NO132103B - - Google Patents
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- Publication number
- NO132103B NO132103B NO1116/72A NO111672A NO132103B NO 132103 B NO132103 B NO 132103B NO 1116/72 A NO1116/72 A NO 1116/72A NO 111672 A NO111672 A NO 111672A NO 132103 B NO132103 B NO 132103B
- Authority
- NO
- Norway
- Prior art keywords
- solution
- bis
- palladium
- denotes
- water
- Prior art date
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 20
- ICSNLGPSRYBMBD-UHFFFAOYSA-N alpha-aminopyridine Natural products NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 230000004913 activation Effects 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 14
- 238000001465 metallisation Methods 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 239000010970 precious metal Substances 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 6
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 6
- 108010073771 Soybean Proteins Proteins 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000010948 rhodium Substances 0.000 claims description 5
- 229940001941 soy protein Drugs 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- 229910052762 osmium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 229920002873 Polyethylenimine Polymers 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- 150000007522 mineralic acids Chemical class 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005728 strengthening Methods 0.000 claims description 3
- 150000003512 tertiary amines Chemical class 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 150000007524 organic acids Chemical group 0.000 claims description 2
- 125000000467 secondary amino group Chemical class [H]N([*:1])[*:2] 0.000 claims 1
- 239000000243 solution Substances 0.000 description 42
- -1 hydroquinone radicals Chemical class 0.000 description 21
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 21
- 238000001994 activation Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N EtOH Substances CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- 229910000510 noble metal Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 4
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 235000011150 stannous chloride Nutrition 0.000 description 4
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910002651 NO3 Inorganic materials 0.000 description 3
- 229910002666 PdCl2 Inorganic materials 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000001273 butane Substances 0.000 description 3
- 239000012876 carrier material Substances 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical group OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- BTIHBLICQHCWRJ-UHFFFAOYSA-N 1-(triazol-1-ylmethyl)triazole Chemical compound C1=CN=NN1CN1C=CN=N1 BTIHBLICQHCWRJ-UHFFFAOYSA-N 0.000 description 2
- PAPNRQCYSFBWDI-UHFFFAOYSA-N 2,5-Dimethyl-1H-pyrrole Chemical compound CC1=CC=C(C)N1 PAPNRQCYSFBWDI-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- CUYKNJBYIJFRCU-UHFFFAOYSA-N 3-aminopyridine Chemical compound NC1=CC=CN=C1 CUYKNJBYIJFRCU-UHFFFAOYSA-N 0.000 description 2
