分離凹槽125延伸而實現,形成圖2中所顯示之延線 142b。與發光裝置1〇〇之最優化透明度一致,第二零件之 142寬度Wcp 146有利地比第二零件142連接之第一零件141 之接觸墊尺寸小,而保持LcpSWep*Rtcl/Rcp之關係。 儘管本發明已根據如上所述之實施案例被闡述,但顯然 其它實施案例可能交替的被使用以達到同樣之目的。因此 本發明之範圍不僅限於上述之實施例,而是同樣可應用於 任何其它裝置’在該處發光二極體是被安置於一透明基板 上及經由透明導電層電子定址。 【圖式簡單說明】 本發明之更多細節、特徵及優勢連同圖式作為範本及最 優方案被揭示於下列描述中。 圖1顯示一先前發光裝置之側面圖。 圖2顯示一根據本發明之發光裝置之俯視圖。 圖3用概要顯示一在先前技術之發光裝置内(卢側)及 根據本發明之裝置内(右側)之電流密度。 127224.doc 11 200843146 【主要元件符號說明】 100 110 120 一 125 130 131 140 (" 141 142 142a 142b 145 146 150 210 220 發光裝置 玻璃嵌板 塗層 凹槽 發光二極體 發光二極體接線端 接觸墊 第一零件 第二零件 延線 延線 較長延線 較短延線 導電黏著劑 電流密度 電流密度 127224.doc -12-
Claims (1)
- 200843146 十、申請專利範圍: L 一發光裝置(100)包括 - 一載板(11 0), -一構造電子導電層(120),其安置於載板之第一表層 上並有一表面電阻Rtcl, -一發光二極體(130),其具有一接線端(131), " 一接觸墊(丨40),其安置于塗層(120)上,具有_夺 面電阻Rep,Rtel/Rep比率比1大,該接觸墊有一第一定件 (141), " - 發光二極體接線端(131)經由一第一零件(141)被耦 合於電子導電層上, 特徵化為 該接觸墊進一步有一第二零件(142)延伸遠離發光二極體 (130)以減少導電層(120)之電流密度。 2·根據請求項1之發光裝置,其中第二零件(142)具有一長 度為Lcp之第一鑲邊(I45)及一寬度為wcp之第二镶邊 (146),Lcp及 Wcp滿足關係 Lcp<Wcp*Rtcl/Rcp。 3. 根據請求項2之發光裝置,其中之載板(110)及電子導電 層(120)皆是透明的。 4. 根據先前任何請求項之發光裝置,其中 - 電子導電層(120)是被一分離凹槽(125)所構造,及 - 該第二零件(142)垂直該凹槽(I25)而延伸。 5. 根據請求項2之發光裝置,其中第二零件(146)之寬产w c p (146)比第二零件連接之接觸墊的第一零件(14丨)尺寸 127224.doc 200843146 6 ·根據請求項】 只1之發光裝置,其中該接觸墊(140)包括一金 屬製品。 7·根據明求項1之發光裝置,其中該第二零件(142)是無銳 角的。 8·根據請求項1之發光裝置,其中該電子導電層(12〇)包括 一金屬氧化物,其是選自由InOx:Sn,SnOx:F, SnOx.Sb ’ ZnOx:Ga,ZnOx:B,ZnOx:F,ZnOx:Al 及 Ag/TiOx組成之群組。 127224.doc
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