NO154363C - Leder-ramme til bruk for brikker med integrerte kretser. - Google Patents
Leder-ramme til bruk for brikker med integrerte kretser.Info
- Publication number
- NO154363C NO154363C NO800226A NO800226A NO154363C NO 154363 C NO154363 C NO 154363C NO 800226 A NO800226 A NO 800226A NO 800226 A NO800226 A NO 800226A NO 154363 C NO154363 C NO 154363C
- Authority
- NO
- Norway
- Prior art keywords
- ics
- integrated circuits
- wireless frame
- wireless
- frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Transceivers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/014,397 US4195193A (en) | 1979-02-23 | 1979-02-23 | Lead frame and chip carrier housing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO800226L NO800226L (no) | 1980-08-25 |
| NO154363B NO154363B (no) | 1986-05-26 |
| NO154363C true NO154363C (no) | 1986-09-03 |
Family
ID=21765252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO800226A NO154363C (no) | 1979-02-23 | 1980-01-30 | Leder-ramme til bruk for brikker med integrerte kretser. |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US4195193A (es) |
| EP (1) | EP0015111B1 (es) |
| JP (1) | JPS55117263A (es) |
| AR (1) | AR220032A1 (es) |
| AT (1) | ATE2034T1 (es) |
| AU (1) | AU528043B2 (es) |
| BR (1) | BR8000587A (es) |
| CA (1) | CA1127319A (es) |
| DE (1) | DE3061294D1 (es) |
| DK (1) | DK155260C (es) |
| ES (1) | ES8103478A1 (es) |
| FI (1) | FI70348C (es) |
| HK (1) | HK4685A (es) |
| IL (1) | IL59455A (es) |
| MX (1) | MX147540A (es) |
| NO (1) | NO154363C (es) |
| NZ (1) | NZ192695A (es) |
| SG (1) | SG44684G (es) |
Families Citing this family (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3535863A (en) * | 1968-01-15 | 1970-10-27 | Hugh Albert Caughlin | Swath separator |
| US4303934A (en) * | 1979-08-30 | 1981-12-01 | Burr-Brown Research Corp. | Molded lead frame dual in line package including a hybrid circuit |
| US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| WO1982001803A1 (en) * | 1980-11-07 | 1982-05-27 | Mulholland Wayne A | Multiple terminal two conductor layer burn-in tape |
| US4330683A (en) * | 1980-12-03 | 1982-05-18 | Bell Telephone Laboratories, Incorporated | Encapsulation for semiconductor device |
| DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
| EP0069733A1 (en) * | 1981-01-15 | 1983-01-19 | Mostek Corporation | Integrated circuit package |
| FR2498814B1 (fr) * | 1981-01-26 | 1985-12-20 | Burroughs Corp | Boitier pour circuit integre, moyen pour le montage et procede de fabrication |
| US4445271A (en) * | 1981-08-14 | 1984-05-01 | Amp Incorporated | Ceramic chip carrier with removable lead frame support and preforated ground pad |
| US4496965A (en) * | 1981-05-18 | 1985-01-29 | Texas Instruments Incorporated | Stacked interdigitated lead frame assembly |
| US4465898A (en) * | 1981-07-27 | 1984-08-14 | Texas Instruments Incorporated | Carrier for integrated circuit |
| JPH01132148A (ja) * | 1981-07-27 | 1989-05-24 | Texas Instr Inc <Ti> | 集積回路用キャリア |
| US4472876A (en) * | 1981-08-13 | 1984-09-25 | Minnesota Mining And Manufacturing Company | Area-bonding tape |
| US4463217A (en) * | 1981-09-14 | 1984-07-31 | Texas Instruments Incorporated | Plastic surface mounted high pinout integrated circuit package |