- GRFNBEZIAWKNCO-UHFFFAOYSA-N 3-pyridinol Chemical compound OC1=CC=CN=C1 GRFNBEZIAWKNCO-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Substances CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- FINHMKGKINIASC-UHFFFAOYSA-N Tetramethylpyrazine Chemical compound CC1=NC(C)=C(C)N=C1C FINHMKGKINIASC-UHFFFAOYSA-N 0.000 description 2
- ISAKRJDGNUQOIC-UHFFFAOYSA-N Uracil Chemical compound O=C1C=CNC(=O)N1 ISAKRJDGNUQOIC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010668 complexation reaction Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- OPTASPLRGRRNAP-UHFFFAOYSA-N cytosine Chemical compound NC=1C=CNC(=O)N=1 OPTASPLRGRRNAP-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- LFGREXWGYUGZLY-UHFFFAOYSA-N phosphoryl Chemical class [P]=O LFGREXWGYUGZLY-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- UBQKCCHYAOITMY-UHFFFAOYSA-N pyridin-2-ol Chemical compound OC1=CC=CC=N1 UBQKCCHYAOITMY-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- CDQDMLWGTVLQEE-UHFFFAOYSA-N (1-methylimidazol-2-yl)methanol Chemical compound CN1C=CN=C1CO CDQDMLWGTVLQEE-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- NODLZCJDRXTSJO-UHFFFAOYSA-N 1,3-dimethylpyrazole Chemical compound CC=1C=CN(C)N=1 NODLZCJDRXTSJO-UHFFFAOYSA-N 0.000 description 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N 1,4-Benzenediol Natural products OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- ARQKBDLERURBNR-UHFFFAOYSA-N 1,5-dimethyl-2h-pyrimidine Chemical compound CN1CN=CC(C)=C1 ARQKBDLERURBNR-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- UWGVZSFDNPZXKG-UHFFFAOYSA-N 1-(1h-pyrazol-5-yl)ethanamine;hydrochloride Chemical compound Cl.CC(N)C1=CC=NN1 UWGVZSFDNPZXKG-UHFFFAOYSA-N 0.000 description 1
- LIUKMUPKYIVFPL-UHFFFAOYSA-N 1-(1h-pyrazol-5-yl)propan-1-amine;hydrochloride Chemical compound Cl.CCC(N)C1=CC=NN1 LIUKMUPKYIVFPL-UHFFFAOYSA-N 0.000 description 1
- OXHNLMTVIGZXSG-UHFFFAOYSA-N 1-Methylpyrrole Chemical compound CN1C=CC=C1 OXHNLMTVIGZXSG-UHFFFAOYSA-N 0.000 description 1
- SNCMIKDGQVEBRU-UHFFFAOYSA-N 1-[(4-sulfotriazol-1-yl)methyl]triazole-4-sulfonic acid Chemical compound N1=NC(S(=O)(=O)O)=CN1CN1N=NC(S(O)(=O)=O)=C1 SNCMIKDGQVEBRU-UHFFFAOYSA-N 0.000 description 1
- KKKDZZRICRFGSD-UHFFFAOYSA-N 1-benzylimidazole Chemical compound C1=CN=CN1CC1=CC=CC=C1 KKKDZZRICRFGSD-UHFFFAOYSA-N 0.000 description 1
- VPUAYOJTHRDUTK-UHFFFAOYSA-N 1-ethylpyrrole Chemical compound CCN1C=CC=C1 VPUAYOJTHRDUTK-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- WITMXBRCQWOZPX-UHFFFAOYSA-N 1-phenylpyrazole Chemical compound C1=CC=NN1C1=CC=CC=C1 WITMXBRCQWOZPX-UHFFFAOYSA-N 0.000 description 1
- IYVYLVCVXXCYRI-UHFFFAOYSA-N 1-propylimidazole Chemical compound CCCN1C=CN=C1 IYVYLVCVXXCYRI-UHFFFAOYSA-N 0.000 description 1
