NL9300389A - Substraatdrager. - Google Patents

Substraatdrager. Download PDF

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Publication number
NL9300389A
NL9300389A NL9300389A NL9300389A NL9300389A NL 9300389 A NL9300389 A NL 9300389A NL 9300389 A NL9300389 A NL 9300389A NL 9300389 A NL9300389 A NL 9300389A NL 9300389 A NL9300389 A NL 9300389A
Authority
NL
Netherlands
Prior art keywords
main surface
substrate support
substrate
substrate carrier
opposite
Prior art date
Application number
NL9300389A
Other languages
English (en)
Dutch (nl)
Original Assignee
Xycarb Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xycarb Bv filed Critical Xycarb Bv
Priority to NL9300389A priority Critical patent/NL9300389A/nl
Priority to DE69415838T priority patent/DE69415838T2/de
Priority to EP94200490A priority patent/EP0614212B1/fr
Priority to US08/205,685 priority patent/US5403401A/en
Priority to JP03393194A priority patent/JP3547470B2/ja
Publication of NL9300389A publication Critical patent/NL9300389A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
NL9300389A 1993-03-04 1993-03-04 Substraatdrager. NL9300389A (nl)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL9300389A NL9300389A (nl) 1993-03-04 1993-03-04 Substraatdrager.
DE69415838T DE69415838T2 (de) 1993-03-04 1994-02-24 Ein Substrathalter
EP94200490A EP0614212B1 (fr) 1993-03-04 1994-02-24 Un porte-substrats
US08/205,685 US5403401A (en) 1993-03-04 1994-03-02 Substrate carrier
JP03393194A JP3547470B2 (ja) 1993-03-04 1994-03-03 基板キャリア

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9300389A NL9300389A (nl) 1993-03-04 1993-03-04 Substraatdrager.
NL9300389 1993-03-04

Publications (1)

Publication Number Publication Date
NL9300389A true NL9300389A (nl) 1994-10-03

Family

ID=19862131

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9300389A NL9300389A (nl) 1993-03-04 1993-03-04 Substraatdrager.

Country Status (5)

Country Link
US (1) US5403401A (fr)
EP (1) EP0614212B1 (fr)
JP (1) JP3547470B2 (fr)
DE (1) DE69415838T2 (fr)
NL (1) NL9300389A (fr)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531835A (en) * 1994-05-18 1996-07-02 Applied Materials, Inc. Patterned susceptor to reduce electrostatic force in a CVD chamber
US6086680A (en) * 1995-08-22 2000-07-11 Asm America, Inc. Low-mass susceptor
WO1997009737A1 (fr) 1995-09-01 1997-03-13 Advanced Semiconductor Materials America, Inc. Dispositif de support pour tranches
US6113702A (en) * 1995-09-01 2000-09-05 Asm America, Inc. Wafer support system
US6001183A (en) * 1996-06-10 1999-12-14 Emcore Corporation Wafer carriers for epitaxial growth processes
US5814561A (en) * 1997-02-14 1998-09-29 Jackson; Paul D. Substrate carrier having a streamlined shape and method for thin film formation
WO1999023691A2 (fr) 1997-11-03 1999-05-14 Asm America, Inc. Systeme de support ameliore de faible poids pour plaquettes
USD422866S (en) * 1999-01-07 2000-04-18 Tooltek Engineering Corporation Substrate fixturing device
US6340090B1 (en) 1999-01-07 2002-01-22 Tooltek Engineering Corporation Substrate fixturing device
US6410172B1 (en) 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition
US6634882B2 (en) * 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
US7033445B2 (en) * 2001-12-27 2006-04-25 Asm America, Inc. Gridded susceptor
US7070660B2 (en) * 2002-05-03 2006-07-04 Asm America, Inc. Wafer holder with stiffening rib
US20050170314A1 (en) * 2002-11-27 2005-08-04 Richard Golden Dental pliers design with offsetting jaw and pad elements for assisting in removing upper and lower teeth and method for removing teeth utilizing the dental plier design
US6709267B1 (en) 2002-12-27 2004-03-23 Asm America, Inc. Substrate holder with deep annular groove to prevent edge heat loss
WO2004090967A1 (fr) * 2003-04-02 2004-10-21 Sumco Corporation Bati de traitement thermique de plaquette a semiconducteur
KR101116510B1 (ko) * 2003-08-01 2012-02-28 에스지엘 카본 에스이 반도체 제조시 웨이퍼를 지지하는 홀더
WO2006078666A2 (fr) 2005-01-18 2006-07-27 Asm America, Inc. Systeme de reaction destine a creer une couche mince
US20060194059A1 (en) * 2005-02-25 2006-08-31 Honeywell International Inc. Annular furnace spacers and method of using same
US8603248B2 (en) * 2006-02-10 2013-12-10 Veeco Instruments Inc. System and method for varying wafer surface temperature via wafer-carrier temperature offset
US8092606B2 (en) * 2007-12-18 2012-01-10 Asm Genitech Korea Ltd. Deposition apparatus
KR101294129B1 (ko) * 2008-08-29 2013-08-07 비코 인스트루먼츠 인코포레이티드 가변 열 저항을 가진 웨이퍼 캐리어
US8801857B2 (en) 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
TWI563589B (en) * 2009-11-27 2016-12-21 Jusung Eng Co Ltd Tray, substrate processing apparatus using the same, and manufacturing method of tray
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
KR20130137475A (ko) * 2012-06-07 2013-12-17 삼성전자주식회사 기판 처리방법 및 그에 사용되는 서포트 기판
US10167571B2 (en) 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
EP3100298B1 (fr) 2014-01-27 2020-07-15 Veeco Instruments Inc. Support de tranche doté de poches de rétention ayant des rayons composés pour des systèmes de dépôt chimique en phase vapeur
KR20170102020A (ko) * 2015-01-23 2017-09-06 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 내의 퇴적 계곡들을 제거하기 위한 신규한 서셉터 설계
CN106024681B (zh) * 2016-07-27 2018-12-28 苏州阿特斯阳光电力科技有限公司 叠层膜、包含其的石墨舟及其制备方法、及石墨舟清洗方法
US10872804B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
US10872803B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
EP3707559B1 (fr) * 2017-11-08 2023-04-19 ASML Netherlands B.V. Support de substrat et procédé de fabrication de dispositif
CN110819968B (zh) * 2018-08-08 2022-06-28 上海理想万里晖薄膜设备有限公司 一种用于pecvd反应腔的复合载板
US11961756B2 (en) 2019-01-17 2024-04-16 Asm Ip Holding B.V. Vented susceptor
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
USD914620S1 (en) 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
US11404302B2 (en) 2019-05-22 2022-08-02 Asm Ip Holding B.V. Substrate susceptor using edge purging
US11764101B2 (en) 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
EP3835281A1 (fr) 2019-12-13 2021-06-16 Siltronic AG Procédé de fabrication d'un corps en forme de plaque avec une matrice en carbure de silicium
CN113278952B (zh) * 2021-03-26 2022-12-06 华灿光电(苏州）有限公司 石墨基板
CN114874395A (zh) * 2022-04-19 2022-08-09 南京艾布纳密封技术股份有限公司 一种耐高温有机浸渗密封材料及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988007487A1 (fr) * 1987-03-31 1988-10-06 Epsilon Technology, Inc. Mecanisme rotatif de support d'un substrat pourvu d'un dispositif de mesure de temperature et destine aux equipements de deposition en phase vapeur
EP0418541A2 (fr) * 1989-09-19 1991-03-27 Watkins-Johnson Company Dispositif de chauffage plan à pluralité de zones et mode opératoire
EP0513834A1 (fr) * 1991-05-15 1992-11-19 Applied Materials, Inc. Procédé et appareil pour refroidir des disques semi-conducteurs