| DE3303165C2 (de) * | 1982-02-05 | 1993-12-09 | Hitachi Ltd | Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern |
| JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
| US4445736A (en) * | 1982-03-31 | 1984-05-01 | Amp Incorporated | Method and apparatus for producing a premolded packaging |
| US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
| US4664309A (en) * | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
| US4736520A (en) * | 1983-11-04 | 1988-04-12 | Control Data Corporation | Process for assembling integrated circuit packages |
| US4560826A (en) * | 1983-12-29 | 1985-12-24 | Amp Incorporated | Hermetically sealed chip carrier |
| US4677526A (en) * | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
| US4663650A (en) * | 1984-05-02 | 1987-05-05 | Gte Products Corporation | Packaged integrated circuit chip |
| US4895536A (en) * | 1984-05-11 | 1990-01-23 | Amp Incorporated | Lead frame assembly having severable electrical circuit sections |
| DE3578830D1 (de) * | 1984-06-14 | 1990-08-30 | Advanced Micro Devices Inc | Mehrschicht-waermesenkpackung fuer integrierte schaltung. |
| US4654693A (en) * | 1984-08-28 | 1987-03-31 | Matsushita Electric Industrial Co., Ltd. | Electronic parts carrier with a chip-supporting top tape |
| JPS628639U (es) * | 1985-06-28 | 1987-01-19 | ||
| JPH034045Y2 (es) * | 1985-07-05 | 1991-02-01 | ||
| JPS6212959U (es) * | 1985-07-06 | 1987-01-26 | ||
| EP0218796B1 (en) * | 1985-08-16 | 1990-10-31 | Dai-Ichi Seiko Co. Ltd. | Semiconductor device comprising a plug-in-type package |
| US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
| US4657172A (en) * | 1985-10-31 | 1987-04-14 | American Microsystems, Inc. | Apparatus and method of solder coating integrated circuit leads |
| JPS62122159A (ja) * | 1985-11-21 | 1987-06-03 | Yamada Seisakusho:Kk | 外部リ−ドの成形方法 |
| US4706811A (en) * | 1986-03-03 | 1987-11-17 | General Motors Corporation | Surface mount package for encapsulated tape automated bonding integrated circuit modules |
| US4712721A (en) * | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
| JPH0766952B2 (ja) * | 1986-05-14 | 1995-07-19 | 三菱電機株式会社 | 混成集積回路装置 |
| US5168432A (en) * | 1987-11-17 | 1992-12-01 | Advanced Interconnections Corporation | Adapter for connection of an integrated circuit package to a circuit board |
| US5438481A (en) * | 1987-11-17 | 1995-08-01 | Advanced Interconnections Corporation | Molded-in lead frames |
| US5152057A (en) * | 1987-11-17 | 1992-10-06 | Mold-Pac Corporation | Molded integrated circuit package |
| US5184285A (en) * | 1987-11-17 | 1993-02-02 | Advanced Interconnections Corporation | Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor |
| US4906802A (en) * | 1988-02-18 | 1990-03-06 | Neal Castleman | Molded chip carrier |
| US4829669A (en) * | 1988-04-28 | 1989-05-16 | Nec Corporation | Method of manufacturing a chip carrier |
| US4967260A (en) * | 1988-05-04 | 1990-10-30 | International Electronic Research Corp. | Hermetic microminiature packages |
| US5299730A (en) * | 1989-08-28 | 1994-04-05 | Lsi Logic Corporation | Method and apparatus for isolation of flux materials in flip-chip manufacturing |
| US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
| US5168345A (en) * | 1990-08-15 | 1992-12-01 | Lsi Logic Corporation | Semiconductor device having a universal die size inner lead layout |