- ATVKWBAMWLLBPS-UHFFFAOYSA-N 1h-benzimidazole-4,6-disulfonic acid Chemical compound OS(=O)(=O)C1=CC(S(O)(=O)=O)=C2N=CNC2=C1 ATVKWBAMWLLBPS-UHFFFAOYSA-N 0.000 description 1
- LYLDIIUFTYRPPK-UHFFFAOYSA-N 1h-imidazole-2-sulfonic acid Chemical compound OS(=O)(=O)C1=NC=CN1 LYLDIIUFTYRPPK-UHFFFAOYSA-N 0.000 description 1
- ZOKUJQYNWMSFJF-UHFFFAOYSA-N 1h-indazole-7-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC2=C1NN=C2 ZOKUJQYNWMSFJF-UHFFFAOYSA-N 0.000 description 1
- HUTNOYOBQPAKIA-UHFFFAOYSA-N 1h-pyrazin-2-one Chemical compound OC1=CN=CC=N1 HUTNOYOBQPAKIA-UHFFFAOYSA-N 0.000 description 1
- JXPVQFCUIAKFLT-UHFFFAOYSA-N 2,5-dimethyl-1h-pyrazol-3-one Chemical compound CC1=CC(=O)N(C)N1 JXPVQFCUIAKFLT-UHFFFAOYSA-N 0.000 description 1
- PGCQAWCRIHOPCA-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1C1=NC=CN1 PGCQAWCRIHOPCA-UHFFFAOYSA-N 0.000 description 1
- XZDSKXFVPQUCOL-UHFFFAOYSA-N 2-(1h-pyrazol-5-yl)propanoic acid Chemical compound OC(=O)C(C)C1=CC=NN1 XZDSKXFVPQUCOL-UHFFFAOYSA-N 0.000 description 1
- FWPADFOYNIFFRV-UHFFFAOYSA-N 2-(2h-indazol-3-yl)propanoic acid Chemical compound C1=CC=CC2=C(C(C(O)=O)C)NN=C21 FWPADFOYNIFFRV-UHFFFAOYSA-N 0.000 description 1
- HQSLVXWQGWJGRV-UHFFFAOYSA-N 2-(4,5-dimethylpyrimidin-2-yl)acetic acid Chemical compound CC1=CN=C(CC(O)=O)N=C1C HQSLVXWQGWJGRV-UHFFFAOYSA-N 0.000 description 1
- GHCFWKFREBNSPC-UHFFFAOYSA-N 2-Amino-4-methylpyrimidine Chemical compound CC1=CC=NC(N)=N1 GHCFWKFREBNSPC-UHFFFAOYSA-N 0.000 description 1
- TVCXVUHHCUYLGX-UHFFFAOYSA-N 2-Methylpyrrole Chemical compound CC1=CC=CN1 TVCXVUHHCUYLGX-UHFFFAOYSA-N 0.000 description 1
- REOGQFPRJXNRMW-UHFFFAOYSA-N 2-[2-[bis(2-hydroxypropan-2-yl)amino]ethyl-(2-hydroxypropan-2-yl)amino]propan-2-ol Chemical compound CC(C)(O)N(C(C)(C)O)CCN(C(C)(C)O)C(C)(C)O REOGQFPRJXNRMW-UHFFFAOYSA-N 0.000 description 1
- ZIMXAFGAUMQPMG-UHFFFAOYSA-N 2-[4-[bis(carboxymethyl)amino]butyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCCN(CC(O)=O)CC(O)=O ZIMXAFGAUMQPMG-UHFFFAOYSA-N 0.000 description 1
- YGDVXSDNEFDTGV-UHFFFAOYSA-N 2-[6-[bis(carboxymethyl)amino]hexyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCCCCN(CC(O)=O)CC(O)=O YGDVXSDNEFDTGV-UHFFFAOYSA-N 0.000 description 1
- GWTCYDOFEZQSAB-UHFFFAOYSA-N 2-[8-[bis(carboxymethyl)amino]octyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCCCCCCN(CC(O)=O)CC(O)=O GWTCYDOFEZQSAB-UHFFFAOYSA-N 0.000 description 1
- XRPDDDRNQJNHLQ-UHFFFAOYSA-N 2-ethyl-1h-pyrrole Chemical compound CCC1=CC=CN1 XRPDDDRNQJNHLQ-UHFFFAOYSA-N 0.000 description 1
- RILVNLMOTMFTMQ-UHFFFAOYSA-N 2-ethylpyrimidine Chemical compound CCC1=NC=CC=N1 RILVNLMOTMFTMQ-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LNJMHEJAYSYZKK-UHFFFAOYSA-N 2-methylpyrimidine Chemical compound CC1=NC=CC=N1 LNJMHEJAYSYZKK-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- OXPDQFOKSZYEMJ-UHFFFAOYSA-N 2-phenylpyrimidine Chemical compound C1=CC=CC=C1C1=NC=CC=N1 OXPDQFOKSZYEMJ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- LOSKNFQZTWYZHI-UHFFFAOYSA-N 2-pyrazol-1-ylacetic acid Chemical compound OC(=O)CN1C=CC=N1 LOSKNFQZTWYZHI-UHFFFAOYSA-N 0.000 description 1