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4397901A (en) * 1979-07-31 1983-08-09 Warren James W Composite article and method of making same
US4499354A (en) * 1982-10-06 1985-02-12 General Instrument Corp. Susceptor for radiant absorption heater system
US4424096A (en) * 1982-12-23 1984-01-03 Western Electric Co., Inc. R-F Electrode type workholder and methods of supporting workpieces during R-F powered reactive treatment
US4486473A (en) * 1983-09-21 1984-12-04 Ga Technologies Inc. Method and apparatus for coating fragile articles in a fluidized bed of particles using chemical vapor deposition
JPS6169116A (ja) * 1984-09-13 1986-04-09 Toshiba Ceramics Co Ltd シリコンウエハ−の連続ｃｖｄコ−テイング用サセプター
US4780174A (en) * 1986-12-05 1988-10-25 Lan Shan Ming Dislocation-free epitaxial growth in radio-frequency heating reactor
US4907534A (en) * 1988-12-09 1990-03-13 Siemens Aktiengesellschaft Gas distributor for OMVPE Growth
JPH02174116A (ja) * 1988-12-26 1990-07-05 Toshiba Ceramics Co Ltd サセプタ
DE3915039A1 (de) * 1989-05-08 1990-11-15 Balzers Hochvakuum Hubtisch

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988007487A1 (fr) * 1987-03-31 1988-10-06 Epsilon Technology, Inc. Mecanisme rotatif de support d'un substrat pourvu d'un dispositif de mesure de temperature et destine aux equipements de deposition en phase vapeur
US4821674A (en) * 1987-03-31 1989-04-18 Deboer Wiebe B Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
EP0418541A2 (fr) * 1989-09-19 1991-03-27 Watkins-Johnson Company Dispositif de chauffage plan à pluralité de zones et mode opératoire
EP0513834A1 (fr) * 1991-05-15 1992-11-19 Applied Materials, Inc. Procédé et appareil pour refroidir des disques semi-conducteurs

Also Published As

Publication number Publication date
US5403401A (en) 1995-04-04
EP0614212B1 (fr) 1999-01-13
DE69415838D1 (de) 1999-02-25
JPH0790590A (ja) 1995-04-04
DE69415838T2 (de) 1999-05-20
JP3547470B2 (ja) 2004-07-28
EP0614212A1 (fr) 1994-09-07

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Legal Events

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A1B A search report has been drawn up
BV The patent application has lapsed