| US5213748A (en) * | 1991-06-27 | 1993-05-25 | At&T Bell Laboratories | Method of molding a thermoplastic ring onto a leadframe |
| US5434750A (en) * | 1992-02-07 | 1995-07-18 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package for certain non-square die shapes |
| US5177669A (en) * | 1992-03-02 | 1993-01-05 | Motorola, Inc. | Molded ring integrated circuit package |
| US5438477A (en) * | 1993-08-12 | 1995-08-01 | Lsi Logic Corporation | Die-attach technique for flip-chip style mounting of semiconductor dies |
| JPH07176677A (ja) * | 1993-08-31 | 1995-07-14 | Texas Instr Inc <Ti> | 低コストリードフレームの設計及び製造方法 |
| US5388327A (en) * | 1993-09-15 | 1995-02-14 | Lsi Logic Corporation | Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package |
| US5820014A (en) * | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
| US5827999A (en) * | 1994-05-26 | 1998-10-27 | Amkor Electronics, Inc. | Homogeneous chip carrier package |
| US5650593A (en) * | 1994-05-26 | 1997-07-22 | Amkor Electronics, Inc. | Thermally enhanced chip carrier package |
| US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
| US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
| JP3870301B2 (ja) * | 1996-06-11 | 2007-01-17 | ヤマハ株式会社 | 半導体装置の組立法、半導体装置及び半導体装置の連続組立システム |
| US5938038A (en) | 1996-08-02 | 1999-08-17 | Dial Tool Industries, Inc. | Parts carrier strip and apparatus for assembling parts in such a strip |
| US5892178A (en) * | 1997-03-20 | 1999-04-06 | Qualcomm Incorporated | Support fixture for control panel assembly |
| US6016918A (en) * | 1998-08-18 | 2000-01-25 | Dial Tool Industries, Inc. | Part carrier strip |
| JP3819728B2 (ja) * | 2001-04-13 | 2006-09-13 | 三洋電機株式会社 | リードフレームを具えた電子部品 |
| US7090362B2 (en) * | 2001-11-09 | 2006-08-15 | Carl Zeiss Smt Ag | Facet mirror having a number of mirror facets |
| DE50214375D1 (de) | 2002-02-09 | 2010-05-27 | Zeiss Carl Smt Ag | Facettenspiegel mit mehreren spiegelfacetten |
| JP3867639B2 (ja) * | 2002-07-31 | 2007-01-10 | 株式会社デンソー | 混成集積回路装置 |
| TW560755U (en) * | 2002-11-27 | 2003-11-01 | Hon Hai Prec Ind Co Ltd | Hard tray for electrical connectors |
| US6907659B2 (en) * | 2003-02-05 | 2005-06-21 | Advanced Connection Technology Inc. | Method for manufacturing and packaging integrated circuit |
| JP3938067B2 (ja) * | 2003-02-18 | 2007-06-27 | 株式会社日立製作所 | 電子回路装置 |
| KR100642748B1 (ko) | 2004-07-24 | 2006-11-10 | 삼성전자주식회사 | 리드 프레임과 패키지 기판 및 이들을 이용한 패키지 |
| DE102005035083B4 (de) * | 2004-07-24 | 2007-08-23 | Samsung Electronics Co., Ltd., Suwon | Bondverbindungssystem, Halbleiterbauelementpackung und Drahtbondverfahren |
| US20080054490A1 (en) * | 2006-08-31 | 2008-03-06 | Ati Technologies Inc. | Flip-Chip Ball Grid Array Strip and Package |
| US7993092B2 (en) * | 2007-08-14 | 2011-08-09 | Samsung Electronics Co., Ltd. | Moving carrier for lead frame and method of moving lead frame using the moving carrier |
| US8946875B2 (en) | 2012-01-20 | 2015-02-03 | Intersil Americas LLC | Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems |
| US8796052B2 (en) | 2012-02-24 | 2014-08-05 | Intersil Americas LLC | Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the same |
| US9754861B2 (en) | 2014-10-10 | 2017-09-05 | Stmicroelectronics Pte Ltd | Patterned lead frame |