- XPQIPUZPSLAZDV-UHFFFAOYSA-N 2-pyridylethylamine Chemical compound NCCC1=CC=CC=N1 XPQIPUZPSLAZDV-UHFFFAOYSA-N 0.000 description 1
- HKOAFLAGUQUJQG-UHFFFAOYSA-N 2-pyrimidin-2-ylpyrimidine Chemical group N1=CC=CN=C1C1=NC=CC=N1 HKOAFLAGUQUJQG-UHFFFAOYSA-N 0.000 description 1
- HEEUMCHKVXTQIP-UHFFFAOYSA-N 2-pyrimidin-5-ylacetic acid Chemical compound OC(=O)CC1=CN=CN=C1 HEEUMCHKVXTQIP-UHFFFAOYSA-N 0.000 description 1
- FIAXGHZQPBGXPY-UHFFFAOYSA-N 2h-benzotriazole-4,6-disulfonic acid Chemical compound C1=C(S(=O)(=O)O)C=C(S(O)(=O)=O)C2=NNN=C21 FIAXGHZQPBGXPY-UHFFFAOYSA-N 0.000 description 1
- VFWJHCOPTQCMPO-UHFFFAOYSA-N 2h-benzotriazole-5-sulfonic acid Chemical compound C1=C(S(=O)(=O)O)C=CC2=NNN=C21 VFWJHCOPTQCMPO-UHFFFAOYSA-N 0.000 description 1
- YNRGDPQTVDWXPB-UHFFFAOYSA-N 3-(1,2,4-triazol-3-ylidene)-1,2,4-triazole Chemical group N1=NC=NC1=C1N=NC=N1 YNRGDPQTVDWXPB-UHFFFAOYSA-N 0.000 description 1
- ITBJOUKQOGUEMR-UHFFFAOYSA-N 3-propylimidazole-4-sulfonic acid Chemical compound CCCN1C=NC=C1S(O)(=O)=O ITBJOUKQOGUEMR-UHFFFAOYSA-N 0.000 description 1
- RZJWSGHNRLPGHP-UHFFFAOYSA-N 3-pyrrol-1-ylpropanoic acid Chemical compound OC(=O)CCN1C=CC=C1 RZJWSGHNRLPGHP-UHFFFAOYSA-N 0.000 description 1
- VXLKZBRLFFGAQT-UHFFFAOYSA-N 3h-benzimidazole-5-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=C2N=CNC2=C1 VXLKZBRLFFGAQT-UHFFFAOYSA-N 0.000 description 1
- JEXFHPIOWFXDCH-UHFFFAOYSA-N 4-ethylpyrimidin-2-amine Chemical compound CCC1=CC=NC(N)=N1 JEXFHPIOWFXDCH-UHFFFAOYSA-N 0.000 description 1
- KAHHAPNRIQLSFT-UHFFFAOYSA-N 5-methoxypyrimidin-2-amine Chemical compound COC1=CN=C(N)N=C1 KAHHAPNRIQLSFT-UHFFFAOYSA-N 0.000 description 1
- XKVUYEYANWFIJX-UHFFFAOYSA-N 5-methyl-1h-pyrazole Chemical compound CC1=CC=NN1 XKVUYEYANWFIJX-UHFFFAOYSA-N 0.000 description 1
- LRSASMSXMSNRBT-UHFFFAOYSA-N 5-methylcytosine Chemical compound CC1=CNC(=O)N=C1N LRSASMSXMSNRBT-UHFFFAOYSA-N 0.000 description 1
- XVMSFILGAMDHEY-UHFFFAOYSA-N 6-(4-aminophenyl)sulfonylpyridin-3-amine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=N1 XVMSFILGAMDHEY-UHFFFAOYSA-N 0.000 description 1
- 102000009027 Albumins Human genes 0.000 description 1
- 108010088751 Albumins Proteins 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- KZQYIMCESJLPQH-UHFFFAOYSA-N Demethylated antipyrine Chemical compound N1C(C)=CC(=O)N1C1=CC=CC=C1 KZQYIMCESJLPQH-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- UQFQONCQIQEYPJ-UHFFFAOYSA-N N-methylpyrazole Chemical compound CN1C=CC=N1 UQFQONCQIQEYPJ-UHFFFAOYSA-N 0.000 description 1
- OXVRRVVTDOIBSI-UHFFFAOYSA-N N1=C(C)C=C(O)N1C1=CC=C(Cl)C=C1 Chemical compound N1=C(C)C=C(O)N1C1=CC=C(Cl)C=C1 OXVRRVVTDOIBSI-UHFFFAOYSA-N 0.000 description 1
- DBFGHUSISCXRQA-UHFFFAOYSA-N NC1=CC=C(C=C1)N1N=C(C=C1O)C Chemical compound NC1=CC=C(C=C1)N1N=C(C=C1O)C DBFGHUSISCXRQA-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical group OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- HNYOPLTXPVRDBG-UHFFFAOYSA-N barbituric acid Chemical compound O=C1CC(=O)NC(=O)N1 HNYOPLTXPVRDBG-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 229940104302 cytosine Drugs 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 description 1
- PBTPREHATAFBEN-UHFFFAOYSA-N dipyrromethane Chemical compound C=1C=CNC=1CC1=CC=CN1 PBTPREHATAFBEN-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002538 fungal effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- KFIGICHILYTCJF-UHFFFAOYSA-N n'-methylethane-1,2-diamine Chemical compound CNCCN KFIGICHILYTCJF-UHFFFAOYSA-N 0.000 description 1
- KVKFRMCSXWQSNT-UHFFFAOYSA-N n,n'-dimethylethane-1,2-diamine Chemical compound CNCCNC KVKFRMCSXWQSNT-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- HMMPCBAWTWYFLR-UHFFFAOYSA-N n-pyridin-2-ylpyridin-2-amine Chemical compound C=1C=CC=NC=1NC1=CC=CC=N1 HMMPCBAWTWYFLR-UHFFFAOYSA-N 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920002006 poly(N-vinylimidazole) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002717 polyvinylpyridine Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- XFTQRUTUGRCSGO-UHFFFAOYSA-N pyrazin-2-amine Chemical compound NC1=CN=CC=N1 XFTQRUTUGRCSGO-UHFFFAOYSA-N 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical compound C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- ZZYXNRREDYWPLN-UHFFFAOYSA-N pyridine-2,3-diamine Chemical compound NC1=CC=CN=C1N ZZYXNRREDYWPLN-UHFFFAOYSA-N 0.000 description 1
- VHNQIURBCCNWDN-UHFFFAOYSA-N pyridine-2,6-diamine Chemical compound NC1=CC=CC(N)=N1 VHNQIURBCCNWDN-UHFFFAOYSA-N 0.000 description 1
- DVECLMOWYVDJRM-UHFFFAOYSA-N pyridine-3-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CN=C1 DVECLMOWYVDJRM-UHFFFAOYSA-N 0.000 description 1
- LJXQPZWIHJMPQQ-UHFFFAOYSA-N pyrimidin-2-amine Chemical compound NC1=NC=CC=N1 LJXQPZWIHJMPQQ-UHFFFAOYSA-N 0.000 description 1
- VTGOHKSTWXHQJK-UHFFFAOYSA-N pyrimidin-2-ol Chemical compound OC1=NC=CC=N1 VTGOHKSTWXHQJK-UHFFFAOYSA-N 0.000 description 1
- ZFCHNZDUMIOWFV-UHFFFAOYSA-N pyrimidine-2-carboxylic acid Chemical compound OC(=O)C1=NC=CC=N1 ZFCHNZDUMIOWFV-UHFFFAOYSA-N 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 description 1
- NVIFVTYDZMXWGX-UHFFFAOYSA-N sodium metaborate Chemical compound [Na+].[O-]B=O NVIFVTYDZMXWGX-UHFFFAOYSA-N 0.000 description 1
- 239000001433 sodium tartrate Substances 0.000 description 1
- 229960002167 sodium tartrate Drugs 0.000 description 1
- 235000011004 sodium tartrates Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- OBSZRRSYVTXPNB-UHFFFAOYSA-N tetraphosphorus Chemical compound P12P3P1P32 OBSZRRSYVTXPNB-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 229940035893 uracil Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Manufacture And Refinement Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2116389A DE2116389C3 (de) | 1971-03-30 | 1971-03-30 | Lösung zur Aktivierung von Oberflächen für die Metallisierung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NO132103B true NO132103B (de) | 1975-06-09 |