| TWM532101U (zh) * | 2016-02-24 | 2016-11-11 | 英屬開曼群島商鴻騰精密科技股份有限公司 | 一種電連接器組合及其支撐件 |
| US10109563B2 (en) | 2017-01-05 | 2018-10-23 | Stmicroelectronics, Inc. | Modified leadframe design with adhesive overflow recesses |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3676748A (en) * | 1970-04-01 | 1972-07-11 | Fuji Electrochemical Co Ltd | Frame structures for electronic circuits |
| US3716761A (en) * | 1972-05-03 | 1973-02-13 | Microsystems Int Ltd | Universal interconnection structure for microelectronic devices |
| US4012766A (en) * | 1973-08-28 | 1977-03-15 | Western Digital Corporation | Semiconductor package and method of manufacture thereof |
| US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
| US4105861A (en) * | 1975-09-29 | 1978-08-08 | Semi-Alloys, Inc. | Hermetically sealed container for semiconductor and other electronic devices |
| US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
| US4142287A (en) * | 1976-12-27 | 1979-03-06 | Amp Incorporated | Electrical devices such as watches and method of construction thereof |
-
1979
- 1979-02-23 US US06/014,397 patent/US4195193A/en not_active Expired - Lifetime
-
1980
- 1980-01-23 NZ NZ192695A patent/NZ192695A/xx unknown
- 1980-01-28 CA CA344,452A patent/CA1127319A/en not_active Expired
- 1980-01-30 BR BR8000587A patent/BR8000587A/pt not_active IP Right Cessation
- 1980-01-30 NO NO800226A patent/NO154363C/no unknown
- 1980-01-30 AU AU55047/80A patent/AU528043B2/en not_active Ceased
- 1980-02-08 FI FI800397A patent/FI70348C/fi not_active IP Right Cessation
- 1980-02-12 EP EP80300398A patent/EP0015111B1/en not_active Expired
- 1980-02-12 DE DE8080300398T patent/DE3061294D1/de not_active Expired
- 1980-02-12 AT AT80300398T patent/ATE2034T1/de not_active IP Right Cessation
- 1980-02-20 MX MX181239A patent/MX147540A/es unknown
- 1980-02-20 ES ES488758A patent/ES8103478A1/es not_active Expired
- 1980-02-21 JP JP2106280A patent/JPS55117263A/ja active Granted
- 1980-02-22 AR AR280068A patent/AR220032A1/es active
- 1980-02-22 IL IL59455A patent/IL59455A/xx not_active IP Right Cessation
- 1980-02-22 DK DK076580A patent/DK155260C/da not_active IP Right Cessation
-
1984
- 1984-06-19 SG SG44684A patent/SG44684G/en unknown
-
1985
- 1985-01-17 HK HK46/85A patent/HK4685A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| ES488758A0 (es) | 1981-02-16 |
| AU5504780A (en) | 1980-08-28 |
| MX147540A (es) | 1982-12-13 |
| JPH026225B2 (es) | 1990-02-08 |
| ES8103478A1 (es) | 1981-02-16 |
| FI800397A (fi) | 1980-08-24 |
| FI70348B (fi) | 1986-02-28 |
| DK76580A (da) | 1980-08-24 |
| HK4685A (en) | 1985-01-25 |
| AU528043B2 (en) | 1983-04-14 |
| FI70348C (fi) | 1986-09-15 |
| SG44684G (en) | 1985-03-08 |
| JPS55117263A (en) | 1980-09-09 |
| US4195193A (en) | 1980-03-25 |
| DK155260C (da) | 1989-07-24 |
| CA1127319A (en) | 1982-07-06 |
| IL59455A (en) | 1982-07-30 |
| DE3061294D1 (en) | 1983-01-20 |
| ATE2034T1 (de) | 1982-12-15 |
| AR220032A1 (es) | 1980-09-30 |
| BR8000587A (pt) | 1980-10-21 |
| NZ192695A (en) | 1982-08-17 |
| NO154363B (no) | 1986-05-26 |
| DK155260B (da) | 1989-03-13 |
| EP0015111A1 (en) | 1980-09-03 |
| EP0015111B1 (en) | 1982-12-15 |
| NO800226L (no) | 1980-08-25 |
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