| NO132103C NO132103C (de) | 1975-09-17 |
Family
ID=5803804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO111672A NO132103C (de) | 1971-03-30 | 1972-04-04 |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US4248632A (de) |
| JP (1) | JPS5234573B1 (de) |
| AT (1) | AT314934B (de) |
| BE (1) | BE781483A (de) |
| CA (1) | CA975503A (de) |
| CH (1) | CH587878A5 (de) |
| DE (1) | DE2116389C3 (de) |
| DK (1) | DK144767C (de) |
| ES (1) | ES400886A1 (de) |
| FR (1) | FR2132172B1 (de) |
| GB (2) | GB1394164A (de) |
| IE (3) | IE36236B1 (de) |
| IT (1) | IT956226B (de) |
| NL (1) | NL175533C (de) |
| NO (1) | NO132103C (de) |
| SE (2) | SE396233B (de) |
| SU (1) | SU747437A3 (de) |
| ZA (1) | ZA722182B (de) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2116389C3 (de) * | 1971-03-30 | 1980-04-03 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Lösung zur Aktivierung von Oberflächen für die Metallisierung |
| IT1041350B (it) * | 1975-07-25 | 1980-01-10 | Alfachimici Spa | Soluzione attivante a base di argento per processi di ramatura anelettrica |
| JPS53163972U (de) * | 1977-05-31 | 1978-12-22 | ||
| US4244789A (en) * | 1979-01-24 | 1981-01-13 | Stauffer Chemical Company | Method of metallizing materials |
| JPS56164751U (de) * | 1980-05-12 | 1981-12-07 | ||
| DE3132218A1 (de) * | 1981-08-14 | 1983-03-03 | Basf Ag, 6700 Ludwigshafen | Verfahren zur abscheidung von metallen auf elektrisch leitfaehigen, polymeren traegern und verwendung der erhaltenen materialien in der elektrotechnik, zur antistatischen ausruestung von kunststoffen und als heterogene katalysatoren |
| JPS58189365A (ja) * | 1982-04-28 | 1983-11-05 | Okuno Seiyaku Kogyo Kk | 化学メッキ用アンダーコート組成物 |
| US4719145A (en) * | 1983-09-28 | 1988-01-12 | Rohm And Haas Company | Catalytic process and systems |
| DE3337856A1 (de) * | 1983-10-18 | 1985-04-25 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substraten fuer die stromlose metallisierung |
| DE3407114A1 (de) * | 1984-02-28 | 1985-09-05 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von leiterplatten |
| JPS60195077A (ja) * | 1984-03-16 | 1985-10-03 | 奥野製薬工業株式会社 | セラミツクスの無電解めつき用触媒組成物 |
| DE3417563C2 (de) * | 1984-05-11 | 1986-12-04 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Verfahren zur Herstellung von Metallmustern auf isolierenden Trägern, insbesondere gedruckte Schaltungen |
| DE3436971A1 (de) * | 1984-10-09 | 1986-06-12 | Bayer Ag, 5090 Leverkusen | Halbzeuge zur herstellung von leiterplatten |
| DE3510202A1 (de) * | 1985-03-21 | 1986-09-25 | Bayer Ag, 5090 Leverkusen | Elektrische leiterplatten |
| JPH0694592B2 (ja) * | 1986-04-22 | 1994-11-24 | 日産化学工業株式会社 | 無電解メッキ法 |
| US4701351A (en) * | 1986-06-16 | 1987-10-20 | International Business Machines Corporation | Seeding process for electroless metal deposition |
| US4748104A (en) * | 1986-11-10 | 1988-05-31 | Macdermid, Incorporated | Selective metallization process and additive method for manufactured printed circuit boards |
| GB8725148D0 (en) * | 1987-10-27 | 1987-12-02 | Omi International Gb Ltd | Catalyst |
| US4986848A (en) * | 1988-01-28 | 1991-01-22 | Hitachi Chemical Company, Ltd. | Catalyst for electroless plating |
| US5200272A (en) * | 1988-04-29 | 1993-04-06 | Miles Inc. | Process for metallizing substrate surfaces |
| EP0367885A1 (de) * | 1988-11-08 | 1990-05-16 | Schering Aktiengesellschaft | Konditionierungsmittel für gedruckte Schaltungen |
| IT1232841B (it) * | 1989-02-03 | 1992-03-05 | Kemifar Spa | Composizione attivante per la metallizzazione di substrati isolanti e procedimento di metalizzazione di tali substrati impiegante la stessa |
| DE3928435A1 (de) * | 1989-08-24 | 1991-02-28 | Schering Ag | Verfahren zur direkten metallisierung eines nicht leitenden substrats |
| US5503877A (en) * | 1989-11-17 | 1996-04-02 | Atotech Deutschalnd Gmbh | Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate |
| DE3938710A1 (de) * | 1989-11-17 | 1991-05-23 | Schering Ag | Komplexverbindungen mit oligomerem bis polymerem charakter |
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| CN101605928B (zh) * | 2006-11-06 | 2011-07-13 | 上村工业株式会社 | 直接镀覆方法和钯导电体层形成溶液 |
| US8388824B2 (en) * | 2008-11-26 | 2013-03-05 | Enthone Inc. | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
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| US8591637B2 (en) | 2010-12-14 | 2013-11-26 | Rohm And Haas Electronic Materials Llc | Plating catalyst and method |
| US8591636B2 (en) * | 2010-12-14 | 2013-11-26 | Rohm And Haas Electronics Materials Llc | Plating catalyst and method |
| EP2610366A3 (de) * | 2011-12-31 | 2014-07-30 | Rohm and Haas Electronic Materials LLC | Plattierkatalysator und Verfahren |
| US9364822B2 (en) | 2013-06-28 | 2016-06-14 | Rohm And Haas Electronic Materials Llc | Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds |
| US20150024123A1 (en) * | 2013-07-16 | 2015-01-22 | Rohm And Haas Electronic Materials Llc | Catalysts for electroless metallization containing iminodiacetic acid and derivatives |
| EP2845923B1 (de) | 2013-09-04 | 2018-11-28 | Rohm and Haas Electronic Materials LLC | Stromlose metallisierung von dielektrika mit stabilen alkalischen katalysatoren welche pyrazinderivative enthalten |
| US20170175272A9 (en) * | 2013-09-04 | 2017-06-22 | Rohm And Haas Electronic Materials Llc | Electroless metallization of dielectrics with alkaline stable pyrimidine derivative containing catalysts |
| US9918389B2 (en) | 2013-09-04 | 2018-03-13 | Rohm And Haas Electronic Materials Llc | Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts |
| EP2845922A1 (de) | 2013-09-04 | 2015-03-11 | Rohm and Haas Electronic Materials LLC | Stromlose Metallisierung von Dielektrika mit alkalischen stabilen Pyrimidinderivate- haltigen Katalysatoren |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3516848A (en) * | 1965-10-18 | 1970-06-23 | Sel Rex Corp | Process and solution for sensitizing substrates for electroless plating |
| US3523874A (en) * | 1967-03-16 | 1970-08-11 | Hooker Chemical Corp | Metal coating of aromatic polymers |
| US3650708A (en) * | 1970-03-30 | 1972-03-21 | Hooker Chemical Corp | Metal plating of substrates |
| DE2116389C3 (de) * | 1971-03-30 | 1980-04-03 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Lösung zur Aktivierung von Oberflächen für die Metallisierung |
-
1971
- 1971-03-30 DE DE2116389A patent/DE2116389C3/de not_active Expired
-
1972
- 1972-03-17 ES ES400886A patent/ES400886A1/es not_active Expired
- 1972-03-24 AT AT258372A patent/AT314934B/de not_active IP Right Cessation
- 1972-03-27 GB GB1416172A patent/GB1394164A/en not_active Expired
- 1972-03-27 GB GB4724374A patent/GB1394165A/en not_active Expired
- 1972-03-28 IT IT2245172A patent/IT956226B/it active
- 1972-03-28 IE IE2415/75A patent/IE36236B1/xx unknown
- 1972-03-28 IE IE752415A patent/IE36236L/xx unknown
- 1972-03-28 IE IE410/72A patent/IE36235B1/xx unknown
- 1972-03-29 SE SE412672A patent/SE396233B/xx unknown
- 1972-03-29 FR FR7211002A patent/FR2132172B1/fr not_active Expired
- 1972-03-30 CA CA138,656A patent/CA975503A/en not_active Expired
- 1972-03-30 CH CH480772A patent/CH587878A5/xx not_active IP Right Cessation
- 1972-03-30 BE BE781483A patent/BE781483A/xx not_active IP Right Cessation
- 1972-03-30 JP JP3212272A patent/JPS5234573B1/ja active Pending
- 1972-03-30 NL NL7204414A patent/NL175533C/xx not_active IP Right Cessation
- 1972-03-30 ZA ZA722182A patent/ZA722182B/xx unknown
- 1972-04-04 NO NO111672A patent/NO132103C/no unknown
- 1972-04-04 DK DK161272A patent/DK144767C/da not_active IP Right Cessation
-
1975
- 1975-02-24 SE SE7502045A patent/SE7502045L/xx unknown
-
1978
- 1978-01-05 SU SU782562407A patent/SU747437A3/ru active
-
1979
- 1979-02-13 US US06/011,847 patent/US4248632A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| IE36236B1 (en) | 1976-09-15 |
| NO132103C (de) | 1975-09-17 |
| ZA722182B (en) | 1972-12-27 |
| DE2116389C3 (de) | 1980-04-03 |
| FR2132172A1 (de) | 1972-11-17 |
| NL7204414A (de) | 1972-10-03 |
| DK144767B (da) | 1982-06-01 |
| ES400886A1 (es) | 1975-01-16 |
| IT956226B (it) | 1973-10-10 |
| SU747437A3 (ru) | 1980-07-23 |
| CH587878A5 (de) | 1977-05-13 |
| FR2132172B1 (de) | 1976-08-06 |
| GB1394165A (en) | 1975-05-14 |
| SE396233B (sv) | 1977-09-12 |
| US4248632A (en) | 1981-02-03 |
| AT314934B (de) | 1974-04-25 |
| NL175533C (nl) | 1984-11-16 |
| DE2116389B2 (de) | 1979-08-02 |
| IE36235B1 (en) | 1976-09-15 |
| DE2116389A1 (de) | 1972-10-26 |
| JPS5234573B1 (de) | 1977-09-03 |
| SE7502045L (de) | 1975-02-24 |
| IE36235L (en) | 1972-09-30 |
| CA975503A (en) | 1975-10-07 |
| BE781483A (fr) | 1972-10-02 |
| DK144767C (da) | 1982-10-25 |
| NL175533B (nl) | 1984-06-18 |
| GB1394164A (en) | 1975-05-14 |
| IE36236L (en) | 1972-09-30 |
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